TSMC Vision,
Mission & Core Values
Table of Contents
TSMC’s Vision
Our vision is to be the most advanced and largest technology and foundry services provider to fabless companies and IDMs, and in
partnership with them, to forge a powerful competitive force in the semiconductor industry.
To realize our vision, we must have a trinity of strengths:
1
be a technology
leader, competitive
with the leading IDMs
2
be the
manufacturing
leader
3
be the most reputable,
service-oriented
and maximum-
total-benefits silicon
foundry
TSMC’s Mission
Our mission is to be the trusted technology and capacity provider of the global logic IC industry for years to come.
TSMC’s Core Values
Integrity
Integrity is our most basic and most important core value. We tell the truth. We believe the record of our accomplishments is the best
proof of our merit. Hence, we do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves
completely to meeting that commitment. We compete to our fullest within the law, but we do not slander our competitors and we respect
the intellectual property rights of others. With vendors, we maintain an objective, consistent, and impartial attitude. We do not tolerate any
form of corrupt behavior or politicking. When selecting new employees, we place emphasis on the candidates’ qualifications and character,
not connections or access.
Commitment
TSMC is committed to the welfare of customers, suppliers, employees, shareholders, and society. These stakeholders all contribute to
TSMC’s success, and TSMC is dedicated to serving their best interests. In return, TSMC hopes all these stakeholders will make a mutual
commitment to the Company.
Innovation
Innovation is the wellspring of TSMC’s growth, and is a part of all aspects of our business, from strategic planning, marketing and
management, to technology and manufacturing. At TSMC, innovation means more than new ideas, it means putting ideas into practice.
Customer Trust
At TSMC, customers come first. Their success is our success, and we value their ability to compete as we value our own. We strive to build
deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term.
5. Operational Highlights
5.1 Business Activities
5.2 Technology Leadership
5.3 Manufacturing Excellence
5.4 Customer Trust
5.5 Employees
5.6 Material Contracts
6. Financial Highlights and Analysis
6.1 Financial Highlights
6.2 Financial Status and Operating Results
6.3 Risk Management
7. Corporate Social Responsibility
7.1 Overview
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7.2 Environmental, Safety and Health (ESH) Management 111
7.3 TSMC Education and Culture Foundation
7.4 TSMC Volunteer Program
7.5 TSMC i-Charity
7.6 Social Responsibility Implementation Status as
Required by the Taiwan Financial Supervisory
Commission
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8. Subsidiary Information and Other Special Notes 126
8.1 Subsidiaries
8.2 Status of TSMC Common Shares and ADRs Acquired,
Disposed of, and Held by Subsidiaries
8.3 Special Notes
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1. Letter to Shareholders
2. Company Profile
2.1 An Introduction to TSMC
2.2 Market/Business Summary
2.3 Organization
2.4 Board Members
2.5 Management Team
3. Corporate Governance
3.1 Overview
3.2 Board of Directors
3.3 Major Decisions of Shareholders’ Meeting and
Board Meetings
3.4 Taiwan Corporate Governance Implementation as
Required by the Taiwan Financial Supervisory
Commission
3.5 Code of Ethics and Business Conduct
3.6 Regulatory Compliance
3.7
Internal Control System Execution Status
3.8 Status of Personnel Responsible for the Company’s
Financial and Business Operation
3.9
Information Regarding TSMC’s Independent Auditor
3.10 Material Information Management Procedure
4. Capital and Shares
4.1 Capital and Shares
4.2
Issuance of Corporate Bonds
4.3 Preferred Shares
4.4
Issuance of American Depositary Shares
4.5 Status of Employee Stock Option Plan
4.6 Status of Employee Restricted Stock
4.7 Status of New Share Issuance in Connection with
Mergers and Acquisitions
4.8 Financing Plans and Implementation
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1. Letter to Shareholders
Dear Shareholders,
2015 was a record-breaking year for TSMC, in which we
achieved record revenue and profits and made important
technology breakthroughs in the face of a challenging business
environment for the semiconductor industry worldwide.
In 2015, lingering issues of a weakening global economy,
stronger US Dollar and financial market volatility dampened
the overall demand for semiconductors and lengthened the
inventory adjustment cycle, but TSMC continued to reap
the benefits of the progress we made in technology and
manufacturing. TSMC’s leadership in technology, coupled with
our ability to provide the right capacity for customers at the
right time, was a major factor in our ability to outperform our
semiconductor industry peers in 2015.
In addition to doubling the 20-nanometer business from the
2014 level, TSMC also saw successful introduction and record
ramp-up speed for our industry-leading 16-nanometer FinFET
process. The 16-nanometer and the 20-nanometer nodes
together contributed 20 percent of our 2015 wafer revenue,
up from 9 percent in 2014. In addition, we continued making
good progress toward achieving the next major industry
milestone, 10-nanometer capability and the development of
7-nanometer technology. With improvements in yield learning
and device performance, we now anticipate to start customer
10-nanometer product tape-outs in the first quarter of 2016.
Despite rising technological complexity and higher capital
requirements, TSMC continues to follow the cadence and
the economy of process technology advancement, known as
“Moore’s Law”. Moore’s Law has already put high-powered
computing and globe-spanning communications into the
pockets of ordinary people around the world and made ICs
powerful and affordable that they can connect mundane
objects around us into intelligent networks. TSMC is dedicated
to continued investment in the R&D and advanced capacity
necessary to not only benefit from the march of Moore’s Law,
but also to keep driving it forward.
Highlights of TSMC’s accomplishments in 2015:
■Total wafer shipments increased 6.1 percent from 2014 to
reach 8,763 thousand 12-inch equivalent wafers.
■Advanced technologies (28-nanometer and beyond)
accounted for 48 percent of total wafer revenue, up from 42
percent in 2014.
■We deployed 228 process technologies, and manufactured
8,941 products for 470 customers.
■TSMC’s market share in the total semiconductor foundry
segment rose successively during the last six years and
reached 55 percent in 2015.
2015 Financial Performance
Consolidated revenue totaled NT$843.50 billion, an increase
of 10.6 percent over NT$762.81 billion in 2014. Net income
was NT$306.57 billion and diluted earnings per share were
NT$11.82. Both increased 16 percent from the 2014 level of
NT$263.90 billion net income and NT$10.18 diluted EPS.
In US dollars, TSMC generated net income of US$9.67 billion
on consolidated revenue of US$26.61 billion, compared with
net income of US$8.71 billion on consolidated revenue of
US$25.17 billion in 2014.
Gross profit margin was 48.7 percent compared with 49.5
percent in 2014, and operating profit margin was 37.9 percent
compared with 38.8 percent a year earlier. Net profit margin
was 36.3 percent, an increase of 1.7 percentage points from
the prior year’s 34.6 percent, aided by non-operating items,
including NT$22.1 billion gain from disposal of ASML shares.
TSMC increased its cash dividend payment to NT$4.5 per
share for 2014 profit distribution, up from NT$3 over the last
eight years, to reflect rising free cash flow generation. We are
confident in our ability to maintain a sustainable level of cash
dividend to our shareholders going forward and will consider
increasing the dividends if and when it is appropriate.
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Technological Developments
Five years into volume production of 28-nanometer technology, TSMC continued to make innovations and introduced 28HPC and
28HPC+ to its industry-leading 28-nanometer technology platform in 2015. These latest additions enable smaller die size circuit
designs with higher performance and lower power consumption. Because TSMCÕ s 28-nanometer solutions are highly competitive
in both technology and cost, we saw increasing number of customer product tape-outs in 2015 and believe we should be able to
maintain our substantial (above 70 percent) market share in this significant node in the next few years.
Our 20nm process paved the way for the successful introduction and production ramp-up of our 16FF+ technology in 2015, with
yield ramping ahead of plan. Customers have been active in engaging with TSMC and nearly 40 product tape-outs were scheduled
before the end of 2015. Drawing on our experience in 16FF+, we completed the development of a highly competitive and
cost-effective solution, 16FFC, which incorporates optical shrink and process simplification for further die cost scaling and is directly
transferrable from 16FF+. Volume ramp of 16FFC is expected to begin in 2016. Both 16FF+ and 16FFC are positioned to drive
future growth with high volume applications across mobile, networking, CPU, FPGA, consumer and GPUs.
In 2015, we completed technology qualification for 10-nanometer and it is on track to meet the goal of production start-up in
2016. TSMCÕ s 7-nanometer technology was in full development in 2015 and is on track for risk production in the first half of
2017. It shares more than 95 percent common tools with our 10-nanometer process and offers substantial density improvement
and power reduction given the same chip performance. Our 5-nanometer node is undergoing definition with intensive advanced
development efforts. Exploratory R&D work focusing on new transistors and technologies is on-going to establish a solid foundation
to feed into future technology platforms.
Our advanced 3D IC packaging InFO technology that integrates 16-nanometer SoC and DRAM package for advanced mobile
products was successfully qualified in 2015 and is expected to start volume production by mid-2016.
Meanwhile, we continued to expand TSMCÕ s Open Innovation Platform¨
in the semiconductor industry. In 2015, more than 10,000 items were contained in our libraries and silicon IP portfolio, an 18
percent increase from 2014. More than 7,500 technology files and over 200 process design kits were available to customers via
TSMC-Online which saw more than 100,000 customer downloads in 2015.
(OIP), which is the most comprehensive design ecosystem
Corporate Developments
In January 2015, TSMCÕ s board of directors approved the sale of TSMC Solid State Lighting to Epistar. Upon the closing of the sale,
TSMC completely exited the LED industry.
In August 2015, TSMC announced that TSMC Solar would cease manufacturing operations by end of that month, as we believed
that our solar business was no longer economically sustainable. All outstanding warranties to existing customers will be honored,
and all Taiwan employees were extended employment offers at TSMC.
In December 2015, TSMC submitted an application to the Investment Commission of TaiwanÕ s Ministry of Economic Affairs (MoEA)
to build a wholly-owned 12-inch wafer manufacturing facility and to start a design service center in Nanjing, China. The purpose
is to enhance our access to business opportunities in China market. Pending approval from the MoEA, the investment project will
commence in 2016 with production targeted in second half of 2018.
Honors and Awards
TSMC received recognitions for achievements in innovation, business information disclosure, sustainability, investor relations and
overall excellence in management from organizations including BarronÕs, FinanceAsia, Fortune Magazine, Institutional Investor, IR
Magazine, GlobalViews Magazine, CommonWealth Magazine, RobecoSAM and the Taiwan Stock Exchange. The IEEE Spectrum
Magazine gave TSMC the highest score in its 2015 Patent Power Scorecard in the semiconductor manufacturing sector. For the
third consecutive year, TSMC was named Semiconductor and
Semiconductor Equipment Industry Group Leader by the Dow
Jones Sustainability Indices, reflecting our commitment to
sustainability and corporate social responsibility.
Outlook
TSMC pioneered the dedicated foundry business model nearly 30
years ago by being committed to delivering technology leadership
and manufacturing excellence with an unmatched focus on
earning customersÕ trust. We forecast the recovery in the global
economy will lead to growth for the semiconductor industry in
2016. More importantly, TSMCÕ s firm dedication to our business
model will enable us to outgrow considerably the semiconductor
industry in both 2016 and beyond, just as we have consistently
done throughout our history.
Capacity Plan
12%
2014
12%
2015
10%
2016
Despite product cycle ebbs and flows, semiconductors have been
and will remain a basic and pervasive technology, defining how
we live. Innovators have not stopped finding ways to create new
applications and services that open up undiscovered opportunities.
The rise of connected or Ò smartÓ devices in smart cars, drones,
robots, virtual reality/augmented reality, artificial intelligence and
wearables is creating a need for significant increases in processor
speeds and capability. At TSMC, we are working with our
customers to drive these emerging innovations to market over the
coming years.
2014
2015
2016
Annual Growth Rate
Capacity: million 12-inch equivalent wafers
Sales Plan
58%
52%
8-9
9-10
10-11
42%
48%
40-50%
50-60%
> 28nm wafer revenue
≤ 28nm wafer revenue
2016 wafer shipment is expected to be 9-10 million 12-inch equivalent wafers.
Being Ò everyoneÕ s foundryÓ has been a key part of our
core strategy, and we will continue to commit resources to
technology development and capacity build for both the
Ò MooreÕ s LawÓ and the Ò More than MooreÓ technologies.
As we carry out our mission as the trusted technology and
capacity provider for the global logic IC industry, we are
well positioned to deliver strong returns to our shareholders
for years to come.
Morris Chang
Morris Chang
Chairman
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2. Company Profile
2.1 An Introduction to TSMC
Established in 1987 and headquartered in Hsinchu, Taiwan,
TSMC pioneered the foundry business model by focusing solely
on manufacturing customers’ designs. The Company does
not design, manufacture or market semiconductor products
under its own brand name, ensuring that it does not compete
directly with its customers. Today, TSMC is the world’s
largest pure-play in the semiconductor foundry business,
manufacturing 8,941 different products using 228 different
technologies for 470 different customers in 2015.
With such a large and diverse global customer base,
TSMC-manufactured semiconductors are used in a wide
variety of applications covering various segments of the
computer, communications, consumer, industrial and standard
semiconductor markets. Such strong diversification helps
smooth fluctuations in market demand, which leads to higher
levels of capacity utilization and profitability.
Annual capacity of the manufacturing facilities managed by
TSMC and its subsidiaries reached above 9 million 12-inch
equivalent wafers in 2015. These facilities include three 12-inch
wafer GIGAFAB® facilities, four 8-inch wafer fabs, and one
6-inch wafer fab in Taiwan, as well as two 8-inch wafer fabs
at wholly owned subsidiaries: WaferTech in the United States
and TSMC China Company Limited. In December 2015, TSMC
submitted an application to the Investment Commission
of Taiwan’s Ministry of Economic Affairs (MoEA) to build a
wholly-owned 12-inch wafer manufacturing facility and to start
a design service center in Nanjing, China. The purpose is to
enhance our access to business opportunities in China market.
Pending approval from the MoEA, the investment project will
commence in 2016 with production targeted in second half of
2018.
TSMC provides customer service through its account
management and engineering services offices in North
America, Europe, Japan, China, South Korea and India. The
Company employed more than 45,000 people worldwide at
the end of 2015.
TSMC’s subsidiaries TSMC Solid State Lighting Ltd. and
TSMC Solar Ltd. had been formed to engage in the research,
development, design, manufacturing and sale of solid state
lighting devices and related products and systems, and
solar-related technologies and products, respectively. In
January 2015, TSMC’s board of directors approved the sale of
TSMC Solid State Lighting to Epistar. Upon the closing of the
sale, TSMC completely exited the LED industry. In August 2015,
TSMC announced that TSMC Solar would cease manufacturing
operations by end of that month, as we believed that our
solar business was no longer economically sustainable. All
outstanding warranties to existing customers will be honored,
and all Taiwan employees were extended employment offers at
TSMC.
The Company is listed on the Taiwan Stock Exchange (TWSE)
under ticker number 2330, and its American Depositary Shares
(ADSs) trade on the New York Stock Exchange (NYSE) under
the symbol TSM.
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2.2 Market/Business Summary
2.2.1 TSMC Achievements
In 2015, TSMC maintained its leading position in the total
foundry segment of the global semiconductor industry, with
an estimated market share of 55%. TSMC achieved this result
despite intense competition from both established players and
relatively new entrants to the business.
Leadership in advanced process technologies is a key factor in
TSMC’s strong market position. In 2015, 48% of TSMC’s wafer
revenue came from manufacturing processes with geometries
of 28nm and below.
With TSMC’s focus on customer trust, the Company
strengthened its Open Innovation Platform® (OIP) initiative
in 2015 with additional services. During the 2015 Open
Innovation Platform® Ecosystem Forum, held in September
in Santa Clara, California, the Company revealed 10nm
FinFET Reference Flow (both full-chip and IP Design), which
highlighted the success of OIP-enabled design. The Forum was
well attended by both customers and ecosystem partners and
demonstrated the value of collaboration through OIP to foster
innovations.
TSMC offers the foundry segment’s widest technology portfolio
and continues to invest in advanced technologies and specialty
technologies, which is a key differentiator from our competitors
and provides customers more added value.
Technologies that the Company either developed or introduced
in 2015 include:
Logic Technology
● 7nm FinFET technology made good developmental progress.
Risk production of this technology is expected to start in the
first quarter of 2017. A very fast yield ramp-up is expected as
the Company leverages the advantage that more than 95%
of tools for 7nm FinFET are compatible with those for 10nm
FinFET. Currently, we are working with several customers
on multiple product tape-outs. Compared to 10nm FinFET,
7nm FinFET features approximately 15~20% speed
improvement or 35~40% power reduction. In addition, 7nm
FinFET provides customers optimized processes for mobile
applications and high-performance computing devices.
● 10nm FinFET technology began customer product tape-out
in the first quarter of 2016. Thanks to its aggressive
geometric shrinkage, this technology offers 2.1X gate density
improvement over 16nm, providing excellent density/cost
benefits. It can serve customers from all different market
segments, including mobile, server and graphic.
● 16nm FinFET Plus technology (16FF+) entered high-volume
production in 2015 with yield ramping ahead of plan.
Currently, a total of approximately 50 product tape-outs were
received. Most of them achieved first-time silicon success.
TSMC’s comprehensive 16FF+ design ecosystem supports
a wide variety of Electronic Design Automation (EDA) tools
and hundreds of process design kits with more than 100
Intellectual Property cores (IPs), all of which have been silicon
validated. In addition, 16nm FinFET Compact technology
(16FFC), a cost-effective version of TSMC’s 16nm technology,
started volume production in the first quarter of 2016. This
process is also seamlessly applicable to the 16nm ecosystem,
accelerating time-to-market for customers. 16FFC can
maximize die cost scaling by incorporating optical shrink and
process simplification at the same time.
● 20nm System-on-Chip technology (20SoC) entered volume
production with stable yield performance. It provides better
density and power value than 28nm thanks to its advanced
patterning technique for both performance-driven products
and mobile computing applications migration.
● 28nm High Performance Compact (28HPC) technology for
mobile computing led the way for mainstream smartphones,
DTVs, storage and SoC applications. 28HPC enables smaller
die size circuit designs, less over-design and extraordinary
power reduction with excellent process control and optimized
design rules.
● 28nm High Performance Compact Plus (28HPC+) technology
for mobile computing provided further performance
enhancement or power reduction of mainstream
smartphones, DTVs, storage, audio and SoC applications.
Compared to 28HPC, 28HPC+ improves device performance
by 15% or reduces leakage by 50%. In addition, 28HPC+
enables low Vdd designs in Ultra Low Power (28ULP)
applications for the Internet of Things (IoT) market. In
addition, this process is seamlessly applicable to the 28nm
ecosystem, accelerating time-to-market for customers.
● 28nm Low Power (28LP and 28HPC) and RF (28LP-RF
and 28HPC-RF) technologies were used for entry-level
smartphones, application processors, tablets, home
entertainment systems and digital consumer applications.
● 40nm ultra-low power and RF technologies started
production in the first quarter of 2016 for the IoT and
wearable devices related applications, such as wireless
connectivity, application processor, and sensor hub
applications.
● 55nm Ultra-Low Power (55ULP) technology went into
production. Compared to 55nm Low Power (55LP) process,
this technology can significantly increase battery life for IoT
applications. In addition, 55ULP integrates RF and eFlash to
enable customers’ SoC designs.
Specialty Technology
● The world’s first 16FF+ SoC for automotive applications was
successfully produced.
● 40nm eFlash started risk production in the fourth quarter of
2015 for applications such as high-endurance security MCU,
wireless MCU, IoT devices, and high-performance MCU, etc.
● 40nm Ultra-Low Power (ULP) eFlash was developed and is
expected to start production in the second half of 2016 for
applications such as wireless MCU, IoT devices, wearable
devices, and high-performance MCU.
● 55nm Ultra-Low Power (ULP) eFlash started production for
battery-powered applications, such as wireless MCUs, IoT,
wearable devices, and general-purpose MCUs.
● 55nm eFlash technologies started risk production for
automotive applications in the fourth quarter of 2015, such
as body control module (BCM), Electric Power Steering (EPS)
and electric vehicles (EV)/hybrid electric vehicles (HEV).
● 40nm high-voltage technology was qualified for top-end
smartphone display drivers. This technology can improve
display quality and reduce power consumption significantly.
● 45nm 1.0 pixel TSMC Stacked Illumination CMOS Image
Sensor technology was fully qualified and started production
in the fourth quarter of 2015 for mid- to high-end mobile
cameras.
● 0.13µm Bipolar-CMOS-DMOS (BCD) process was readied
for production on both 8-inch and 12-inch wafers. This
process in 12-inch fabs extended qualification for Automotive
Electronic Council (AEC) AEC-Q100 Grade-0 in the first half of
2015.
● 0.18µm BCD third generation underwent process validation
by customers. Compared to the second generation, this
technology provides superior cost competitiveness and is
expected to ramp in the second half of 2016.
● 0.5µm GaN on Silicon 650V Enhancement Mode HEMT
process was qualified for discrete power applications.
Customer samples were sent out to hundreds of their
customers for qualification, as this technology is expected to
enter production in the second half of 2016.
● Successfully demonstrated the world’s smallest CMOS-MEMS
monolithic pressure sensor with accuracy down to 10cm air
pressure change in elevation.
● Successfully demonstrated Bio Metal-Oxide-Semiconductor
Field-Effect Transistor (Bio-MOSFET) technology for
bio-chemical analysis, with 5-10X sensitivity improvement
over traditional techniques. It can provide high accuracy and
high throughput analysis for Point-of-Care applications.
Advanced Packaging Technology
● InFO PoP technology that integrates 16nm SoC and DRAM
for advanced mobile products was successfully qualified in
the fourth quarter of 2015. This technology is expected to
start volume production in the first half of 2016.
● CoWoS-XL (CoWoS® technology that features extra-large
interposer of > 32mmx26mm in size) was successfully
developed and qualified in 2015. It enables the integration
of more or bigger advanced chips in one CoWoS® module.
Volume production is expected in the first half of 2016
for the 20nm multi-chip scheme for FPGA and 16nm SoC
integrated with next generation high-bandwidth DRAM
(HBM2) devices for ultrahigh-performance computing using
the CoWoS-XL scheme.
● Production started in 2015 of fine pitch (80µm pitch)
Bump-on-Trace (BoT) Cu bump technology for flip chip
packaging on 16nm silicon as well as for 28nm silicon in
Wafer Level Chip Scale Packaging (WLCSP) technologies for
mobile applications.
2.2.2 Market Overview
TSMC estimates that the worldwide semiconductor market
in 2015 was US$354 billion in revenue, representing zero
year-over-year growth, a sharp plunge from the 10% YoY
growth recorded in 2014. In the foundry sub-segment of the
semiconductor industry, total revenues were US$44 billion in
2015, representing 4% YoY growth.
2.2.3 Industry Outlook, Opportunities and Threats
Industry Demand and Supply Outlook
The decline in the foundry segment growth to 4% in 2015
from 14% in 2014 was driven mainly by a market slowdown
and a prolonged inventory correction.
TSMC forecasts the total semiconductor market to grow
1% in 2016. Over the longer term, driven by increasing
semiconductor content in electronic devices, continuing market
share gains by fabless companies, and expanding in-house
Application-Specific Integrated Circuits (ASIC) from system
companies, the Company expects foundry segment revenue
growth to be much stronger than the 3% compound annual
growth rate projected for the total semiconductor industry
from 2015 through 2020.
As an upstream supplier in the semiconductor supply chain,
the foundry segment is tightly correlated with the market
health of the three Cs, communications, computer, consumer,
and the emerging IoT.
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● Communications
The communications sector, particularly the Smartphone
segment, posted a 10% growth in unit shipments for 2015.
Although the growth is slowing down, continuing transition
to 4G/LTE and LTE-Advanced will bring mid- to high-single
digit growth to the Smartphone market in 2016. Smartphones
with increasing performance, lower power usage and more
intelligent features will continue to propel buying interests.
The increasing popularity of low-end smartphones in emerging
countries will also drive the growth of the sector.
Low-power IC is an essential requirement among handset
manufacturers. The SoC design for more optimized cost, power
and form factor (device footprint), plus the appetite for higher
performance to run complex software and higher resolution
video will continue to accelerate the migration to advanced
process technologies, in which TSMC is already the leader.
● Computer
After a 1% decline in 2014, the computer sector’s unit
shipments dropped 8% YoY in 2015. The decline was driven
by prolonged replacement cycle, inventory correction, the end
of Windows XP migration, and the new Windows 10 free
upgrade.
The personal computer market is expected to decline by
mid-single digit percentage in 2016. Increasing variety (e.g.
Convertible, Ultrabook and Chromebook), the business
adoption of Windows 10, and steady consumer upgrades to
aging PCs, however, are expected to help buoy PC demand.
Requirements of lower power, higher performance and the
integration of key computer components such as CPU, GPU,
Chipset, etc., should drive demand for product redesign
towards leading process technologies.
● Consumer
The consumer sector’s unit shipments declined 6% in 2015.
While new-generation TV game consoles and set-top boxes
still showed positive growth, the rest of the sector – TVs,
MP3 players, digital cameras and hand-held game consoles
– continued to decline due to economic softness and foreign
exchange issues, as well as functional cannibalization by
smartphones.
Although consumer electronics will continue to decline in
2016, 4K (UHD) TVs and 4K set-top boxes should achieve high
growth within the sector. TSMC will be able to capitalize on
these trends with advanced technology offerings.
● IoT
The Internet of Things (IoT) is taking shape as the “next big
thing,” since more and more devices are being connected
to the Internet. The IoT will have 10X greater installed unit
potential than the smartphone will have in 2025. Applications
and products benefiting from IoT related technologies include
smart wearables, home robots, smart meters, self-driving cars,
and so on. These applications and products will require much
longer battery life, diversified sensors and low-power wireless
connections, which will challenge technology development in
new ways. TSMC’s ultra-low-power logic and RF solutions, and
diversified sensing technologies will help customers lead the
way for this future growth.
Supply Chain
The electronics industry consists of a long and complex supply
chain, the elements of which are highly dependent and
correlated with each other. At the upstream IC manufacturing
level, it is important for IC vendors to have sufficient and
flexible supply to support the dynamic market situation. The
foundry vendors are playing an important role to ensure the
health of the supply chain. As a leader in the foundry segment,
TSMC provides leading technologies and large-scale capacity
to complement the innovations created along the downstream
chain.
2.2.4 TSMC Position, Differentiation, and Strategy
Position
TSMC is the worldwide semiconductor foundry leader for both
advanced and specialty process technologies, commanding a
55% market share in 2015. Net revenues by geography were:
68% from North America; 12% from the Asia Pacific region,
excluding China and Japan; 8% from China; 7% from Europe,
the Middle East and Africa; and 5% from Japan. Net revenues
by end-product application were: 8% from the computer
sector, 61% from communications, 8% from consumer
products, and 23% from industrial and standard products.
Differentiation
TSMC’s leadership position is based on three defining
competitive strengths and a business strategy rooted in
the Company’s heritage. TSMC distinguishes itself from the
competition through its technology leadership, manufacturing
excellence and customer trust.
As a technology leader, TSMC is consistently first among
dedicated foundries that provide next-generation leading-edge
technologies. The Company has also established its leadership
on more mature technology nodes by applying the lessons
learned on leading-edge technology development to enrich
its specialty technologies to more advanced process nodes.
Beyond process technology, TSMC has established front-end
and backend integration capabilities that result in faster
time-to-production and create the best power, performance
and area sweet spot.
TSMC has gained manufacturing acclaim for its
industry-leading management and is extending that leadership
through its Open Innovation Platform® and Grand Alliance
initiatives. The TSMC Open Innovation Platform® initiative
hastens the pace of innovation in the semiconductor design
community and among its ecosystem partners, as well as
the Company’s IP, design implementation and design for
manufacturing capabilities, process technology and backend
services. A key element is a set of ecosystem interfaces and
collaborative components initiated and supported by TSMC
that more efficiently empower innovation throughout the
supply chain and drive the creation and sharing of newly
created revenue and profits. The TSMC Grand Alliance is one of
the most powerful forces for innovation in the semiconductor
industry, bringing together customers, electronic design
automation (EDA) partners, IP partners, and key equipment
and materials suppliers at a new, higher level of collaboration.
Its objective is to help customers, alliance members and TSMC
win business and stay competitive.
The foundation for customer trust is a commitment TSMC
made when it opened for business in 1987: to never compete
with its customers. As a result, TSMC has never owned or
marketed a single semiconductor product design, but instead
has focused all of its resources on becoming the trusted
foundry for its customers.
Strategy
TSMC is confident that its differentiating strengths will enable it
to prosper from the foundry segment’s many attractive growth
opportunities. TSMC maintains its technology leadership
by collaborating in the development process through early
engagement and technology definition that provides a smooth
transition for TSMC’s advanced technology customers.
TSMC’s 20nm System-on-Chip technology (20SoC) entered
the volume production stage with stable yield performance,
while its 16nm FinFET Plus (16FF+) process started volume
production in mid-2015. By leveraging the success of
16FF+, TSMC introduced a highly competitive cost-effective
solution, 16nm FinFET Compact technology (16FFC), which
started volume production in the first quarter of 2016. In
addition, TSMC’s 10nm FinFET technology began customer
product tape-out in the first quarter of 2016. Also, 7nm
FinFET technology is under development with good progress.
This technology is expected to start risk production in the
first quarter of 2017. At the same time, the Company
has maintained its leadership in specialty technologies by
broadening its offerings and expanding their integration into
more advanced process nodes.
Numerous other efforts are underway to ensure manufacturing
excellence through product grade enhancements and
manufacturing technology innovation. On the advanced 3D IC
packaging technology front, InFO PoP technology for advanced
mobile products was successfully qualified in the fourth quarter
of 2015 and is expected to start volume production in the first
half of 2016. In addition, CoWoS-XL (CoWoS® technology that
features extra-large interposer of >32mmx26mm in size) was
successfully developed and qualified in 2015. This technology is
expected to start volume production in the first half of 2016.
To address challenges inherent in the electronic product life
cycle and increased competition from other semiconductor
manufacturing companies, TSMC continually strengthens
its core competitiveness and deploys both short-term and
long-term technology and business development plans to meet
Return on Investment (ROI) and growth objectives.
● Short-term Semiconductor Business Development Plan
1. Substantially ramp the business and sustain advanced
technology market share through increased capacity
investment.
2. Maintain mainstream technology market share by expanding
business to new customers and market segments with
off-the-shelf technologies.
3. Further expand TSMC’s business and service infrastructure
into emerging and developing markets.
● Long-term Semiconductor Business Development Plan
1. Continue developing leading-edge technologies consistent
with Moore’s Law.
2. Broaden specialty business contributions by further
developing derivative technologies.
3. Provide more integrated services, covering system-level
integration design, design technology definition, design tool
preparation, wafer processing, and backend services, all of
which deliver more value to customers through optimized
solutions.
010
011
2.3 Organization
2.3.1 Organization Chart
Audit Committee
Compensation
Committee
Shareholders’ Meeting
Board of Directors,
Chairman,
Vice Chairman
As of 02/29/2016
Internal Audit
Co-CEO Office
Finance and
Spokesperson
Legal
Research and Development-Specialty,
Operations,
Human Resources
Research and Development, Asia, Europe, North America,
Business Development, Corporate Planning Organization,
Quality and Reliability, Information Technology,
Materials Management and Risk Management, Customer Service
2.3.2 Major Corporate Functions
Operations
● Operations of all fabs including in Taiwan and overseas;
product development, manufacturing technology
development, and backend technology development and
production
Human Resources
● Human resources management and organizational
development, as well as proprietary information protection
and physical security management
Research and Development
● Advanced and specialty technology development and
exploratory research, as well as design and technology
platform development
Quality and Reliability
● Ensuring and managing the quality and reliability of the
Company’s products
Information Technology
● Integrating the Company’s technology and business
IT systems; developing IT infrastructure, providing
communication services and ensuring IT security and service
quality
Materials Management and Risk Management
● Procurement, warehousing, import and export, and logistics
support; also environmental protection, industrial safety,
occupational health, and risk management
Customer Service
● Provides support and service for customers in Asia, Europe,
Asia
● Sales, market development, field technical support and service
and North America
for customers in Asia
Europe
● Technical marketing, field technical support and service for
customers in Europe
North America
● Sales, market development, field technical support and service
for customers in North America
Business Development
● Business development for electronic products, identification
of new applications, development of markets for specialty
technology, exploration and development of new markets,
strengthening customer relations, as well as managing the
Company’s brand
Corporate Planning Organization
● Planning for operational resources, as well as for production
and demand; the integration of business processes, corporate
pricing, market analysis and forecasting
Internal Audit
● Inspection and review of TSMC’s internal control system,
its adequacy in design and effectiveness in operation with
independent risk assessment to ensure compliance with
TSMC’s policies and procedures as well as with external
regulations
Finance and Spokesperson
● Corporate finance, accounting and corporate
communications; the head of the organization, also serves as
company spokesperson
Legal
● Corporate legal affairs, including litigation, commercial
transactions, patents and management of other intellectual
properties; and compliance with relevant domestic and
international laws and regulations
012
013
2.4 Board Members
2.4.1 Information Regarding Board Members
Title/Name
Chairman
Morris Chang
Vice Chairman
F.C. Tseng
Nationality or
Place of
Registration
Date Elected
Term Expires
Date First
Elected
Shareholding When Elected
Current Shareholding
Spouse & Minor Shareholding
Shares
%
Shares
%
U.S.A.
06/09/2015
06/08/2018
12/10/1986
125,137,914
0.48%
125,137,914
0.48%
Shares
%
135,217
0.00%
R.O.C.
06/09/2015
06/08/2018
05/13/1997
34,472,675
0.13%
34,472,675
0.13%
132,855
0.00%
Director
National Development Fund, Executive Yuan
(Note 3)
Representative:
Johnsee Lee
R.O.C.
08/06/2010
(Note 4)
06/09/2015
06/08/2018
12/10/1986
1,653,709,980
6.38%
1,653,709,980
6.38%
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Independent Director
Sir Peter Leahy Bonfield
UK
06/09/2015
06/08/2018
05/07/2002
Independent Director
Stan Shih
R.O.C.
06/09/2015
06/08/2018
04/14/2000
1,480,286
0.01%
1,480,286
0.01%
16,116
0.00%
Selected Education, Past Positions & Current Positions at Non-profit Organizations
Bachelor Degree in Mechanical Engineering, MIT
Master Degree in Mechanical Engineering, MIT
Ph.D. in Electrical Engineering, Stanford University
Former Group Vice-President, Texas Instruments Inc.
Former President & COO, General Instrument Corporation
Former Chairman, Industrial Technology Research Institute
Former CEO, TSMC
Member of National Academy of Engineering
Life Member Emeritus of MIT Corporation
Fellow of the Computer History Museum
Laureate of the Industrial Technology Research Institute
Bachelor Degree in Electrical Engineering, National Chengkung University
Master Degree in Electrical Engineering, National Chiao Tung University
Ph.D. in Electrical Engineering, National Chengkung University
Honorary Ph.D., National Chiao Tung University
Former President, Vanguard International Semiconductor Corp.
Former President, TSMC
Former Deputy CEO, TSMC
Chairman, TSMC Education and Culture Foundation
Director, National Culture and Arts Foundation, R.O.C.
Ph.D. in Chemical Engineering, Illinois Institute of Technology
MBA, University of Chicago
Graduate of Harvard Business School’s Advanced Management Program
Former Principal Investigator, Argonne National Laboratory
Former Senior Manager, Johnson Matthey Inc.
Former President, Industrial Technology Research Institute
Former Chairman, Development Center for Biotechnology
Managing Director, Development Center for Biotechnology
Honorary Chairman, Taiwan Bio Industry Organization
Bachelor Degree in Engineering, Loughborough University
Honours Degree in Engineering, Loughborough University
Former Chairman and CEO, ICL Plc
Former CEO and Chairman of the Executive Committee, British Telecommunications Plc
Former Vice President, the British Quality Foundation
Fellow of the Royal Academy of Engineering
Chair of Council and Senior Pro-Chancellor, Loughborough University, UK
BSEE, National Chiao Tung University
MSEE, National Chiao Tung University
Honorary EE Ph.D., National Chiao Tung University
Honorary Doctor of Technology, The Hong Kong Polytechnic University
Honorary Fellowship, University of Wales, Cardiff, UK
Honorary Doctor of International Law, Thunderbird, American Graduate School of International
Management, U.S.A.
Co-Founder, Chairman Emeritus, Acer Group
Former Chairman & CEO, Acer Group
Chairman, National Culture and Arts Foundation, R.O.C.
Director, Public Television Service Foundation, R.O.C.
Council member of Asian Corporate Governance Associate (ACGA)
Chairman of Stans Foundation
As of 02/29/2016
Selected Current Positions at TSMC and
Other Companies
None
Chairman of:
- TSMC China Company Ltd.
- Global UniChip Corp.
Vice Chairman, Vanguard International
Semiconductor Corp.
Director of:
- TSMC Solid State Lighting Ltd. (as of 03/18/2015)
(Note 1)
- TSMC Solar Ltd. (as of 12/14/2015) (Note 2)
Independent Director, Chairman of Audit Committee &
Compensation Committee member, Acer Inc.
CEO, Personal Genomics, Inc.
Independent Director of:
- Far Eastern New Century Corp.
- Zhen Ding Technology Holding Ltd.
- Everlight Electronics Co., Ltd.
- San Fu Chemical Co., Ltd.
Chairman of:
- NXP Semiconductors N.V., the Netherlands
- Global Logic Inc., U.S.A.
Director, Mentor Graphics Corporation Inc., Oregon,
U.S.A.
Member, The Longreach Group Advisory Board
Board Mentor, CMi
Senior Advisor to :
- Rothschild, London
- Alix Partners, London
- G3 Good Governance Group, London.
Director & Honorary Chairman, Acer Inc.
Director of:
- Qisda Corp.
- Wistron Corp.
- Nan Shan Life Insurance Co., Ltd.
- Egis Technology Inc.
- Digitimes Inc.
Independent Director
Thomas J. Engibous
U.S.A.
06/09/2015
06/08/2018
06/10/2009
-
-
-
-
-
-
Bachelor Degree in Electrical Engineering, Purdue University
Master Degree in Electrical Engineering, Purdue University
Honorary Doctorate in Engineering, Purdue University
Lead Director, J.C. Penny Company, Inc.
014
Former Executive Vice President and President of the Semiconductor Group, Texas Instruments Inc.
Former President and CEO, Texas Instruments Inc.
Former Chairman of the Board, Texas Instruments Inc.
Former Chairman of the Board of Catalyst
Member of National Academy of Engineering
Member of Texas Business Hall of Fame
Honorary Director of Catalyst
Honorary Trustee, Southwestern Medical Foundation
(Continued)
015
Title/Name
Independent Director
Gregory C. Chow (Note 5)
Nationality or
Place of
Registration
Date Elected
Term Expires
Date First
Elected
U.S.A.
06/12/2012
06/09/2015
06/09/2011
Shareholding When Elected
Current Shareholding
Spouse & Minor Shareholding
Shares
-
%
-
Shares
-
%
-
Shares
-
%
-
Independent Director
Kok-Choo Chen
R.O.C.
06/09/2015
06/08/2018
06/09/2011
-
-
-
-
5,120
0.00%
Selected Education, Past Positions & Current Positions at Non-profit Organizations
Bachelor Degree in Economics, Cornell University,
Master Degree in Economics, The University of Chicago,
Ph.D. in Economics, The University of Chicago,
Academician, Academia Sinica, R.O.C.
Member, American Philosophical Society
Fellow of the American Statistical Association
Fellow of the Econometric Society
Former President, Society of Economic Dynamics and Control
Honorary Doctor’s, Sun Yat-Sen University
L.L.D., Lingnan University
Hon. Dr. of Business Adm, The University of Hong Kong of Science and Technology
Honorary Professor of Fudan, Guangxi, Hainan, Nankai, Shandong, Remin, Huazhong University of Science
and Technology, Graduate University of Management of Chinese Academy of Sciences, Sun Yat-Sen
Universities and City University of Hong Kong
Assistant Professor, MIT., 1955-1959
Associate Professor, Cornell University, 1959-1962
Research Staff Member and Manager of Economics Research, IBM Thomas Watson Research Center,
1962-1970
Adjunct Professor, Columbia University, 1964-1970
Professor and Director, Econometric Research Program, Princeton University, 1970-2001 (In 2001 Princeton
University renamed the Program the Gregory C. Chow Econometric Research Program in his honor.)
Class of 1913 Professor of Political Economy, Princeton University, 1976-2001
Chairman of the American Economic Association’s Committee on Exchanges in Economics with the People’s
Republic of China, 1981-1994
Co-chairman of the U.S. Committee on Economics Education and Research in China, 1985-1994
Advisor to Prime Ministers and Chairmen of the Economic Planning and Development Council of the Executive
Yuan in Taiwan on economic policy from the mid 1960’s to the early 1980’s
Advisor to the Prime Minister and the State Commission for Restructuring the Economic System on economic
reform in China, 1985-1989
Professor of Economics and Class of 1913 Professor of Political Economy, Emeritus, Princeton University,
2001-Present
Inns of Court School of Law, England
Barrister-at-law, England
Advocate & Solicitor, Singapore
Attorney-at-law, California, U.S.A.
Lawyer, Tan, Rajah & Cheah, Singapore, 1969-1970
Lawyer, Sullivan & Cromwell, New York, U.S.A., 1971-1974
Lawyer, Heller, Erhman, White & McAuliffe, San Francisco, California, U.S.A., 1974-1975
Partner, Ding & Ding Law Offices, Taiwan, 1975-1988
Partner, Chen & Associates Law Offices, Taiwan, 1988-1992
Former Vice-President, Echo Publishing, Taiwan, 1992-1995
Former President, National Culture & Arts Foundation, R.O.C., 1995-1997
Former Senior Vice-President & General Counsel, TSMC, 1997-2001
Founder & Executive Director of Taipei Story House, 2003-2015
Lecturer, Nanyang University, Singapore, 1970 ~ 1971
Associate Professor, Soochow University, 1981 ~ 1998
Chair Professor, National Tsing Hua University, 1999 ~ 2002
Professor, National Chengchi University, 2001 ~ 2004
Professor, Soochow University, 2001 ~ 2008
Chairman, National Performing Arts Center
Advisor, Executive Yuan, R.O.C.
Director, National Culture and Arts Foundation, R.O.C.
Director, Republic of China Female Cancer Foundation
Independent Director
Michael R. Splinter (Note 6)
U.S.A.
06/09/2015
06/08/2018
06/09/2015
-
-
-
-
-
-
Bachelor and Master Degrees in Electrical Engineering, University of Wisconsin Madison
Honorary Ph.D, in Engineering, University of Wisconsin Madison
Former Executive Vice President of Technology and Manufacturing group, Intel Corporation
Former Executive Vice President of Sales and Marketing, Intel Corporation
Former CEO, Applied Materials, Inc.,
Former Chairman, Applied Materials, Inc.,
Director, Silicon Valley Leadership Group
Director, Semiconductor Equipment and Materials International (SEMI)
Director, University of Wisconsin Foundation
Remarks:
1. No member of the Board of Directors held TSMC shares by nominee arrangement.
2. No member of the Board of Directors had a spouse or relative within two degrees of consanguinity serving as a manager or director at TSMC.
Note 1: On January 9, 2015, the Board of Directors of TSMC approved to sell all shares of TSMC Solid Sate Lighting (TSMC SSL) held by TSMC and TSMC’s subsidiary to Epistar Corporation. After the transaction, TSMC
completely exited TSMC SSL. Dr. F.C. Tseng stopped his directorship as of March 18, 2015.
Note 2: TSMC Solar ceased manufacturing operations in August 2015. On November 10, 2015, TSMC’s Board of Directors approved merging TSMC Solar into TSMC, with the latter as the surviving entity. The merger
record date was December 14, 2015.
Note 3: Major Shareholder of TSMC’s Director that is an Institutional Shareholder.
Director that is an Institutional Shareholder of TSMC
National Development Fund, Executive Yuan
Top 10 Shareholders
Not Applicable
Major Institutional shareholders of National Development Fund: Not Applicable.
Note 4: Mr. Johnsee Lee was appointed as the representative of National Development Fund on August 6, 2010.
Note 5: Professor Dr. Gregory C. Chow’s tenure expired on June 9, 2015 because he was not re-elected at the 2015 Annual Shareholders’ Meeting.
Note 6: Mr. Michael R. Splinter was elected as TSMC’s independent director at TSMC’s Annual Shareholder’s Meeting on June 9, 2015.
Selected Current Positions at TSMC and
Other Companies
None
None
Director of:
- The NASDAQ OMX Group, Inc.
- Pica8, Inc.
General Partner, WISC Partners LP
016
017
2.4.2 Remuneration Paid to Directors (Note 1)
Unit: NT$ thousands
Base Compensation (A)
Severance Pay and
Pensions (B) (Note 4)
Compensation to Directors (C)
Allowances (D)
(Note 5)
Director’s Remuneration
Total Remuneration
(A+B+C+D) as a % of 2015
Net Income
Compensation Earned by a Director Who is an Employee of TSMC or of TSMC’s Consolidated Entities
Base Compensation,
Bonuses, and Allowances (E)
Severance Pay and
Pensions (F) (Note 4)
Employees’ Profit Sharing Bonus (G)
Exercisable Employee
Stock Options (H)
(Note 6)
Granted Employee
Restricted Stock (I)
(Note 7)
Total Compensation
(A+B+C+D+E+F+G) as
a % of 2015 Net Income
(Note 8)
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
From TSMC
From All Consolidated
Entities
Cash
Stock (Fair
Market
Value)
Cash
Stock (Fair
Market
Value)
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
Compensation
Paid to
Directors
from Non-
consolidated
Affiliates
(J)
33,718
33,718
895
895
356,186
356,186
3,669
3,669
0.13%
0.13%
-
-
-
-
-
-
-
-
-
-
-
-
0.13%
0.13%
2,968
Title/Name
Chairman
Morris Chang
Vice Chairman
F.C. Tseng
Independent Director
Sir Peter Leahy Bonfield
Independent Director
Stan Shih
Independent Director
Thomas J. Engibous
Independent Director
Gregory C. Chow (Note 2)
Independent Director
Kok-Choo Chen
Independent Director
Michael R. Splinter (Note 3)
Director
National Development Fund, Executive
Yuan
Representative: Johnsee Lee
Note 1: Remuneration policies, standards/packages, procedures, the linkage to operating performance and future risk exposure: The base compensation for the Chairman, Vice-Chairman and directors are
determined in accordance with the procedures set forth in TSMC’s Articles of Incorporation. The Articles of Incorporation also provides that the compensation to directors shall be no more than
0.3% of annual profits and directors who also serve as executive officers of TSMC are not entitled to receive compensation to directors. The distribution of compensation to directors shall be made
in accordance with TSMC’s “Rules for Distribution of Compensation to Directors”.
Note 2: Professor Dr. Gregory C. Chow’s tenure expired on June 9, 2015 because he was not re-elected at the 2015 Annual Shareholders’ Meeting.
Note 3: Mr. Michael R. Splinter was elected as TSMC’s independent director at TSMC’s Annual Shareholders’ Meeting on June 9, 2015.
Note 4: Pensions funded/paid according to applicable law.
Note 5: The above-mentioned figures include expenses for Company cars and gasoline reimbursement, but do not include compensation paid to Company drivers (totaled NT$4,621 thousand).
Note 6: Represents the number of employee stock options exercisable as of the date of this Annual Report.
Note 7: TSMC did not issue employee restricted stock in 2015, and as of the date of this Annual Report.
Note 8: Total remuneration and compensation of TSMC and all consolidated entities paid to TSMC’s directors in 2014 were NT$444,110 thousand and NT$478,063 thousand respectively, accounting for
0.17% and 0.18% of 2014 net income respectively.
Remuneration Paid to Directors
Total Remuneration (A+B+C+D)
Total Compensation (A+B+C+D+E+F+G+J)
From TSMC
From All Consolidated Entities
From TSMC
From All Consolidated Entities
and Non-consolidated Affiliates
2015
NT$0 ~ NT$2,000,000
NT$2,000,000 ~ NT$4,999,999
NT$5,000,000 ~ NT$9,999,999
None
None
None
None
National Development Fund, Executive Yuan, Gregory C. Chow,
Michael R. Splinter
National Development Fund, Executive Yuan, Gregory C. Chow,
Michael R. Splinter
NT$10,000,000 ~ NT$14,999,999
Sir Peter Leahy Bonfield, Stan Shih, Thomas J. Engibous, Kok-Choo Chen
Sir Peter Leahy Bonfield, Stan Shih, Thomas J. Engibous, Kok-Choo Chen
NT$15,000,000 ~ NT$29,999,999
F.C. Tseng
NT$30,000,000 ~ NT$49,999,999
NT$50,000,000 ~ NT$99,999,999
Over NT$100,000,000
Total
None
None
Morris Chang
9
F.C. Tseng
None
None
Morris Chang
9
018
019
2.5 Management Team
2.5.1 Information Regarding Management Team
Title
Name
(Note 1)
President and Co-Chief Executive Officer
Mark Liu
President and Co-Chief Executive Officer
C.C. Wei
Senior Vice President and Chief Information Officer
Information Technology, Materials Management and
Risk Management
Stephen T. Tso
Senior Vice President,
Chief Financial Officer and Spokesperson
Finance
Lora Ho
Senior Vice President
Research and Development
Wei-Jen Lo (Note 3)
Senior Vice President of TSMC and
President of TSMC North America
Rick Cassidy (Note 3)
Vice President
Operations/Affiliate Fabs
M.C. Tzeng
Vice President and Chief Technology Officer
Research and Development
Jack Sun
Vice President
Operations/Product Development
Y.P. Chin
Vice President
Quality and Reliability
N.S. Tsai
Vice President
Operations/Mainstream Fabs and Manufacturing
Technology
J.K. Lin
Vice President
Operations/300mm Fabs
J.K. Wang
Vice President
Corporate Planning Organization
Irene Sun
Vice President
Research and Development
Y.J. Mii
Nationality
On-board Date
(Note 2)
Shareholding
Spouse & Minor
Shareholding
%
Shareholding
R.O.C.
11/15/1993
12,977,114
0.05%
-
%
-
R.O.C.
02/01/1998
7,179,207
0.03%
261
0.00%
R.O.C.
12/16/1996
13,217,064
0.05%
-
-
R.O.C.
06/01/1999
4,481,080
0.02%
2,230,268
0.01%
R.O.C.
07/01/2004
1,468,127
0.01%
U.S.A.
11/14/1997
-
-
R.O.C.
01/01/1987
7,592,595
0.03%
R.O.C.
06/02/1997
4,195,831
0.02%
-
-
-
-
-
-
-
-
R.O.C.
01/01/1987
7,150,122
0.03%
2,194,107
0.01%
R.O.C.
03/01/2000
2,033,180
0.01%
1,103,253
0.00%
R.O.C.
01/01/1987
12,498,018
0.05%
1,178,036
0.00%
R.O.C.
02/11/1987
2,553,947
0.01%
160,844
0.00%
R.O.C.
10/01/2003
800,709420,709
0.00%
R.O.C.
11/14/1994
1,000,419
0.00%
--
-
--
-
TSMC Shareholding by
Nominee Arrangement
Shareholding
-
-
-
-
-
-
-
-
-
-
-
-
-
-
%
-
-
-
-
-
-
-
-
-
-
-
-
-
-
020
As of 02/29/2016
Managers Who are Spouses or within Second-degree
Relative of Consanguinity to Each Other
Title
None
Name
None
Relation
None
None
None
None
Director, TSMC subsidiary
None
None
None
Director and/or Supervisor, TSMC subsidiaries
Director, TSMC affiliates
President, TSMC subsidiaries
None
None
None
None
None
None
None
Director, TSMC North America
None
None
None
Director, TSMC subsidiaries
Director, TSMC affiliate
Deputy Director
M.J. Tzeng
Siblings
Education & Selected Past Positions
Selected Current Positions at Other
Companies
Ph.D., Electrical Engineering & Computer Science, University of California, Berkeley, U.S.
Executive Vice President and Co-Chief Operating Officer, TSMC
Senior Vice President, Operations, TSMC
Senior Vice President, Advanced Technology Business, TSMC
President, Worldwide Semiconductor Manufacturing Corp.
Ph.D., Electrical Engineering, Yale University, U.S.
Executive Vice President and Co-Chief Operating Officer, TSMC
Senior Vice President, Business Development, TSMC
Senior Vice President, Mainstream Technology Business, TSMC
Senior Vice President, Chartered Semiconductor Manufacturing Ltd.
Ph.D., Materials Science & Engineering, University of California, Berkeley, U.S.
President, WaferTech, LLC
Senior Vice President, Operations, TSMC
General Manager of CVD Products, Applied Material
Master, Business Administration, National Taiwan University, Taiwan
Senior Director, Accounting, TSMC
Vice President & CFO, TI-Acer Semiconductor Manufacturing Corp.
Ph.D., Solid State Physics and Surface Chemistry, University of California, Berkeley, U.S.
Vice President, Research and Development, TSMC
Vice President, Operations/ Manufacturing Technology, TSMC
Vice President, Advanced Technology Business, TSMC
Vice President, Operation II, TSMC
Director, Advanced Technology Development and CTM Plant Manager, Intel
Bachelor, Engineering Technology, United States Military Academy at West Point, U.S.
Vice President of TSMC North America Account Management
Master, Applied Chemistry, Chungyuan University, Taiwan
Vice President, Mainstream Technology Business, TSMC
Senior Director, Fab 2 Operation, TSMC
Ph.D., Electrical Engineering, University of Illinois at Urbana-Champaign, U.S.
Vice President, Research and Development, TSMC
Senior Director, Logic Technology Division, TSMC
Senior Manager of R&D, International Business Machines (IBM)
Master, Electrical Engineering, National Cheng Kung University, Taiwan
Vice President, Advanced Technology and Business, TSMC
Senior Director, Product Engineering & Services, TSMC
Ph.D., Material Science, Massachusetts Institute of Technology, U.S.
Senior Director, Assembly Test Technology & Service, TSMC
Vice President, Operations, Vanguard International Semiconductor Corp.
None
None
None
None
None
Bachelor, Science, National Changhua University of Education, Taiwan
Senior Director, Mainstream Fabs, TSMC
Director, TSMC subsidiaries
Director, TSMC affiliate
Master, Chemical Engineering, National Cheng Kung University, Taiwan
Senior Director, 300mm fab operations, TSMC
Ph.D., Materials Science and Engineering, Cornell University, U.S.
Senior Director, Corporate Planning Organization, TSMC
Ph.D., Electrical Engineering, University of California, Los Angeles, U.S.
Senior Director, R&D Platform I Division, TSMC
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
Technical Manager
J.J. Wang
Siblings
None
None
None
None
None
None
(Continued)
021
Title
Name
(Note 1)
Vice President
Research and Development
Cliff Hou
Vice President
Business Development
Been-Jon Woo
Vice President and General Counsel
Legal
Sylvia Fang
Vice President
Human Resources
Connie Ma
Vice President
Research and Development
Y.L. Wang (Note 3)
Nationality
On-board Date
(Note 2)
Shareholding
Spouse & Minor
TSMC Shareholding by
Nominee Arrangement
Shareholding
%
Shareholding
%
Shareholding
R.O.C.
12/15/1997
352,532
0.00%
60,802
0.00%
R.O.C.
04/30/2009
265,000
0.00%
50,000
0.00%
-
-
%
-
-
R.O.C.
03/20/1995
700,285
0.00%
419,112
0.00%
34,000
0.00%
R.O.C.
06/01/2014
50,000
0.00%
-
-
R.O.C.
06/01/1992
218,535
0.00%
1,135,529
0.00%
-
-
-
-
Note 1: Vice President Dr. Burn J. Lin retired, effective November 1, 2015.
Note 2: On-board date means the official date joining TSMC.
Note 3: Dr. Y.L. Wang was promoted to Vice President, effective November 10, 2015.
Education & Selected Past Positions
Ph.D., Electrical Engineering, Syracuse University, U.S.
Senior Director, Design and Technology Platform, TSMC
Ph.D., Chemistry, University of Southern California, U.S.
Director of Business Development, TSMC
Vice President of R&D, Grace Semiconductor Manufacturing Corp.
Director of Technology Integration, Intel Corp.
Master of Comparative Law, School of Law, University of Iowa
Associate General Counsel, TSMC
Taiwan International Patent and Law Office (TIPLO)
EMBA, International Business Management, National Taiwan University
Director of Human Resources, TSMC
Senior Vice President of Global Human Resources, Trend Micro Inc.
Ph.D., Electrical Engineering, National Chiao Tung University, Taiwan
Vice President, Fab 14B operations, TSMC
Senior Director, Fab 14B operations, TSMC
Selected Current Positions at Other
Companies
Managers Who are Spouses or within Second-degree
Relative of Consanguinity to Each Other
Director, TSMC subsidiaries
Director, TSMC affiliate
President, TSMC subsidiaries
None
Director, TSMC subsidiaries
Director, TSMC affiliate
None
None
Title
None
None
None
None
None
Name
None
Relation
None
None
None
None
None
None
None
None
None
022
023
2.5.2 Compensation Paid to CEO, President, and Vice Presidents (Note 1)
Unit: NT$ thousands
Salary (A)
Severance Pay and Pensions (B)
(Note 4)
Bonuses and Allowances (C)
(Note 5)
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
Employees’ Profit Sharing Bonus (D)
Total Compensation as a % of
2015 Net Income (A+B+C+D)
(Note 6)
Exercisable Employee Stock
Options (K shares)
(Note 7)
Exercisable Employee Restricted
Stock (K shares)
(Note 8)
From TSMC
From All Consolidated Entities
Cash
Stock
(Fair Market
Value)
Cash
Stock
(Fair Market
Value)
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
From TSMC
From All
Consolidated
Entities
Compensation
Received from
Non-consolidated
Affiliates
83,158
97,577
9,673
10,031
671,432
741,637
642,284
-
642,284
-
0.46%
0.49%
-
-
-
-
280
Title
Name
President and Co-Chief Executive Officer
President and Co-Chief Executive Officer
Senior Vice President and Chief Information Officer
Information Technology, Materials Management and Risk
Management
Senior Vice President, Chief Financial Officer and Spokesperson
Finance
Senior Vice President
Research and Development
Senior Vice President of TSMC and
President of TSMC North America
Vice President
Operations/Affiliate Fabs
Vice President and Chief Technology Officer
Research and Development
Vice President
Operations/Product Development
Vice President
Quality and Reliability
Vice President
Operations/Mainstream Fabs and Manufacturing Technology
Vice President
Operations/300mm Fabs
Vice President
Corporate Planning Organization
Vice President
Research and Development
Vice President
Research and Development
Vice President
Research and Development
Vice President
Business Development
Vice President and General Counsel
Legal
Vice President
Human Resources
Vice President
Research and Development
Mark Liu
C.C. Wei
Stephen T. Tso
Lora Ho
Wei-Jen Lo
Rick Cassidy
M.C. Tzeng
Jack Sun
Y.P. Chin
N.S. Tsai
J.K. Lin
J.K. Wang
Irene Sun
Burn J. Lin (Note 2)
Y.J. Mii
Cliff Hou
Been-Jon Woo
Sylvia Fang
Connie Ma
Y.L. Wang (Note 3)
Note 1: Compensation policy, standards/packages, procedures, the linkage to operating performance and future risk exposure: The total compensation paid to Chief Executive Officer and each
executive officer are also reviewed by the Compensation Committee individually based on their job responsibility, contribution, and projected future risks the Company will face before the total
compensation proposals are submitted to the Board of Directors for approval.
Note 2: Vice President Dr. Burn J. Lin retired, effective November 1, 2015.
Note 3: Dr. Y.L. Wang was promoted to Vice President, effective November 10, 2015.
Note 4: Pensions funded/paid according to applicable law.
Note 5: The above-mentioned figures include the expense for the employees’ cash bonuses distributed in June, August, November 2015 and February 2016, Company cars and gasoline reimbursement,
but does not include compensation paid to Company drivers (totaled NT$3,321 thousand).
Note 6: Total compensation of TSMC and all consolidated entities paid to TSMC’s Chief Executive Officer and Executive Officers in 2014 were NT$1,283,465 thousand and NT$1,348,861 thousand
respectively, accounting for 0.49% and 0.51% of 2014 net income respectively.
Note 7: Represents the number of employee stock options exercisable as of the date of this Annual Report.
Note 8: TSMC did not issue employee restricted stock in 2015, and as of the date of this Annual Report.
Compensation Paid to CEO, President and Vice Presidents
NT$0 ~ NT$2,000,000
NT$2,000,000 ~ NT$4,999,999
NT$5,000,000 ~ NT$9,999,999
NT$10,000,000 ~ NT$14,999,999
NT$15,000,000 ~ NT$29,999,999
NT$30,000,000 ~ NT$49,999,999
NT$50,000,000 ~ NT$99,999,999
From TSMC
Rick Cassidy
None
Y.L. Wang
None
None
2015
From All Consolidated Entities and Non-consolidated Affiliates
None
None
Y.L. Wang
None
None
Burn J. LIN, N.S. Tsai, J.K. Lin, Been-Jon Woo, J.K. Wang, Irene Sun,
Sylvia Fang, Connie Ma
Lora Ho, Jack Sun, M.C. Tzeng, Y.P. Chin, Y.J. Mii, Cliff Hou
Burn J. LIN, N.S. Tsai, J.K. Lin, Been-Jon Woo, J.K. Wang, Irene Sun,
Sylvia Fang, Connie Ma
Lora Ho, Rick Cassidy, Jack Sun, M.C. Tzeng, Y.P. Chin, Y.J. Mii, Cliff Hou
Over NT$100,000,000
Mark Liu, C.C. Wei, Stephen T. Tso, Wei-Jen Lo
Mark Liu, C.C. Wei, Stephen T. Tso, Wei-Jen Lo
Total
20
20
024
025
2.5.3 Employees’ Profit Sharing Bonus Paid to Management Team
Unit: NT$ thousands
Title
President and Co-Chief Executive Officer
President and Co-Chief Executive Officer
Senior Vice President and Chief Information Officer
Information Technology, Materials Management and Risk Management
Senior Vice President, Chief Financial Officer and Spokesperson
Finance
Senior Vice President
Research and Development
Senior Vice President of TSMC and
President of TSMC North America
Vice President
Operations/Affiliate Fabs
Vice President and Chief Technology Officer
Research and Development
Vice President
Operations/Product Development
Vice President
Quality and Reliability
Vice President
Operations/Mainstream Fabs and Manufacturing Technology
Vice President
Operations/300mm Fabs
Vice President
Corporate Planning Organization
Vice President
Research and Development
Vice President
Research and Development
Vice President
Research and Development
Vice President
Business Development
Vice President and General Counsel
Legal
Vice President
Human Resources
Vice President
Research and Development
Note 1: Vice President Dr. Burn J. Lin retired, effective November 1, 2015.
Note 2: Dr. Y.L. Wang was promoted to Vice President, effective November 10, 2015.
Name
Mark Liu
C.C. Wei
Stephen T. Tso
Lora Ho
Wei-Jen Lo
Rick Cassidy
M.C. Tzeng
Jack Sun
Y.P. Chin
N.S. Tsai
J.K. Lin
J.K. Wang
Irene Sun
Burn J. Lin (Note 1)
Y.J. Mii
Cliff Hou
Been-Jon Woo
Sylvia Fang
Connie Ma
Y.L. Wang (Note 2)
Stock
(Fair Market Value)
Cash
Total Employees’ Profit Sharing Bonus
Total Employees’ Profit Sharing Bonus
Paid to Management Team as a % of
2015 Net Income
-
642,284
642,284
0.21%
026
027
3. Corporate Governance
3.1 Overview
TSMC advocates and acts upon the principles of operational transparency and respect for shareholder rights. We believe that the
basis for successful corporate governance is a sound and effective Board of Directors. In line with this principle, the TSMC Board
delegates various responsibilities and authority to two Board Committees, Audit Committee and Compensation Committee. Each
Committee has a written charter approved by the Board. Each Committee’s chairperson regularly reports to the Board on the
activities and actions of the relevant committee. The Audit Committee and Compensation Committee consist solely of independent
directors.
2015 Corporate Governance Awards
Organization
Dow Jones Sustainability Indices (DJSI)
FinanceAsia
IR Magazine
Fortune Magazine
Barron’s
MSCI Global Sustainability Index Series
CommonWealth Magazine
GlobalViews Magazine
Taiwan Institute for Sustainable Energy
R.O.C. Security & Futures Institute
Taiwan Stock Exchange
Awards
DJSI Semiconductor and Semiconductor Equipment “Industry Group Leader”
RobecoSAM Sustainability Award “Gold Class”
RobecoSAM Sustainability Award: Industry Leader
Best Corporate Governance – Rank No. 3 in Taiwan
Best Managed Public Company – Rank No. 2 in Taiwan
Most committed to a Strong Dividend Policy – Rank No. 2 in Taiwan
Grand Prix for best overall investor relations (Large cap)
Best in Sector – Technology
Best IR by a Taiwanese Company
Selected as one of The World’s Most Admired Companies
Selected as Top 100 World’s Most Respected Companies
Selected as MSCI Global Sustainability Index component
Excellence in Corporate Social Responsibility Award – Large cap – 1st Place
Corporate Social Responsibility Award:
Technology and Traditional Industry Group – Model Award
Public Welfare Promoting – Model Award
Taiwan Corporate Sustainability Awards:
Taiwan Top 50 Corporate Responsibility Report Awards – Electronics Industry – Gold Class
Sustainable Water Management Award
12th Information Disclosure of Public Companies Ranking – Ranked A++
Ranked in top 5% in First Corporate Governance Evaluation of Listed Companies
028
028
029
029
The third duty of the Board of Directors is to evaluate the
management’s performance and to dismiss officers of
the Company when necessary. TSMC’s management has
maintained a healthy and functional communication with the
Board of Directors, has been devoted in executing guidance of
the Board, and is dedicated in running the business operations,
all to achieve the best interests for TSMC shareholders.
Election of Directors
Directors shall be elected pursuant to the candidates
nomination system as specified in Article 192-1 of the R.O.C.
“Company Law”. The tenure of office for Directors shall be
three years. Our Board members are nominated through
a highly selective process that considers not only their
respective professional technical competence but also their
respective reputation for ethical behavior and leadership. The
independence of each independent director candidate is also
considered and assessed under relevant law such as the Taiwan
“Regulations Governing Appointment of Independent Directors
and Compliance Matters for Public Companies”. Under R.O.C.
law, in which TSMC was incorporated, any shareholders
holding one percent or more of our total outstanding
common shares may nominate their own candidate to stand
for election as a Board member. This democratic mechanism
allows our shareholders to become involved in the selection
and nomination process of Board candidates. The final slate
of candidates are put to the shareholders for voting at the
relevant annual shareholders’ meeting.
Directors’ Compensation
According to our Articles of Incorporation, not more than
0.3 percent of our annual profits (defined under local law)
after recovering any losses incurred in prior years, if any, may
be distributed as compensation to our directors. In addition,
directors who also serve as executive officers of the Company
are not entitled to receive any director compensation.
3.2 Board of Directors
Board Structure
TSMC’s 13th Board of Directors was elected at TSMC’s 2015
Annual Shareholders’ Meeting on June 9, 2015. TSMC’s Board
of Directors consists of eight distinguished members with a
great breadth of experience as world-class business leaders
or scholars. We rely on them for their diverse knowledge,
personal perspectives, and solid business judgment. Five of
the eight members are independent directors: former British
Telecommunications Chief Executive Officer, Sir Peter Bonfield;
Co-Founder, Chairman Emeritus of the Acer Group, Mr. Stan
Shih; former Texas Instruments Inc. Chairman of the Board,
Mr. Thomas J. Engibous; Chairman of National Performing
Arts Center and Advisor to the Taiwan Executive Yuan, Ms.
Kok-Choo Chen; and former Chairman of Applied Materials,
Inc., Mr. Michael R. Splinter. One of the members of the Board
Directors is female. The number of Independent Directors is
more than 50% of the total number of Directors.
Board Responsibilities
Under the leadership of Chairman Morris Chang, TSMC’s Board
of Directors takes a serious and forthright approach to its
duties and is a dedicated, competent and independent Board.
In the spirit of Chairman Chang’s approach to corporate
governance, a board of directors’ primary duty is to supervise.
The Board should supervise the Company’s: compliance with
relevant laws and regulations, financial transparency, timely
disclosure of material information, and maintaining of the
highest integrity within the Company.
TSMC’s Board of Directors strives to perform these
responsibilities through the Audit Committee and the
Compensation Committee, the hiring of a financial expert for
the Audit Committee, and coordination with the Internal Audit
department.
The second duty of the Board of Directors is to provide
guidance to the management team of the Company. Quarterly,
TSMC’s management reports to the Board on a variety of
subjects. The management also reviews the Company’s
business strategies with the Board and updates TSMC’s Board
on the progress of those strategies, obtaining Board guidance
as appropriate.
Directors’ Professional Qualifications and Independent Analysis
According to the relevant requirements set by Taiwan’s Securities and Futures Bureau, the professional qualifications and
independence status of the Company’s Board members are listed in the table below.
Meet the Following Professional Qualification Requirements,
Together with at Least Five Years Work Experience
Criteria (Note 1)
An Instructor or
Higher Position in
a Department of
Commerce, Law,
Finance, Accounting,
or Other Academic
Department Related
to the Business Needs
of the Company in
a Public or Private
Junior College,
College or University
A Judge, Public
Prosecutor, Attorney,
Certified Public
Accountant, or
Other Professional or
Technical Specialists
Who Has Passed a
National Examination
and Been Awarded
a Certificate in a
Profession Necessary
for the Business of
the Company
Have Work
Experience in the
Area of Commerce,
Law, Finance, or
Accounting, or
Otherwise Necessary
for the Business of
the Company
1
2
3
4
5
6
7
8
9
10
Number of Other
Taiwanese Public
Companies
Concurrently Serving
as an Independent
Director
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
-
1
4
-
-
-
-
-
-
Name/Criteria
Morris Chang
Chairman
F.C. Tseng
Vice Chairman
Johnsee Lee
Director
Sir Peter Leahy Bonfield
Independent Director
Stan Shih
Independent Director
Thomas J. Engibous
Independent Director
Gregory C. Chow
Independent Director
(Note 2)
Kok-Choo Chen
Independent Director
Michael R. Splinter
Independent Director
(Note 3)
Note 1: Directors, during the two years before being elected and during the term of office, meet any of the following situations, please tick the appropriate corresponding boxes:
1. Not an employee of the company or any of its affiliates;
2. Not a director or supervisor of the company or any of its affiliates. The same does not apply, however, in cases where the person is an independent director of the company, its parent company,
or any subsidiary in which the company holds, directly or indirectly, more than 50 percent of the voting shares;
3. Not a natural-person shareholder who holds shares, together with those held by the person’s spouse, minor children, or held by the person under others’ names, in an aggregate amount of
one percent or more of the total number of issued shares of the company or ranks as one of its top ten shareholders;
4. Not a spouse, relative within the second degree of kinship, or lineal relative within the third degree of kinship, of any of the above persons in the preceding three subparagraphs;
5. Not a director, supervisor, or employee of a corporate/institutional shareholder that directly holds five percent or more of the total number of issued shares of the company or ranks as of its top
five shareholders;
6. Not a director, supervisor, officer, or shareholder holding five percent or more of the shares of a specified company or institution that has a financial or business relationship with the company;
7. Not a professional individual who, or an owner, partner, director, supervisor, or officer of a sole proprietorship, partnership, company, or institution that, provides commercial, legal, financial,
accounting services or consultation to the company or to any affiliate of the company, or a spouse thereof, provided that this restriction does not apply to any member of the compensation
committee who exercises powers pursuant to Article 7 of the “Regulations Governing the Establishment and Exercise of Powers of Compensation Committees of Companies whose Stock is
Listed on the TWSE or Traded on the GTSM”;
8. Not having a marital relationship, or a relative within the second degree of kinship to any other director of the company;
9. Not been a person of any conditions defined in Article 30 of the Company Law; and
10. Not a governmental, juridical person or its representative as defined in Article 27 of the Company Law.
Note 2: Professor Gregory C. Chow’s tenure expired on June 9, 2015 because he was not re-elected at the 2015 Annual Shareholders’ Meeting.
Note 3: Mr. Michael R. Splinter was elected as TSMC’s independent director at the 2015 Annual Shareholders’ Meeting on June 9, 2015.
030
031
3.2.1 Audit Committee
The Audit Committee assists the Board in fulfilling its oversight
of the quality and integrity of the accounting, auditing,
reporting, and financial control practices of the Company.
The Audit Committee is responsible to review the following
major matters:
● Financial reports;
● Auditing and accounting policies and procedures;
● Internal control systems;
● Material asset or derivatives transactions;
● Material lending funds, endorsements or guarantees;
● Offering or issuance of any equity-type securities;
● Legal compliance;
● Related-party transactions and potential conflicts of interests
involving executive officers and directors;
● Ombudsman reports;
● Potential fraud investigation reports;
● Corporate risk management;
● Hiring or dismissal of an attesting CPA, or the compensation
given thereto; and
● Appointment or discharge of financial, accounting, or internal
auditing officers, etc.
Under R.O.C. law, the membership of Audit Committee shall
consist of all independent Directors. TSMC’s Audit Committee
satisfies this statutory requirement. The Committee also
engaged a financial expert consultant in accordance with the
rules of the U.S. Securities and Exchange Commission. The
Audit Committee annually conducts self-evaluation to assess
the Committee’s performance and identify areas for further
attention.
TSMC’s Audit Committee is empowered by its Charter to
conduct any study or investigation it deems appropriate
to fulfill its responsibilities. It has direct access to TSMC’s
internal auditors, the Company’s independent auditors, and
all employees of the Company. The Committee is authorized
to retain and oversee special legal, accounting, or other
consultants as it deems appropriate to fulfill its mandate. The
Audit Committee Charter is available on TSMC’s corporate
website.
3.2.2 Compensation Committee
The Compensation Committee assists the Board in discharging
its responsibilities related to TSMC’s compensation and benefits
policies, plans and programs, and in the evaluation and
compensation of TSMC’s directors of the Board and executives.
The members of the Compensation Committee are appointed
by the Board as required by R.O.C. law. According to TSMC’s
Compensation Committee Charter, the Committee shall consist
of no fewer than three independent directors of the Board.
Currently, the Compensation Committee is comprised of all five
independent directors; the Chairman of the Board, Dr. Morris
Chang, is invited by the Committee to attend all meetings
and is excused from the Committee’s discussion of his own
compensation.
TSMC’s Compensation Committee is authorized by its Charter
to retain an independent consultant to assist in the evaluation
of CEO, or executive officer compensation. The Compensation
Committee Charter is available on TSMC’s corporate website.
Compensation Committee Members’ Professional Qualifications and Independent Analysis
According to the relevant requirements set by Taiwan’s Securities and Futures Bureau, the professional qualifications and
independence status of the Company’s Compensation Committee members are listed in the table below.
Meet the Following Professional Qualification Requirements, Together with at Least
Five Years Work Experience
Criteria (Note 1)
An Instructor or Higher
Position in a Department
of Commerce, Law,
Finance, Accounting,
or Other Academic
Department Related to
the Business Needs of
the Company in a Public
or Private Junior College,
College or University
A Judge, Public Prosecutor,
Attorney, Certified Public
Accountant, or Other
Professional or Technical
Specialists Who Has Passed
a National Examination
and Been Awarded a
Certificate in a Profession
Necessary for the Business
of the Company
Have Work Experience in
the Area of Commerce,
Law, Finance, or
Accounting, or Otherwise
Necessary for the Business
of the Company
1
2
3
4
5
6
7
8
Number of Other
Taiwanese Public
Companies
Concurrently Serving
as a Compensation
Committee Member in
Taiwan
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
ˇ ˇ ˇ ˇ ˇ ˇ ˇ ˇ
-
-
-
-
-
-
Name Title/Criteria
Stan Shih
Independent Director
Sir Peter Leahy Bonfield
Independent Director
Thomas J. Engibous
Independent Director
Gregory C. Chow
Independent Director
(Note 2)
Kok-Choo Chen
Independent Director
Michael R. Splinter
Independent Director
(Note 3)
Note 1: Compensation Committee Members, during the two years before being elected or during the term of office, meet any of the following situations, please tick the appropriate corresponding boxes:
1. Not an employee of the company or any of its affiliates;
2. Not a director or supervisor of the company or any of its affiliates. The same does not apply, however, in cases where the person is an independent director of the company, its parent company,
or any subsidiary in which the company holds, directly or indirectly, more than 50 percent of the voting shares;
3. Not a natural-person shareholder who holds shares, together with those held by the person’s spouse, minor children, or held by the person under others’ names, in an aggregate amount of one
percent or more of the total number of issued shares of the company or ranks as one of its top ten shareholders;
4. Not a spouse, relative within the second degree of kinship, or lineal relative within the third degree of kinship, of any of the above persons in the preceding three subparagraphs;
5. Not a director, supervisor, or employee of a corporate/institutional shareholder that directly holds five percent or more of the total number of issued shares of the company or ranks as of its top
five shareholders;
6. Not a director, supervisor, officer, or shareholder holding five percent or more of the shares of a specified company or institution that has a financial or business relationship with the company;
7. Not a professional individual who, or an owner, partner, director, supervisor, or officer of a sole proprietorship, partnership, company, or institution that, provides commercial, legal, financial,
accounting services or consultation to the company or to any affiliate of the company, or a spouse thereof;
8. Not been a person of any conditions defined in Article 30 of the Company Law.
Note 2: Professor Gregory C. Chow’s tenure expired on June 9, 2015 because he was not re-elected at the 2015 Annual Shareholders’ Meeting.
Note 3: Mr. Michael R. Splinter was elected as TSMC’s independent director at the 2015 Annual Shareholders’ Meeting on June 9, 2015.
3.2.3 Director and Committees Members’ Attendance
Each Director is expected to attend every Board meeting and the committees meeting on which he or she serves. In 2015, the
average Board Meeting attendance rate was 85% and the attendance rate for the Audit Committee and Compensation Committee’s
Meetings were 85% and 100% respectively.
032
033
Board of Directors Meeting Status
Dr. Morris Chang, the Chairman of the Board of Directors, convened four regular meetings and two special meetings in 2015. The
directors’ attendance status is as follows.
Compensation Committee Meeting Status
Mr. Stan Shih, Chairman of the Compensation Committee, convened four regular meetings in 2015. The Committee members’
attendance status is as follows:
Title
Chairman
Vice Chairman
Director
Name
Morris Chang
F.C. Tseng
National Development Fund, Executive Yuan
Representative: Johnsee Lee
Independent Director
Sir Peter Leahy Bonfield
Independent Director
Stan Shih
Independent Director
Thomas J. Engibous
Independent Director
Gregory C. Chow
Independent Director
Kok-Choo Chen
Independent Director
Michael R. Splinter
Attendance
in Person
By Proxy
Attendance Rate
in Person (%)
Notes
6
6
6
4
6
4
1
6
3
-
-
-
2
-
2
1
-
-
100%
Renewal of office (Note)
100%
Renewal of office (Note)
100%
Renewal of office (Note)
67%
Renewal of office (Note)
Sir Peter Bonfield participated in the
discussion through telephone at
01/09 and 04/24 Special Meetings,
represented by proxy.
100%
Renewal of office (Note)
67%
33%
Renewal of office (Note)
Term expired (Professor Chow’s tenure
expired on June 8, 2015 because he
was not re-elected at the 2015 Annual
Shareholders’ Meeting)
100%
Renewal of office (Note)
100%
New office assumed (Note)
Annotations:
1. There were no written or otherwise recorded resolutions on which an independent director had a dissenting opinion or qualified opinion in 2015.
2. Recusals of Directors due to conflicts of interests in 2015: Directors recused themselves from the discussion and voting of their compensation resolution.
3. Measures taken to strengthen the functionality of the Board:
－Five of the eight Directors are Independent Directors. The number of Independent Directors is more than 50% of the total number of Directors.
－The Chairman and Vice Chairman of the Board of Directors are not executive officers of the Company.
－TSMC Board delegates various responsibilities and authority to two Board Committees, Audit Committee and Compensation Committee. Both the two Committees consist solely of the five Independent
Directors. Each Committee’s chairperson regularly reports to the Board on the activities and actions of the relevant committee.
Note: TSMC’s 13th Board of Directors was elected at TSMC’s Annual Shareholders’ Meeting on June 9, 2015. Their respective tenures are from June 9 2015 to June 8, 2018.
Audit Committee Meeting Status
Sir Peter Bonfield, Chairman of the Audit Committee, convened four regular meetings and one special meeting in 2015. The
Committee members and consultant’s attendance status is shown in the following table. In addition to these meetings, the
Committee members and consultant participated in five telephone conferences to discuss the Company’s Annual Report to be filed
with the Taiwan and U.S. authorities and investor conference materials with management.
Title
Chair
Member
Member
Member
Member
Member
Financial Expert
Name
Sir Peter Leahy Bonfield
Stan Shih
Thomas J. Engibous
Gregory C. Chow
Kok-Choo Chen
Michael R. Splinter
J.C. Lobbezoo
Attendance
in Person
By Proxy
Attendance Rate
in Person (%)
Notes
4
5
4
1
5
3
4
1
-
1
-
-
-
-
80%
Renewal of office (Note)
Sir Peter Bonfield participated in the
discussion through telephone at 01/09
Special Meeting, represented by proxy.
100%
Renewal of office (Note)
80%
50%
Renewal of office (Note)
Term expired (Note)
100%
Renewal of office (Note)
100%
New office assumed (Note)
100%
Mr. Lobbezoo did not have to attend
01/09 Special Meeting.
Annotations:
1. There was no Securities and Exchange Act §14-5 resolution which was not approved by the Audit Committee but was approved by two thirds or more of all directors in 2015.
2. There were no recusals of independent directors due to conflicts of interests in 2015.
3. Descriptions of the communications between the independent directors, the internal auditors, and the independent auditors in 2015 (e.g. the channels, items and/or results of the audits on the corporate finance
and/or operations, etc.):
(1) The internal auditors have sent the audit reports to the members of the Audit Committee periodically, and presented the findings of all audit reports in the quarterly meetings of the Audit Committee.
The head of Internal Audit will immediately report to the members of the Audit Committee any material matters. During 2015, the head of Internal Audit did not report any such material matters. The
communication channel between the Audit Committee and the internal auditor functioned well.
(2) The Company’s independent auditors have presented the findings of their quarterly review or audits on the Company’s financial results. Under applicable laws and regulations, the independent auditors are
also required to immediately communicate to the Audit Committee any material matters that they have discovered. During 2015, the Company’s independent auditors did not report any irregularity. The
communication channel between the Audit Committee and the independent auditors functioned well.
Title
Chair
Member
Member
Member
Member
Member
Name
Stan Shih
Sir Peter Leahy Bonfield
Thomas J. Engibous
Gregory C. Chow
Kok-Choo Chen
Michael R. Splinter
Attendance
in Person
By Proxy
Attendance Rate
in Person (%)
Notes
4
4
4
1
4
3
-
-
-
-
-
-
100%
Renewal of office (Note)
100%
Renewal of office (Note)
100%
Renewal of office (Note)
100%
Term expired (Note)
100%
Renewal of office (Note)
100%
New office assumed (Note)
Annotation:
1. There was no recommendation of the Compensation Committee which was not adopted or was modified by the Board of Directors in 2015.
2. There were no written or otherwise recorded resolutions on which a member of the Compensation Committee had a dissenting opinion or qualified opinion.
Note: At the meeting of June 9, 2015, TSMC’s Board of Directors approved the appointment of all five independent directors, Stan Shih, Sir Peter Leahy Bonfield, Thomas J. Engibous, Kok-Choo Chen and
Michael R. Splinter, as members of the Compensation Committee. Their respective tenures are from June 9, 2015 to June 8, 2018.
3.3 Major Decisions of Shareholders’ Meeting and Board Meetings
3.3.1 Major Resolutions of Shareholders’ Meeting and Implementation Status
TSMC’s 2015 Annual Shareholders’ Meeting was held in Hsinchu, Taiwan on June 9, 2015. At the meeting, shareholders present in
person or by proxy approved the following resolutions:
(1) The 2014 Business Report and Financial Statements;
(2) The distribution of 2014 profits;
(3) Election of eight directors (including five independent directors).
Implementation Status
All the resolutions of the Shareholders’ Meeting have been fully implemented in accordance with the resolutions.
The eight newly elected directors were Morris Chang, F.C. Tseng, Sir Peter Leahy Bonfield (Independent Director), Stan Shih
(Independent Director), Thomas J. Engibous (Independent Director), Kok-Choo Chen (Independent Director), Michael R. Splinter
(Independent Director) and Johnsee Lee (representative of National Development Fund, Executive Yuan).
3.3.2 Major Resolutions of Board Meetings
During the 2015 calendar year, and as of the date of this Annual Report, major resolutions approved at Board meetings are
summarized below:
(1) Special Board Meeting of January 9, 2015:
● approving the sale of all shares (i.e. 565.5 million common shares) of TSMC Solid State Lighting Ltd. at a price of NT$825
million (equivalent to NT$1.46 per share) to Epistar Corporation.
(2) Regular Board Meeting of February 9 & 10, 2015:
● approving 2014 business report and financial statements;
● approving distribution of 2014 profits, and cash dividends, employee cash bonus and employee profit sharing;
● approving capital appropriations of US$2,003.70 million (including: 1. installation of advanced and mainstream technology
capacity; 2. installation of specialty technology capacity; 3. conversion of certain logic capacity to specialty technologies; 4.
capacity installation and conversion for advanced packaging and assembly; 5. second quarter 2015 R&D capital investments
and sustaining capital expenditures); and
● convening the 2015 Annual Shareholders’ Meeting.
(3) Special Board Meeting of April 24, 2015:
● listing eight qualified candidates for directors (including five independent directors) to stand for election at TSMC’s 2015
Note: Sir Peter Leahy Bonfield, Stan Shih, Thomas J. Engibous, Kok-Choo Chen and Michael R. Splinter were elected as TSMC’s independent directors and became members of the Audit Committee on
June 9, 2015. Their respected tenures are from June 9, 2015 to June 8, 2018.
Annual Shareholders’ Meeting.
034
035
(4) Regular Board Meeting of June 9 & 10, 2015:
(7) Board Meeting of February 1 & 2, 2016:
3.4 Taiwan Corporate Governance Implementation as Required by Taiwan Financial Supervisory
● re-election of Dr. Morris Chang as the Chairman and Dr.
F.C. Tseng as the Vice Chairman of the Board of Directors;
● approving 2015 business report and financial statements;
● approving distribution of 2015 profits, and cash
● approving to sell 5% common shares of Vanguard
International Semiconductor Corporation;
● approving capital appropriation of US$1,452.15 million
(including: 1. installation of advanced and specialty
technology capacity; 2. conversion of certain logic capacity
to specialty technologies; 3. third quarter 2015 R&D
capital investments and sustaining capital expenditures);
and
dividends, employee cash bonus and employee profit
sharing;
● approving the establishment of a wholly owned subsidiary
in Nanjing of China with capital injection not exceeding
US$1 billion, subject to approval from the Investment
Commission of Taiwan’s Ministry of Economic Affairs, to
set up a 12-inch fab and a design service center with a
total capital investment not to exceed US$3 billion;
● approving the capital injection of not more than
● approving capital appropriations of US$2,536.9 million
US$2 billion to TSMC Global Ltd., a wholly-owned BVI
subsidiary, for the purpose of reducting foreign exchange
hedging costs.
(including: 1. installation of advanced technology capacity;
2. second quarter 2016 R&D capital investments and
sustaining capital expenditures);
(5) Regular Board Meeting of August 10 & 11, 2015:
● approving the capital injection of not more than
US$2 billion to TSMC Global Ltd., a wholly-owned BVI
subsidiary, for the purpose of reducing foreign exchange
hedging costs; and
● convening the 2016 Annual Shareholders’ Meeting.
3.3.3 Major Issues of Record or Written Statements
Made by Any Director Dissenting to Important
Resolutions Passed by the Board of Directors
during the 2015 Calendar Year and as of the Date
of this Annual Report: None.
● approving capital appropriations of US$1,236.9 million
(including: 1. capacity expansion of advanced technology
and packaging and assembly; 2. conversion of certain
logic capacity to specialty technologies; 3. fourth quarter
2015 R&D capital investments and sustaining capital
expenditures); and
● approving acquisition of OmniVision Technologies, Inc.’s
(OVT’s) 49.1% ownership in VisEra Holding Cayman, Ltd.,
and 100% ownership in Taiwan OmniVision Invetment
Holding Co. Inc. (OVT Taiwan), at an amount not
more than US$126 million. The acquisition of shares is
conditional on related governments (including the United
States) approving a Chinese consortium’s acquisition of
OVT.
(6) Regular Board Meeting of November 9 & 10, 2015:
● approving capital appropriations of US$3,963.3 million
(including: 1. capacity expansion of advanced technology
and packaging and assembly; 2. construction of fab
facilities and installation of facility systems; 3. first quarter
2016 R&D capital investments and sustaining capital
expenditures); and
● approving the promotion of Dr. Y.L. Wang as Vice
President.
Commission
Assessment Item
1. Does Company follow “Taiwan Corporate Governance Implementation” to
establish and disclose its corporate governance practices?
Yes
No
V
2. Shareholding Structure & Shareholders’ Rights
(1) Does Company have Internal Operation Procedures for handling
shareholders’ suggestions, concerns, disputes and litigation matters. If
yes, has these procedures been implemented accordingly?
(2) Does Company possess a list of major shareholders and beneficial owners
of these major shareholders?
(3) Has the Company built and executed a risk management system and
“firewall” between the Company and its affiliates?
(4) Has the Company established internal rules prohibiting insider trading on
undisclosed information?
V
V
V
V
3. Composition and Responsibilities of the Board of Directors
(1) Has the Company established a diversification policy for the composition
V
of its Board of Directors and has it been implemented accordingly?
(2) Other than the Compensation Committee and the Audit Committee
which are required by law, does the Company plan to set up other Board
committees?
(3) Has the Company established methodology for evaluating the
performance of its Board of Directors, on an annual basis?
(4) Does the Company regularly evaluate its external auditors’ independence?
4. Has the Company established a means of communicating with its
Stakeholders or created a Stakeholders Section on its Company website?
Does the Company respond to stakeholders’ questions on corporate
responsibilities?
5. Has the Company appointed a professional registrar for its Shareholders’
Meetings?
6. Information Disclosure
(1) Has the Company established a corporate website to disclose information
regarding its financials, business and corporate governance status?
(2) Does the Company use other information disclosure channels (e.g.
maintaining an English-language website, designating staff to handle
information collection and disclosure, appointing spokespersons,
webcasting investors conference etc.)?
V
V
V
V
V
V
V
Non-
implementation
and Its Reason(s)
Same as explanation
None
None
Implementation Status
Explanation
TSMC has always followed excellent corporate governance practices, provided
the utmost in operational transparency and safeguarded shareholders’ equity.
Although the Company does not have a formal code of practice for corporate
governance, however TSMC has always been highly regarded as the industry leader
in implementing comprehensive corporate governance practices. In addition, the
Company also has a world-class Board of Directors. The Company believes that
corporate governance is based on integrity. TSMC has been proving its excellent
corporate governance in its operating performance and continued winning of
domestic and international awards on best corporate governance company.
(1) TSMC has designated appropriate departments, such as Corporate
Communication Division, the SEC Compliance Department, Legal Department,
etc., to handle shareholder suggestions, concerns, disputes or litigation matters.
(2) TSMC tracks the shareholdings of directors, officers, and shareholders holding
more than 10% of the outstanding shares of TSMC.
(3) TSMC has set up internal rules in the Company’s Internal Control System and
Affiliated Corporations Management.
(4) TSMC has established its “Insider Trading policy” that applies to all employees,
officers and members of the Board of Directors of the Company and to any
other person having a duty of trust or confidence, with respect to transactions
in the Company’s securities. This policy prohibits any insider trading and the
Company regularly provides internal training on this issue.
(1) The members of TSMC Board of Directors are nominated via a rigorous selection
process. It not only considers professional competence, but also attaches great
importance to his/her personal reputation on ethics and leadership. Presently,
the Company’s Board of Directors consists of eight members who possesses
world-class managerial and/or academic experiences. We rely on each directors’
knowledge, personal insight and business judgment. One female director
currently sits on the Board of Director, and a majority of our Board consists of
independent directors.
(2) All important resolutions are decided by the Board of Directors of the Company.
TSMC founded its audit committee and compensation committee in 2002 and
2003 respectively, and the members of these committees are all independent
directors. In addition, the Company has a Corporate Social Responsibility
Committee which is formed by the Company’s management team and it reports
to the Board of Directors.
(3) As TSMC’s corporate governance concept, the Board of Director’s primary
responsibility is to supervise, provide guidance and evaluate the management’s
performance and to dismiss officers of the Company when necessary. TSMC’s
Board of Directors consists of distinguished members with a great breadth of
experience as world-class business leaders or scholars and adhere high ethical
standards and commitment to the Company. Each quarter’s Board Meeting
is last for two days. Company’s resolutions are determined in board meeting,
also business strategy and future orientation are discussed in the meeting,
in order to create best interest for shareholders. Based on TSMC’s operating
performance and local/international awards of best corporate governance, it
certainly proves the Company’s excellent performance of Board of Directors.
Also, TSMC’s audit committee performs self evaluation and discusses future
issues of concern by questionnaire on annual basis.
(4) The Audit Committee annually evaluates the independence of external auditors
and reports the same to the Board of Directors.
Depending on the situation, the Company’s Corporate Communication Division
and SEC Compliance department will communicate with stakeholders. We also
have publicly disclosed the contact information of our corporate spokesperson
and relevant departments. Also, we have a stakeholder section on our corporate
website to address our corporate social responsibilities and any other issues.
None
We have appointed China Trust as our registrar for our Shareholders’ Meetings.
None
(1) TSMC discloses its financials, business and corporate governance status on its
None
website at http://www.tsmc.com (in Chinese and English).
TSMC’s American Depositary Receipt (ADR) is listed on the New York Stock
Exchange (NYSE). As a foreign issuer, TSMC must comply with NYSE’s rules. We
have been operating in accordance with NYSE listing standards, and have been
disclosing the major differences between our corporate governance practices
and U.S. corporate governance practices. Please see http://www.tsmc.com/
download/english/e03_governance/NYSE_Section_303A.pdf
(2) TSMC has designated appropriate departments (e.g. the Corporate
None
Communication Division, the SEC Compliance Department, etc.) to handle the
collection and disclosure of information as required by the relevant laws and
regulations of Taiwan and other jurisdictions.
TSMC has designated spokespersons as required by relevant regulations.
TSMC webcasts live investor conferences.
036
(Continued)
037
Assessment Item
7. Has the Company disclosed other information to facilitate a better
understanding of its corporate governance practices (e.g. including but
not limited to employee rights, employee wellness, investor relations,
supplier relations, rights of stakeholders, directors’ training records, the
implementation of risk management policies and risk evaluation measures,
the implementation of customer relations policies, and purchasing insurance
for directors)?
Yes
V
Implementation Status
No
Explanation
Non-
implementation
and Its Reason(s)
(1) For employee rights and employee wellness, please refer to “5.5 Employees” on
None
page 75-79 of this Annual Report.
(2) For investor relations, supplier relations and rights of stakeholders, please refer
to “7. Corporate Social Responsibility” on page 106-125 of this Annual Report.
(3) For Directors’ training records, please refer to page 38 of this Annual Report.
(4) For Risk Management Policies and Risk Evaluation, please refer to “6.3 Risk
Management” on page 95-105 of this Annual Report.
(5) For Customer Relations Policies, please refer to “5.4 Customer Trust” on page
73-74 of this Annual Report.
(6) TSMC maintains D&O Insurance for its directors and officers.
8. Does the Company perform any self evaluations on its corporate governance
practices or appointed any third party to do so? (If yes, please disclose the
Board of Director’s view on the results of such evaluation).
V
In January 2015, we conducted the self-evaluation through the corporate
governance evaluation system which was developed by the TWSE Corporate
Governance Center and was ranked top 5% companies.
None
In addition, TSMC received recognitions for achievements in innovation,
business information disclosure, sustainability, investor relations and overall
excellence in management from organizations including Barron’s, FinanceAsia,
Fortune Magazine, Institutional Investor, IR Magazine, GlobalViews Magazine,
CommonWealth Magazine, RobecoSAM and the Taiwan Stock Exchange. The
IEEE Spectrum Magazine gave TSMC the highest score in its 2015 Patent Power
Scorecard in the semiconductor manufacturing sector. For the third consecutive
year, TSMC was named Semiconductor and Semiconductor Equipment Industry
Group Leader by the Dow Jones Sustainability Indices.
Continuing Education/Training of Directors in 2015
Date
05/30
06/05
10/17
05/08
06/17
01/13
03/23
04/13
05/08
08/13
08/14
Host by
National Taiwan University
Bank of Taiwan
Training/Speech Title
Speech: Thoughts on Innovation in Higher Education
Speech: World’s Semiconductor Industry Status and Outlook (Executives Lecture)
EMBA, National Taiwan University
Speech: My Management Experience and Philosophy
Securities and Futures Institute
Practices on how to conduct effective social responsibility reporting
Taiwan Corporate Governance Association
Long-term incentive compensation application trends and design considerations
Cloud Services Measurement Initiative Consortium (CSMIC)
Speech: The New Economics under the Moving Wave
Yuanta Securities Co., Ltd.
China Productivity Center
Securities Regulations Learning
Speech: Wangdao Management Philosophy
Wangdao Management Philosophy Forum
Speech: Wangdao and Competition
Taiwan Corporate Governance Association
The Game Theory of Reborn of Taiwan Enterprises
Economic Development Bureau, Tainan City Government
Monte Jade Science and Technology Association of Taiwan
2015 Global Green Business Opportunities and Trends Seminar
08/27
Securities and Futures Institute
Forum for Directors of Public Companies – Corporate Integrity Risk Control and
Social Responsibility New World Forum
Duration
1 hour
1 hour
1 hour
3 hours
3 hours
2 hours
3 hours
1 hour
3.5 hours
3 hours
4 hours
3 hours
12/02
08/11
Asian Venture Capital Journal (AVCJ)
Private Equity and Venture Capital Forum – Taiwan 2015
TSMC
“The Outlook for Taiwan’s 2016 Presidential and Legislative Elections”
by Dr. Chi SU, Chairman of Taipei Forum
8 hours 45 min
1 hour
Name
Morris Chang (Note)
F.C. Tseng
Stan Shih (Note)
Johnsee Lee
Morris Chang
F. C. Tseng
Sir Peter Leahy Bonfield
Stan Shih
Thomas J. Engibous
Kok-Choo Chen
Michael R. Splinter
Johnsee Lee
1. From time to time, TSMC provides directors with information concerning regulatory requirements and developments as related to directors’ activities. TSMC management also regularly presents updates on the
Company’s business and other information to directors.
2. Regular regulatory update reports are provided by TSMC’s General Counsel and by the Company’s independent auditors at the Audit Committee meetings such as:
- Conflict-free Minerals
- U.S. SEC Rules update
Note: Selected speeches on corporate governance and related topics.
Continuing Education/Training of Management in 2015
Name/Title
Lora Ho
Senior Vice President,
Chief Financial Officer
and Spokesperson
Sylvia Fang
Vice President and
General Counsel
Date
05/08
08/06
08/07
05/29
06/15
09/23
11/27
11/30
11/06
12/09
Jessica Chou
Director, Accounting
Division
John Liang
Director, Internal Audit
Division
Host by
Training
Securities and Futures Institute
How Corporations conduct better social responsibility and reporting practices
Taiwan Corporate Governance Association
Directors and Supervisors’ Civil and Criminal Responsibilities and Case Studies
Securities and Futures Institute
Legal Liability of Directors and Supervisors arising in Mergers and Acquisitions
Nationla Chung Hsing University
Legal Challenges and Uncertainties Facing A Global High-tech Company
CAIL Systems Inc.
09/04
Lee and Li, Attorneys at Law
Intellectual Property Office and State Intellectual
Property Office of P.R.C
Data Privacy & Data Security: What is most likely to bring a company’s business to
a halt
Symposia for the 50th Anniversary
- Opportunities and Challenges for Corporate Mergers in the Era of Globalization
2015 Patent Cross-Strait Forum
Patent Litigation Strategies and Management Forum
- Experience sharing: Strategies and Management of TSMC’s Transnational Patent
Portfolios and US Patent litigations
Accounting Research and Development Foundation
The annual professional development training for principal accounting officer
Accounting Research and Development Foundation
Auditing and Case Study on Regulation Management
The Institute of Internal Auditors
Case Sharing of Procurement Auditing
Duration
3 hours
3 hours
3 hours
2 hours
16 hours
2 hours
3 hours
6 hours
6 hours
6 hours
6 hours
In addition, various training programs and speech presentations were also provided by TSMC’s Legal Organization for Management
and the relevant divisions, such as:
● Anti-bribery/corruption
● Antitrust (unfair competition)
● Environmental, Safety and Health (ESH)
● Insider Trading
● Intellectual Property Protection
● Privacy Protection
● Export Control Enhancement
3.5 Code of Ethics and Business Conduct
Ethics at TSMC
Code of Conduct: Integrity is the most important core value of TSMC’s culture. TSMC is committed to acting ethically in all aspects
of our business; constantly and vigilantly promoting integrity, honesty, fairness, accuracy, and transparency in all that we say and
do. At the heart of our corporate governance culture is TSMC’s Code of Ethics and Business Conduct (the “Code”) that applies to
TSMC and its subsidiaries. The Code requires that each employee bears a heavy personal responsibility to preserve and to protect
TSMC’s ethical values and reputation and to comply with various applicable laws and regulations.
Major Ethics Code Obligations
● Do not advance personal interests at the expense of, or in conflict with the Company;
● Refrain from corruption, unfair competition, fraud, and waste or abuse of corporate assets;
● Avoid any efforts improperly to influence the decisions of anyone, including government officials, agencies, and courts, as well as
our customers, suppliers, and vendors.
● Do not undertake any practices detrimental to TSMC, the environment and to society;
● Procure all of our raw materials from socially responsible sources;
● Protect proprietary information of TSMC and our customers; and
● Abide by both the letter and spirit of all applicable laws, rules and regulations.
Intellectual Property Protection: In order to build and sustain an environment of innovation, technology leadership, and sustainable
profitable growth, the Code requires that we promote business relationships founded upon an unwavering respect for the
intellectual property rights, proprietary information and trade secrets of TSMC, our customers, and others.
Public Disclosures: TSMC’s officers, especially our CEO, CFO, and General Counsel, with oversight from our Board, are responsible
for the full, fair, accurate, timely, and understandable financial accounting and financial disclosure in reports and documents filed
038
039
by the Company with securities authorities and in all TSMC
public communications and disclosures. TSMC has a variety of
measures in place to ensure compliance with these disclosure
obligations.
Any modification to the Code requires the approval of our
Audit Committee to ensure our ethics compliance program is
independently reviewed against corporate best practices.
Code Implementation
High Standard Ethical Culture: Our ethics program is
implemented in four ways by all of our employees, officers and
Board members. First, TSMC’s management sets the “tone from
the top” by acting in accordance with the Code so that they
may be an example to all stakeholders. Second, working-level
managers are responsible for ensuring their staff’s understanding
of and compliance with applicable rules and regulations. Third,
we encourage an environment of open communications in
discussing any questions related to the Code. Any stakeholder
may consult his or her direct supervisors, Human Resources or
Legal to obtain timely advice. Lastly, TSMC requires all employees
to stay vigilant and report any noncompliance by anyone to
their supervisors, the function head of Human Resources,
the responsible corporate Vice President that oversees the
Ombudsmen system, or to the Chairman of the Company’s
Audit Committee directly and, if desired, anonymously.
Self-Assessment of All Departments and Employees:
Self-assessment of all departments and employees is an
important part of our ethics compliance program. All
departments and subsidiaries of TSMC are required to
conduct Control Self-Assessment (CSA) tests annually to
review employees’ awareness of the Code. The CSA results are
reviewed to track the results of our compliance program. In
addition, all employees must disclose any matters that cause,
or may cause, actual or potential conflict of interest. In addition
to such proactive disclosure requirement, employees with
certain job responsibilities and senior officers must annually
declare any relationships that may constitute a conflict of
interest, which is then reviewed by executive management.
Internal Auditing: The Internal Auditor of TSMC plays a critical
role in ensuring the Company’s compliance with the Code and
relevant rules and regulations. To ensure that our financial,
managerial, and operating information is accurate, reliable,
and timely and that our employee’s actions are in compliance
with applicable policies, standards, procedures, laws and
regulations, our Internal Auditor conducts audits of various
control points within the Company in accordance with its
annual audit plan approved by the Board of Directors and
subsequently reports its audit findings and remedial issues to
the Board and management on a regular basis.
Training and Promotion: To promote awareness to our
employees of their responsibilities under the Code, we publish
our Code and related policies and documents on our intranet
and, provide training courses, posters, and internal news
articles. For incoming employees, we provide an introductory
training course on the Code which is available to all employees
online, as well as advanced courses delving into more specific
individual topics such as anti-corruption, PIP, export control
and insider trading.
In addition to our internal compliance efforts, we expect and
assist our customers, suppliers, business partners, and any
other entities with whom we deal (such as consultant or third
party agents who act for or on behalf of TSMC) to recognize
and understand TSMC’s ethical standards to fulfill our
responsibilities as a corporate citizen. For instance, we require
all of our suppliers, vendors and contractors to declare in
writing that they will not engage in any fraud or any unethical
conduct when dealing with us, our officers, or employees. In
2015, TSMC became a full member of the Electronic Industry
Citizenship Coalition (EICC) which is the largest industry
coalition dedicated to electronics supply chain sustainability.
In addition to adopting the EICC Code of Conduct at all of its
facilities, TSMC applied the EICC’s standards to enhance our
audit program of our suppliers and relevant business partners.
We also provide training and communicate our ethical culture
to our business partners through regular live seminars to
prevent any unethical conduct and detect any sign of Code
violations. We exchange views on appropriate business conduct
and TSMC’s ethical standards with our customers as part of
customer audit programs and other occasions.
Reporting Channels and Whistleblower Protection
To ensure that our conduct meets the highest legal and ethical
standards, TSMC provides multiple channels for reporting
business conduct concerns. First of all, we have implemented the
“Complaint Policy and Procedures for Certain Accounting and
Legal Matters” and “Procedures for Ombudsman System” that
allow employees or any whistleblowers with relevant evidence
to report any financial, legal, or ethical irregularities. To foster an
open culture of ethics compliance, we encourage our employees
and the third parties we do business with to report any
suspected wrongdoing by TSMC or by any parties with whom
we do business.
TSMC treats any complaint and the investigation thereof in a
confidential and sensitive manner, and strictly prohibits any
form of retaliation against any individual who in good faith
reports or helps with the investigation of any complaint.
040
Code Violation Disciplinary Action
We do not tolerate any violation of the Code and treat every possible violation incident seriously. Any violator of the Code (or
relevant regulations) will be severely disciplined to the full extent of our policies and the law, including immediate dismissal,
termination of business relationship, and judicial prosecution as appropriate.
Compliance Activities
Prevention
Detection
Enhancement
- Employee declaration
- Employee education
- Continuing promotion
- Stakeholder promotion/cooperation
- Internal auditor
- Internal/external hotline
- Administrative discipline/legal action
- Monitor and analyze outcomes
- Propose improved procedures
- Implement enhanced management
system
3.5.1 Taiwan Corporate Conduct and Ethics Implementation as Required by the Taiwan Financial Supervisory
Commission
Assessment Item
1. Establishment of Corporate Conduct and Ethics Policy and Implementation
Measures
(1) Does the company have bylaws and publicly available documents
addressing its corporate conduct and ethics policy and measures, and the
commitment regarding implementation of such policy from the Board of
Directors and the management team?
(2) Does the company establish relevant policies which are duly enforced
to prevent unethical conduct and provide implementation procedures,
guidelines, consequence of violation and complaint procedures in such
policies?
(3) Does the company establish appropriate compliance measures for the
business activities prescribed in paragraph 2, article 7 of the Ethical
Corporate Management Best Practice Principles for TWSE/GTSM Listed
Companies and any other such activities associated with high risk of
unethical conduct?
Yes
No
Summary
Implementation Status
Non-implementation
and Its Reason(s)
None
V
V
(1) Integrity is the most important core value of TSMC’s culture. TSMC is
committed to acting ethically in all aspects of our business. We have
established TSMC Code of Ethics and Business Conduct (the “Code”) to
require that each employee bears a heavy personal responsibility to uphold
TSMC’s ethics value. For more details on the Code and the measures that
TSMC Board of Directors (the “Board”) and the management team take to
ensure compliance of the Code please refer to TSMC’s Annual Report and the
Corporate Social Responsibility Report.
(2) At the heart of our corporate governance culture is the Code that applies to
TSMC and its subsidiaries, and this Code requires that each employee bears a
heavy personal responsibility to preserve and to protect TSMC’s ethical values
and reputation and to comply with various applicable laws and regulations.
Specific requirements under the Code could be found in our Annual Report.
In addition, to educate and remind our employees of their responsibilities
under the Code, we publish our Code, relevant policies and documents on
our intranet and promote its awareness through training courses, posters,
and internal news articles. Furthermore, to ensure that our conduct meets
the highest legal and ethical standards, TSMC provides multiple channels
for reporting business conduct concerns. Please refer to Assessment Item 3
for details.
We do not tolerate any violation of the Code and treat every possible
violation incident seriously. Any violator of the Code (or relevant regulations)
will be severely punished to the full extent of our policies and the law,
including immediate dismissal in accordance with TSMC Employee
Recognition, Disciplinary and Ombudsman Procedure, termination of business
relationship, and judicial prosecution as appropriate.
V
(3) Under the framework of the Code, TSMC has established policies, guidelines
and procedures in other policy areas, including: Anti- corruption, Anti-
harassment/ discrimination, Antitrust (unfair competition), Environment,
Export Control, Financial Reporting/Internal Controls, Insider Trading,
Intellectual Property, Proprietary Information Protection (“PIP“), Privacy,
Record Retention and Disposal, as well as procuring raw materials from
socially responsible sources (“Conflict-free Minerals“). The above-mentioned
policies are crucial in strengthening overall compliance with the Code.
TSMC, its employees and its subsidiaries and affiliates are expected to
fully understand and comply with all laws and regulations that govern
our businesses. The Internal Auditor of TSMC also plays a critical role in
ensuring the Company’s compliance with the Code and relevant rules
and regulations. To ensure that our financial, managerial, and operating
information is accurate, reliable, and timely and that our employee’s actions
are in compliance with applicable policies, standards, procedures, laws and
regulations, our Internal Auditor conducts audits of various control points
within the Company in accordance with its annual audit plan approved
by the Board of Directors and subsequently reports its audit findings and
remedial issues to the Board and Management on a regular basis.
(Continued)
041
Non-implementation
and Its Reason(s)
None
Assessment Item
Implementation Status
Yes
No
Summary
2. Ethic Management Practice
(1) Does the company assess the ethics records of whom it has business
V
relationship with and include business conduct and ethics related clauses
in the business contracts?
(2) Does the company set up a unit which is dedicated to or tasked with
promoting the company’s ethical standards and reports directly to the
Board of Directors with periodical updates on relevant matters?
(3) Does the company establish policies to prevent conflict of interests, provide
appropriate communication and complaint channels and implement such
policies properly?
(4) To implement relevant policies on ethical conducts, does the company
establish effective accounting and internal control systems that are audited
by internal auditors or CPA periodically?
V
V
V
(1) We expect and assist our customers, suppliers, business partners, and any
other entities with whom we deal (such as consultant or third party agents
who act for or on behalf of TSMC) to understand and act in accordance with
TSMC’s ethical standards. For instance, as for our suppliers, vendors and
contractors, we require all of them to declare in writing that they will not
engage in any fraud or any unethical conduct when dealing with us or our
officers and employees. In addition to periodic audit, we also provide training
and communicate our ethical culture to our business partners through
regular live seminars to prevent any unethical conduct. We exchange views
on business conduct and TSMC’s ethical standards with our customers in
customer audit programs and other proper occasions.
(2) TSMC’s Board of Directors strives to perform the responsibilities of supervising
the corporate conduct and ethics compliance practice through the Audit
Committee and the Compensation Committee, the hiring of a financial
expert for the Audit Committee, and coordination with the Internal Audit
department. In addition, General Counsel, the responsible corporate Vice
President who oversees the Ombudsmen system and Internal Auditors update
the Board ethical standards compliance issues on a regular basis. Moreover,
TSMC’s officers, especially our CEO, CFO, and General Counsel, with oversight
from our Board, are responsible for the full, fair, accurate, timely, and
understandable financial accounting and financial disclosure in reports and
documents filed by the Company with securities authorities and in all TSMC
public communications and disclosures.
(3) TSMC requires newly hired employees to declare any conflict of interest
situation as appropriate. In addition, all employees must disclose any matters
that have, or may have, the appearance of undermining the Code (such as
any actual or potential conflict of interest). Furthermore, key employees and
senior officers must periodically declare their compliance status with the Code
according to relevant procedures.
(4) TSMC continues maintaining the integrity of its financial reporting processes
and controls and establishes appropriate internal control systems for
preventing higher potential unethical conduct, and the Internal Auditors
formulate annual audit plans based on the results of the risk assessment and
subsequently reports its audit findings and remedial issues to the Board and
Management on a regular basis. In addition, all departments and subsidiaries
of TSMC are also required to conduct Control Self-Assessment (CSA) tests
annually to review the effectiveness of the internal control system.
(5) Does the company provide internal and external ethical conduct training
V
(5) Training is a major component of our compliance program, conducted
programs on a regular basis?
3. Implementation of Complaint Procedures
(1) Does the company establish specific complaint and reward procedures, set
up conveniently accessible complaint channels, and designate responsible
individuals to handle the complaint received?
(2) Does the company establish standard operation procedures for
investigating the complaints received and ensuring such complaints are
handled in a confidential manner?
(3) Does the company adopt proper measures to prevent a complainant from
retaliation for his/her filing a complaint?
4. Information Disclosure
Does the company disclose its guidelines on business ethics as well as
information about implementation of such guidelines on its website and
Market Observation Post System (“MOPS”)?
throughout the year to refresh TSMC’s employees’ commitment to ethical
conduct, and to get updated information on laws and regulations related
to their daily operations. As for our suppliers, vendors and contractors, we
communicate our ethical culture to our business partners through regular
live seminars to ensure their fully understanding of our commit to ethical
conduct.
(1) TSMC has implemented the “Complaint Policy and Procedures for Certain
Accounting and Legal Matters“ and “Procedures for Ombudsman System“
that allow employees or any whistleblowers with relevant evidence to
report any financial, legal, or ethical irregularities. TSMC also requires all
employees to stay vigilant and whistle-blow any noncompliance by anyone
to their supervisors, the function head of Human Resources, the responsible
corporate Vice President that oversees the Ombudsmen system, or to the
Chairman of the Company’s Audit Committee directly and anonymously. In
particular, the Ombudsmen system is open to external parties such as our
vendors and subcontractors.
(2) TSMC treats any complaint and the investigation thereof in a confidential and
sensitive manner, and such manner is clearly stated in our bylaws.
(3) TSMC strictly prohibits any form of retaliation against any individual who in
good faith reports or helps with the investigation of any complaint, and such
requirement is clearly stated in our bylaws.
Our internal website provides guidelines and informative articles on ethics
and honorable business conduct (in both Chinese and English) for employees’
easy access. In addition, TSMC discloses relevant policies and information in its
Annual Report (which is also available at the MOPS) and CSR Report (available at:
http://www.tsmc.com)
None
None
V
V
V
V
5. If the company has established corporate governance policies based on TSE Corporate Conduct and Ethics Best Practice Principles, please describe any discrepancy between the policies and their implementation.
TSMC has established the Code to require that all employees, officers and board members comply with the Code and the other policies and procedures. There is no discrepancy between the Code, including its
affiliate policies and procedures, and its implementation. For more details, please refer to “3.5 Code of Ethics and Business Conduct” on page 39-42 of this Annual Report.
6. Other important information to facilitate better understanding of the company’s corporate conduct and ethics compliance practices (e.g., review the company’s corporate conduct and ethics policy).
For details on the implementation of TSMC’s Corporate Conduct and Ethics, please refer to “3.5 Code of Ethics and Business Conduct” on page 39-42 of this Annual Report.
042
3.6 Regulatory Compliance
TSMC’s robust compliance efforts are comprised of legislation monitoring, developing and implementation of effective compliance
policies and programs, training, and maintaining an open reporting environment.
Legislative Monitoring
TSMC operates in many countries. To comply with governing legislation, applicable laws, regulations and regulatory expectations,
we closely monitor domestic and foreign government policies and regulatory developments that could materially impact TSMC’s
business and financial operations. Our Legal organization periodically updates our relevant internal departments, management and
the Audit Committee of applicable regulatory changes so that internal teams ensure compliance with new regulatory requirements
in a timely manner. We are a proactive advocate for local legislative and regulatory reform. For example, we achieved remarkable
results in strengthening trade secret protection in Taiwan, and generally our comments and recommendations on legal reforms to
the government have been accepted constructively. TSMC is increasingly dedicated to identifying potential regulatory issues and will
continue to be involved in advocating public policy changes that foster a positive and fair business environment.
Policy and Compliance Program Development and Implementation
Under the framework of the Code, TSMC has established policies, guidelines and procedures in different compliance areas,
including: Anti-corruption, Anti-harassment/discrimination, Employment Regulations, Antitrust (unfair competition), Environment,
Export Control, Financial Reporting, Internal Controls, Insider Trading, Intellectual Property, Proprietary Information Protection
(“PIP”), Privacy, Record Retention and Disposal, as well as procuring raw materials from socially responsible sources (“Conflict-free
Minerals”). It is our belief that these policies are crucial in strengthening overall compliance with the Code and compliance
programs. TSMC, its employees and its subsidiaries and affiliates are expected to fully understand and comply with all laws and
regulations that govern our businesses and make ethical decisions in every circumstance.
Compliance Awareness Training
Training is a major component of our regulatory compliance program, conducted throughout the year to refresh TSMC’s employees’
commitment to ethical conduct, and to get updated information on laws and regulations related to their daily operations.
Highlights of our training include:
● Posters at our facilities, and news articles, compliance guidelines and tips which our employees can access through our intranet;
● Live seminars focusing on specific topics such as Anti-Corruption (this was the highlight of our compliance training activities for
2015, as described in Section 3.3.1 below), PIP, Intellectual Property, Personal Data Protection, Conflict Minerals Compliance and
Export Control Management. Training is made mandatory for those employees whose jobs are especially relevant to a particular
topic to ensure sufficient awareness of relevant laws and internal policies;
● On-line learning programs updated frequently to provide most up-to-date information and timely and flexible access for
employees to understand the law and key compliance issues, covering topics of Antitrust, Anti-harassment, Insider Trading, Export
Control Management, PIP, and Privacy Protection among others;
● External training, in Taiwan and abroad, for TSMC’s legal team to receive current developments of new laws and regulations, and
for its lawyers to comply with applicable continuing legal education requirements. External experts are also invited to give in-house
lectures on key issues.
Reporting Channel
As mentioned above, TSMC provides an open reporting channel for employees and external parties such as our customer, vendors
and subcontractors through its Ombudsman. Below is a summary of the Number of Reported Incidents:
FY 2014
FY 2015
Incidents submitted to the Ombudsman System (Note)
Incidents submitted to the Audit Committee Whistleblower System
Incidents reported to the “hotline”
which were treated as plausible
Sexual Harassment Investigation Committee
which were found after investigations
Note: There were no incidents related to ethics, finance or accounting matters in 2014 or 2015.
39
-
22
-
4
4
60
-
16
-
7
7
043
Major Accomplishments
In 2015, TSMC achieved several major accomplishments in
regulatory compliance:
● Public Promotion Activities: In addition to rigorously fulfilling
our obligations on regulatory compliance matters, TSMC
exercised its civic duties as a responsible corporate citizen
by advising the local government on law and policy reform,
including urging the Government to amend certain outdated
laws and regulations, which we believe were inconsistent
with global practice, to improve Taiwan’s investment
environment and economic development. For example, since
Taiwan legislature’s acceptance of TSMC’s advice to impose
criminal liability for trade secret misappropriation in 2012,
TSMC continues to be an advocate of trade secret protection,
and hosted multiple events to raise the event participants’
awareness of this topic that is critical to innovation and fair
competition.
● Internal Training: Throughout 2015, TSMC offered a wide
range of training courses on various compliance topics,
including 12 on-line training courses, and 37 topics covered
via live seminars. These courses were all developed and
conducted by compliance experts and legal professionals.
● Anti-Corruption Program Enhancement: To provide more
specific behavioral guidance to our employees, TSMC
implemented new Anti-corruption Rules based on the
anti-corruption provisions in the Code, and initiated a series
of awareness activities to ensure our employees’ compliance
with the requirements. Being the most interactive way of
communication, the Legal organization provided a series
of face-to-face training sessions to over 6,000 employees
from different internal organizations. Employees who could
not join the in-person training participated through the
on-line training program. Overall, around 25,000 employees
(including those of our subsidiaries) received the training and
gained a deeper understanding on this critical topic. Looking
ahead into 2016, it is our objective to continuously provide
compliance training that includes the topic of anti-corruption,
among others, to this same group of the employees. We
also plan to conduct face-to-face communications with our
manager-level employees to promote awareness of and
ensure compliance with TSMC’s business conduct standards
when interacting with third parties.
● Conflict-Free Supply Chain: As a recognized global leader in
the electronics industry supply chain, we acknowledge our
corporate social responsibility to strive to procure conflict
free minerals in an effort to recognize humanitarian and
ethical social principles that protect the dignity of all persons
and have implemented a series of compliance safeguards.
In 2015, TSMC has been making continued progress to
ensure a conflict-free supply chain. Its conflict-free minerals
compliance has also been highly ranked by independent third
party rating agencies.
● Export Compliance: In order to prevent any unauthorized
export of controlled items by TSMC or any of its subsidiaries,
a formal policy and export management system (EMS)
existed for a number of years is continuously maintained to
ensure compliance with all applicable regulations covering
the export of information, technologies, products, materials
and equipment. TSMC’s EMS allows TSMC to streamline
its complicated SHTC (Strategic High-Tech Commodities)
export process and creates efficiency for both TSMC and its
customers. TSMC’s EMS was certified in September 2012
by the Bureau of Foreign Trade, the Taiwan regulator, as a
qualified ICP (Internal Control Program) exporter. Because
of its successful implementation, TSMC has also frequently
earned recognition as “best in class” and was asked to share
our experience on EMS implementation to third parties that
included a variety of domestic and foreign organizations and
industry peers.
● Privacy: TSMC on behalf of itself and its subsidiaries adopted
a privacy and personal data protection policy to meet
global standards for handling personal data in compliance
with relevant legislations respecting personal privacy in the
workplace. A variety of promotion events were provided
throughout 2015, including live, in-person seminars and
online training programs, as well as the publication of
educational materials such as a set of FAQs on TSMC
intranet for employees’ easy access. All Human Resources
staff received proper training as well. Flyers and eBanners
posted throughout our facilities and through our intranet
also successfully raised employees’ awareness on this topic.
Through our dedication, we are fostering a culture whereby
an individual’s personal data and privacy are protected and
handled in line with global standards.
3.7 Internal Control System Execution Status
Taiwan Semiconductor Manufacturing Company Limited
Statement of Internal Control System
Date: February 2, 2016
Based on the findings of a self-assessment, Taiwan Semiconductor Manufacturing Company Limited (TSMC) states the following
with regard to its internal control system during the year 2015:
1. TSMC’s Board of Directors and Management are responsible for establishing, implementing, and maintaining an adequate
internal control system. Our internal control is a process designed to provide reasonable assurance over the effectiveness and
efficiency of our operations (including profitability, performance, and safeguarding of assets), reliability, timeliness, transparency
of our reporting, and compliance with applicable rulings, laws and regulations.
2. An internal control system has inherent limitations. No matter how perfectly designed, an effective internal control system can
provide only reasonable assurance of accomplishing its stated objectives. Moreover, the effectiveness of an internal control system
may be subject to changes due to extenuating circumstances beyond our control. Nevertheless, our internal control system
contains self-monitoring mechanisms, and TSMC takes immediate remedial actions in response to any identified deficiencies.
3. TSMC evaluates the design and operating effectiveness of its internal control system based on the criteria provided in the
Regulations Governing the Establishment of Internal Control Systems by Public Companies (herein below, the “Regulations”). The
criteria adopted by the Regulations identify five key components of managerial internal control: (1) control environment, (2) risk
assessment, (3) control activities, (4) information and communication, and (5) monitoring activities.
4. TSMC has evaluated the design and operating effectiveness of its internal control system according to the aforesaid Regulations.
5. Based on the findings of such evaluation, TSMC believes that, on December 31, 2015, it has maintained, in all material respects,
an effective internal control system (that includes the supervision and management of our subsidiaries), to provide reasonable
assurance over our operational effectiveness and efficiency, reliability, timeliness, transparency of reporting, and compliance with
applicable rulings, laws and regulations.
6. This Statement will be an integral part of TSMC’s Annual Report for the year 2015 and Prospectus, and will be made public. Any
falsehood, concealment, or other illegality in the content made public will entail legal liability under Articles 20, 32, 171, and 174
of the Securities and Exchange Law.
7. This Statement has been passed by the Board of Directors in their meeting held on February 2, 2016, with none of the eight
attending directors expressing dissenting opinions, and the remainder all affirming the content of this Statement.
Taiwan Semiconductor Manufacturing Company Limited
Morris Chang,
Chairman
Mark Liu,
President and Co-Chief Executive Officer
C.C. Wei,
President and Co-Chief Executive Officer
044
045
3.8 Status of Personnel Responsible for the Company’s Financial and Business Operation
3.8.1 Resignation or Dismissal of Chairman, President, and Heads of Accounting, Finance, Internal Audit and R&D
during the 2015 Calendar Year and as of the Date of this Annual Report: None.
3.8.2 Certification of Employees Whose Jobs are Related to the Release of the Company’s Financial Information
Certification
Certified Public Accountants (CPA)
US Certified Public Accountants (US CPA)
The Chartered Institute of Management Accountants (CIMA)
Certified Internal Auditor (CIA)
Chartered Financial Analyst (CFA)
Certified Management Accountant (CMA)
Financial Risk Manager (FRM)
Certificate in Financial Management (CFM)
Certification in Control Self-Assessment (CCSA)
Certification in Risk Management Assurance (CRMA)
Certified Information Systems Auditor (CISA)
BS7799/ISO 27001 Lead Auditor
Number of Employees
Internal Audit
3
3
-
12
-
-
-
-
3
4
4
1
Finance
27
12
1
5
4
2
1
1
-
-
-
-
3.9 Information Regarding TSMC’s Independent Auditor
3.9.1 Audit Fees
The Audit Committee approves all fees payable to TSMC’s independent auditor and recommends the same to the Board of Directors
for further approval. The Board of Directors has authorized the Audit Committee to approve any increase not exceeding 10% of the
approved fees.
Unit: NT$ thousands
Accounting
Firm
Name of CPA
Audit Fee
Non-audit Fee
Whether the CPA’s Audit Period Covers
an Entire Fiscal Year
System
Design
Company
Registration
Human
Resource
Others
(Note 1)
Subtotal
Yes
No
Audit
Period
Deloitte &
Touche
Yi-Hsin Kao,
Hung-Wen Huang,
and others
60,363
-
90
1,994
82
2,166
V
Note 1: Fees mainly related to accounting research tool.
Note 2: Article 10-5-1 of Regulation Governing Information to be published in Annual Report of Public Companies was not applicable to TSMC.
Remark
Note 2
3.9.2 TSMC did not replace its independent auditor
during 2014, 2015, and as of February 29, 2016.
3.9.3 TSMC’s Chairman, Directors, Chief Executive
Officer, Chief Financial Officer, and managers in
charge of its finance and accounting operations
did not hold any positions within TSMC’s
independent audit firm or its affiliates in the most
recent year.
3.9.4 Evaluation of the External Auditor’s Independence
The Audit Committee regularly monitors the independence of
TSMC’s external auditor by conducting the below evaluations
and reports the same to the Board of Directors:
1. The auditor’s independence declaration
2. The Audit Committee pre-approves all audit and non-audit
services conducted by the auditor to ensure that the
non-audit services do not influence the results of the audit
3. Ensure the audit partner rotates every five years
4. Annually evaluate the independence of the external auditor
based on the results of the auditor survey
3.10 Material Information Management
Procedure
TSMC has established relevant procedures for managing and
disclosing material information. The responsible departments
regularly remind all officers and employees about the need to
comply with these procedures and other applicable regulations
when they become aware of any potential material information
and the possible need to publicly disclose such information. To
ensure that our employees, managers and board directors are
aware of and comply with these relevant regulations, TSMC
has also established our “Insider Trading Policy”. To reduce
the risk of insider trading, on-line training programs and live
seminars are conducted periodically. In addition, employees
can familiarize themselves with relevant internal policies and
training articles by easily accessing TSMC’s Legal Organization
intranet website.
046
047
4. Capital and Shares
4.1 Capital and Shares
4.1.1 Capitalization
Unit: Share/NT$
Month/
Year
Issue Price
(Per Share)
Authorized Share Capital
Capital Stock
Shares
Amount
Shares
Amount Sources of Capital
Remark
Capital Increase by
Assets Other than
Cash
03/2015
07/2015
10
28,050,000,000
280,500,000,000
25,929,662,436
259,296,624,360 Exercise of Employee Stock
None
Options: NT$2,874,800
10
28,050,000,000
280,500,000,000
25,930,380,458
259,303,804,580 Exercise of Employee Stock
None
Options: NT$7,180,220
As of 02/29/2016
Date of Approval &
Approval Document No.
03/12/2015 Zhu Shang Tzu
No. 1040006423
07/13/2015 Zhu Shang Tzu
No. 1040020526
As of 02/29/2016
Total
Authorized Share Capital
Issued Shares
Listed
Non-listed
Total
Unissued
Shares
25,930,380,458
-
25,930,380,458
2,119,619,542
28,050,000,000
4.1.2 Capital and Shares
Unit: Share
Type of Stock
Common Stock
Shelf Registration: None.
4.1.3 Composition of Shareholders
Common Share
Type of Shareholders
Government
Agencies
Financial
Institutions
Other Juridical
Persons
Foreign
Institutions
and Natural
Persons
Domestic Natural
Persons
Number of Shareholders
8
207
1,208
3,733
349,155
As of 07/05/2015 (last record date)
Total
354,311
Shareholding
1,653,797,313
977,881,685
1,380,363,102
19,657,991,373
2,260,346,985
25,930,380,458
Holding Percentage (%)
6.38%
3.77%
5.32%
75.81%
8.72%
100.00%
048
048
049
049
Distribution Profile of Share Ownership
Common Share
Shareholder Ownership (Unit: Share)
Number of Shareholders
1 ~ 999
1,000 ~ 5,000
5,001 ~ 10,000
10,001 ~ 15,000
15,001 ~ 20,000
20,001 ~ 30,000
30,001 ~ 40,000
40,001 ~ 50,000
50,001 ~ 100,000
100,001 ~ 200,000
200,001 ~ 400,000
400,001 ~ 600,000
600,001 ~ 800,000
800,001 ~ 1,000,000
Over 1,000,001
Total
151,145
142,760
27,422
10,543
4,871
5,357
2,509
1,595
3,134
1,637
1,095
443
250
178
1,372
354,311
Preferred Share: None.
4.1.4 Major Shareholders
Common Share
Shareholders
ADR-Taiwan Semiconductor Manufacturing Company, Ltd.
National Development Fund, Executive Yuan
JPMorgan Chase Bank N.A. Taipei Branch in custody for Saudi Arabian Monetary Agency
Government of Singapore
JPMorgan Chase Bank N.A. Taipei Branch in custody for EuroPacific Growth Fund
JPMorgan Chase Bank N.A. Taipei Branch in custody for ABU DHABI Investment Authority
Cathay Life Insurance Co., Ltd.
Vanguard Emerging Markets Stock Index Fund, a Series of Vanguard International Equity Index Funds
Norges Bank
JPMorgan Chase Bank, N.A., Taipei Branch in custody for Stichting Depositary APG Emerging Markets Equity Pool
Ownership
34,213,375
303,388,668
197,371,094
128,147,107
85,778,760
130,583,605
86,644,013
71,688,191
219,362,243
227,187,115
305,191,059
216,576,354
174,666,125
160,051,044
23,589,531,705
25,930,380,458
Total Shares Owned
5,365,356,963
1,653,709,980
641,514,041
635,155,654
354,917,649
320,874,542
287,686,235
252,531,845
235,258,515
230,128,873
As of 07/05/2015 (last record date)
Ownership (%)
0.13%
1.17%
0.76%
0.49%
0.33%
0.50%
0.33%
0.28%
0.85%
0.88%
1.18%
0.84%
0.67%
0.62%
90.97%
100.00%
As of 07/05/2015 (last record date)
Ownership (%)
20.69%
6.38%
2.47%
2.45%
1.37%
1.24%
1.11%
0.97%
0.91%
0.89%
050
4.1.5 Net Change in Shareholding by Directors, Management and Shareholders with 10% Shareholdings or More
Unit: Share
Title
Name
Chairman
Morris Chang
Vice Chairman
F.C. Tseng
Director
National Development Fund, Executive Yuan
Representative: Johnsee Lee
Independent Director
Sir Peter Leahy Bonfield
Independent Director
Stan Shih
Independent Director
Thomas J. Engibous
Independent Director
Gregory C. Chow (Note 2)
Independent Director
Kok-Choo Chen
Independent Director
Michael R. Splinter (Note 3)
President and Co-Chief Executive Officer
Mark Liu
President and Co-Chief Executive Officer
C.C. Wei
Senior Vice President and Chief Information Officer
Information Technology, Materials Management and Risk
Management
Stephen T. Tso
Senior Vice President, Chief Financial Officer and Spokesperson
Finance
Lora Ho
Senior Vice President
Research and Development
Wei-Jen Lo
Senior Vice President of TSMC and
President of TSMC North America
Rick Cassidy
Vice President
Operations/Affiliate Fabs
M.C. Tzeng
Vice President and Chief Technology Officer
Research and Development
Jack Sun
Vice President
Operations/Product Development
Y.P. Chin
Vice President
Quality and Reliability
N.S. Tsai
Vice President
Operations/Mainstream Fabs and Manufacturing
Technology
J.K. Lin
Vice President
Operations/300mm Fabs
J.K. Wang
Vice President
Corporate Planning Organization
Irene Sun
2015
01/01/2016 ~ 02/29/2016
Net Change in Shareholding
Net Change in Shares
Pledged (Note 1)
Net Change in Shareholding
Net Change in Shares
Pledged (Note 1)
-
-
-
-
-
-
-
-
-
-
-
-
(60,000)
(1,900,000)
-
-
-
(59,000)
(153,000)
(18,000)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
220,000
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
(36,000)
(22,000)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
(Continued)
051
2015
01/01/2016 ~ 02/29/2016
4.1.9 Long-term Investment Ownership
Ownership by TSMC (1)
Ownership by Directors, Managers and
Directly/Indirectly Owned Subsidiaries (2)
Total Ownership
(1) + (2)
Shares
%
Shares
%
Shares
%
As of 12/31/2015
Long-term Investment
Equity Method:
TSMC Partners, Ltd.
TSMC Global Ltd.
TSMC North America
TSMC Europe B.V.
TSMC Japan Limited
TSMC Korea Limited
988,268,244
5,284
11,000,000
200
6,000
80,000
100%
100%
100%
100%
100%
100%
-
-
-
-
-
-
TSMC China Company Limited
Not Applicable (Note 1)
100%
Not Applicable (Note 1)
TSMC Solar Europe GmbH (Note 2)
Chi Cherng Investment Co., Ltd. (Note 3)
Systems on Silicon Manufacturing Co. Pte. Ltd.
Vanguard International Semiconductor Corp.
Xintec Inc.
Global UniChip Corporation
Motech Industries, Inc. (Note 5)
800
36,600,000
313,603
464,223,493
92,778,303
46,687,859
58,319,782
100%
100%
38.79%
28.32%
34.51%
34.84%
11.98%
-
-
-
-
-
275,893,484
16.83% (Note 4)
32,237,381
11.99%
Emerging Alliance Fund, L.P. (Note 6)
Not Applicable (Note 1)
99.50%
Not Applicable (Note 1)
VentureTech Alliance Fund II, L.P.
Not Applicable (Note 1)
98.00%
Not Applicable (Note 1)
VentureTech Alliance Fund III, L.P.
Not Applicable (Note 1)
98.00%
Not Applicable (Note 1)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
988,268,244
5,284
11,000,000
200
6,000
80,000
Not Applicable (Note 1)
800
36,600,000
313,603
740,116,977
125,015,684
46,687,859
58,319,782
Not Applicable (Note 1)
Not Applicable (Note 1)
Not Applicable (Note 1)
100%
100%
100%
100%
100%
100%
100%
100%
100%
38.79%
45.16%
46.50%
34.84%
11.98%
99.50%
98.00%
98.00%
Note 1: Not applicable. These firms do not issue shares. TSMC’s investment is measured as a percentage of ownership.
Note 2: In the third quarter of 2015, the Board of Directors of TSMC Solar Ltd. (“TSMC Solar”) approved the dissolution of TSMC Solar North America, Inc. and TSMC Solar Europe GmbH. TSMC Solar
North America completed the dissolution in December 2015.
Note 3: Pursuant to TSMC Board’s approval on August 11, 2015, TSMC acquired OmniVision Technologies, Inc.’s 100% ownership in Taiwan OmniVision Investment Holding Co. Inc. (“OVT Taiwan”) on
November 20, 2015. OVT Taiwan changed its name to Chi Cherng Investment Co., Ltd. afterwards.
Note 4: TSMC’s Director, National Development Fund of Executive Yuan, holds 16.72% while other Directors and Management hold 0.11%.
Note 5: TSMC Solar ceased manufacturing operations in August 2015. On December 14, 2015, TSMC Solar and TSMC Guang Neng Investment, Ltd. (“TSMC GN”) were merged into TSMC. TSMC
succeeded and assumed all the assets, rights, obligations, and liabilities in TSMC Solar and TSMC GN, including the shares of Motech Industries, Inc., held by TSMC Solar.
Note 6: Due to the expiration of the investment agreement between Emerging Alliance Fund, L.P. and TSMC, Emerging Alliance Fund, L.P. will complete its liquidation procedures in April 2016.
Title
Name
Vice President
Research and Development
Burn J. Lin (Note 4)
Vice President
Research and Development
Y.J. Mii
Vice President
Research and Development
Cliff Hou
Vice President
Business Development
Been-Jon Woo
Vice President and General Counsel
Legal
Sylvia Fang
Vice President
Human Resources
Connie Ma
Vice President
Research and Development
Y.L. Wang (Note 5)
Net Change in Shareholding
Net Change in Shares
Pledged (Note 1)
Net Change in Shareholding
Net Change in Shares
Pledged (Note 1)
-
-
(300,000)
40,000
-
10,000
-
-
-
-
-
-
-
-
-
-
-
25,000
-
-
-
-
-
-
-
-
-
-
Note 1: This refers to the creation of security interest over TSMC shares in favor of creditors, usually in connection with a shareholder’s own financing activities.
Note 2: Professor Dr. Gregory C. Chow’s tenure expired on June 9, 2015 because he was not re-elected at the 2015 Annual Shareholders’ Meeting.
Note 3: Mr. Michael R. Splinter was elected as TSMC’s independent directors at TSMC’s Annual Shareholders’ Meeting on June 9, 2015.
Note 4: Vice President Dr. Burn J. Lin retired, effective November 1, 2015. His shareholding was not disclosed after that date.
Note 5: Dr. Y.L. Wang was promoted to Vice President, effective November 10, 2015. His shareholding was disclosed starting from that date.
4.1.6 Stock Trade with Related Party
Name
Lora Ho
Reason of the Transfer
Transfer Date
Transferee
Relation with the Transferer
Gifting
05/29/2015
C.H. Liu
Spouse
Shares
Transfer
Price
2,000,000
-
4.1.7 Stock Pledge with Related Party: None.
4.1.8 Related Party Relationship among Our 10 Largest Shareholders
Common Share
Name
Current Shareholding
Spouse and Minor
Shareholding
TSMC Shareholding by
Nominee Arrangement
Shares
%
Shares
ADR-Taiwan Semiconductor Manufacturing Company, Ltd.
5,365,356,963
National Development Fund, Executive Yuan
Representative: Johnsee Lee
JPMorgan Chase Bank N.A. Taipei Branch in custody for Saudi
Arabian Monetary Agency
Government of Singapore
JPMorgan Chase Bank N.A. Taipei Branch in custody for
EuroPacific Growth Fund
JPMorgan Chase Bank N.A. Taipei Branch in custody for ABU
DHABI Investment Authority
Cathay Life Insurance Co., Ltd.
Chairman: Hong-Tu Tsai
Vanguard Emerging Markets Stock Index Fund, a Series of
Vanguard International Equity Index Funds
Norges Bank
JPMorgan Chase Bank, N.A., Taipei Branch in custody for
Stichting Depositary APG Emerging Markets Equity Pool
1,653,709,980
-
641,514,041
635,155,654
354,917,649
320,874,542
287,686,235
252,531,845
235,258,515
230,128,873
20.69%
6.38%
-
2.47%
2.45%
1.37%
1.24%
1.11%
0.97%
0.91%
0.89%
N/A
N/A
-
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
%
N/A
N/A
-
N/A
N/A
N/A
N/A
N/A
Not Available
N/A
N/A
N/A
Shares
N/A
N/A
-
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
%
N/A
N/A
-
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
As of 07/05/2015 (last record date)
Name and Relationship
between TSMC’s
Shareholders
Name
Relationship
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
052
053
4.1.10 Share Information
4.1.12 Compensation to Directors and Profit Sharing Bonus to Employees
TSMC’s earnings per share in 2015 increased 16.2% from 2014 to NT$11.82 per share. The following table details TSMC’s market
price, net worth, earnings, and dividends per common share, as well as other data regarding return on investment.
Market Price, Net Worth, Earnings, and Dividends Per Common Share
Unit: NT$, except for weighted average shares and return on investment ratios
Item
Market Price Per Share (Note 1)
Highest Market Price
Lowest Market Price
Average Market Price
Net Worth Per Share
Before Distribution
After Distribution
Earnings Per Share
Weighted Average Shares (thousand shares)
Diluted Earnings Per Share
Dividends Per Share
Cash Dividends
Accumulated Undistributed Dividend
Return on Investment
Price/Earnings Ratio (Note 2)
Price/Dividend Ratio (Note 3)
Cash Dividend Yield (Note 4)
2014
141.50
100.50
122.53
40.35
35.85
25,930,104
10.18
4.50
-
12.04
27.23
3.7%
2015
01/01/2016 ~ 02/29/2016
154.50
115.00
139.84
47.11
(Note 5)
25,930,380
11.82 (Note 5)
6.00 (Note 5)
-
11.83 (Note 5)
23.31 (Note 5)
4.3% (Note 5)
151.00
131.50
141.04
-
-
-
-
-
-
-
-
-
Note 1: Referred to TWSE website
Note 2: Price/Earnings Ratio = Average Market Price/ Diluted Earnings Per Share
Note 3: Price/Dividend Ratio = Average Market Price/Cash Dividends Per Share
Note 4: Cash Dividend Yield = Cash Dividends Per Share/Average Market Price
Note 5: Pending for shareholders’ approval
4.1.11 Dividend Policy and Distribution of Earnings
TSMC does not pay dividends when there are no profits or retained earnings. TSMC has distributed cash dividends every year to
its shareholders since 2004. TSMC intends to maintain a stable and sustainable dividend policy, and will consider raising dividends
when the free cash flow is sufficient to cover the previous level of dividend payment and any debt repayment. On February 2, 2016,
TSMC’s Board of Directors adopted a proposal recommending distribution of a cash dividend of NT$6 per share as shown in the
table below. The proposal will be implemented according to the relevant regulations, upon the approval of shareholders at the
Annual Shareholders’ Meeting on June 7, 2016.
Proposal to Distribute 2015 Earnings
Unit: NT$
Cash Dividends to Common Shareholders (NT$6 per share)
155,582,282,748
Under the Company Law as amended in May 2015, profit sharing bonus to employees has been detached from distribution
of company’s earnings. In addition, the newly amended Company Law also requires companies to stipulate in their Articles of
Incorporation a fixed amount or ratio of annual profits as profit sharing bonus to employees. TSMC expects to amend its Articles of
Incorporation, which is to be approved at the Annual Shareholders’ Meeting on June 7, 2016. Based on the proposed amendment,
before paying dividends or bonuses to shareholders, TSMC shall set aside not more than 0.3% of its annual profit to directors as
compensation, and not less than 1% to employees as profit sharing bonus. As resolved by TSMC’s Board of Directors on February
2, 2016, profit sharing bonus to employees was expensed based on a certain percentage of 2015 profit; compensation to directors
was expensed based on the estimated amount of payment. If the actual amounts subsequently paid differ from the above estimated
amounts, the differences will be recorded in the year paid as a change in accounting estimate.
2015 Directors’ Compensation and Employees’ Profit Sharing Bonus
Directors’ Compensation (Cash)
Employee’s Profit Sharing Bonus (Cash)
Total
Board Resolution (02/02/2016)
Amount (NT$)
356,186,472
20,556,887,786
20,913,074,258
Note: NT$20,556,887,786 employees’ cash bonus has already been distributed following each quarter of 2015. The above employees’ profit sharing bonus will be distributed in the third quarter of 2016.
2014 Directors’ Compensation and Employees’ Profit Sharing Bonus
Directors’ Compensation (Cash)
Employees’ Profit Sharing Bonus (Cash)
Total
Board Resolution (02/10/2015)
Actual Result (Note)
Amount (NT$)
406,853,980
17,645,966,064
18,052,820,044
Amount (NT$)
406,853,980
17,480,829,446
17,887,683,426
Note: The above Directors’ Compensation and Employees’ Profit Sharing Bonus were expensed under the Company’s 2014 statement of comprehensive income and the same amounts were approved
by the Board of Directors at its meeting on February 10, 2015. The Employees’ Profit Sharing Bonus was distributed after the approval of the same by shareholders at 2015 Annual Shareholders’
Meeting on June 9, 2015. Due to employee turnover, Employees’ Profit Sharing Bonus in the amount of NT$165,136,618 was undistributed, and related expense was reversed in 2015.
4.1.13 Impact to 2015 Business Performance and EPS Resulting from Stock Dividend Distribution: Not applicable.
4.1.14 Buyback of Common Stock: None.
054
055
4.2 Issuance of Corporate Bonds
4.2.1 Corporate Bonds
NTD Corporate Bonds
As of 02/29/2016
Issuance
Issuing Date
Denomination
Offering Price
Total Amount
Coupon
Domestic Unsecured Bond (100-1)
Domestic Unsecured Bond (100-2)
Domestic Unsecured Bond (101-1)
Domestic Unsecured Bond (101-2)
Domestic Unsecured Bond (101-3) Domestic Unsecured Bond (101-4) Domestic Unsecured Bond (102-1) Domestic Unsecured Bond (102-2) Domestic Unsecured Bond (102-3) Domestic Unsecured Bond (102-4)
09/28/2011
NT$10,000,000
Par
01/11/2012
NT$10,000,000
Par
08/02/2012
NT$10,000,000
Par
09/26/2012
NT$10,000,000
Par
10/09/2012
NT$10,000,000
Par
01/04/2013
NT$10,000,000
Par
02/06/2013
NT$10,000,000
Par
07/16/2013
NT$10,000,000
Par
08/09/2013
NT$10,000,000
Par
09/25/2013
NT$10,000,000
Par
NT$18,000,000,000
NT$17,000,000,000
NT$18,900,000,000
NT$21,700,000,000
NT$4,400,000,000
NT$23,600,000,000
NT$21,400,000,000
NT$13,700,000,000
NT$12,500,000,000
NT$15,000,000,000
Tranche A: 1.40% p.a.
Tranche B: 1.63% p.a.
Tranche A: 1.29% p.a.
Tranche B: 1.46% p.a.
Tranche A: 1.28% p.a.
Tranche B: 1.40% p.a.
Tranche A: 1.28% p.a.
Tranche B: 1.39% p.a.
1.53% p.a.
Tranche A: 1.23% p.a.
Tranche B: 1.35% p.a.
Tranche C: 1.49% p.a.
Tranche A: 1.23% p.a.
Tranche B: 1.38% p.a.
Tranche C: 1.50% p.a.
Tranche A: 1.50% p.a.
Tranche B: 1.70% p.a.
Tranche A: 1.34% p.a.
Tranche B: 1.52% p.a.
Tenor and Maturity Date
Tranche A: 5 years
Maturity: 09/28/2016
Tranche B: 7 years
Maturity: 09/28/2018
Tranche A: 5 years
Maturity: 01/11/2017
Tranche B: 7 years
Maturity: 01/11/2019
Tranche A: 5 years
Maturity: 08/02/2017
Tranche B: 7 years
Maturity: 08/02/2019
Tranche A: 5 years
Maturity: 09/26/2017
Tranche B: 7 years
Maturity: 09/26/2019
Tenor: 10 years
Maturity: 10/09/2022
Tranche A: 5 years
Maturity: 01/04/2018
Tranche B: 7 years
Maturity: 01/04/2020
Tranche C: 10 years
Maturity: 01/04/2023
Tranche A: 5 years
Maturity: 02/06/2018
Tranche B: 7 years
Maturity: 02/06/2020
Tranche C: 10 years
Maturity: 02/06/2023
Tranche A: 7 years
Maturity: 07/16/2020
Tranche B: 10 years
Maturity: 07/16/2023
Tranche A: 4 years
Maturity: 08/09/2017
Tranche B: 6 years
Maturity: 08/09/2019
Tranche A: 1.35% p.a.
Tranche B: 1.45% p.a.
Tranche C: 1.60% p.a.
Tranche D: 1.85% p.a.
Tranche E: 2.05% p.a.
Tranche F: 2.10% p.a.
Tranche A: 3 years
Maturity: 09/25/2016
Tranche B: 4 years
Maturity: 09/25/2017
Tranche C: 5.5 years
Maturity: 03/25/2019
Tranche D: 7.5 years
Maturity: 03/25/2021
Tranche E: 9.5 years
Maturity: 03/25/2023
Tranche F: 10 years
Maturity: 09/25/2023
NT$15,000,000,000
Outstanding
Credit Rating
Trustee
Guarantor
Underwriter
Legal Counsel
Auditor
Repayment
Redemption or Early Repayment Clause
Covenants
Other Rights of
Bondholders
Conversion Right
Amount of Converted or
Exchanged Common Shares,
ADRs or Other Securities
NT$18,000,000,000
NT$17,000,000,000
NT$18,900,000,000
NT$21,700,000,000
NT$4,400,000,000
NT$23,600,000,000
NT$21,400,000,000
NT$13,700,000,000
NT$12,500,000,000
twAAA
(Taiwan Ratings Corporation,
08/24/2011)
twAAA
(Taiwan Ratings Corporation,
12/06/2011)
twAAA
(Taiwan Ratings Corporation,
07/02/2012)
Mega International Commercial Bank
twAAA
(Taiwan Ratings Corporation,
08/23/2012)
Taipei Fubon Commercial Bank
twAAA
(Taiwan Ratings Corporation,
09/04/2012)
twAAA
(Taiwan Ratings Corporation,
11/29/2012)
twAAA
(Taiwan Ratings Corporation,
12/18/2012)
twAAA
(Taiwan Ratings Corporation,
05/16/2013)
twAAA
(Taiwan Ratings Corporation,
07/15/2013)
twAAA
(Taiwan Ratings Corporation,
08/06/2013)
None
Not Applicable
Modern Law Office
Deloitte & Touche
Bullet
None
None
None
Not Applicable
Dilution Effect and Other Adverse Effects on
Existing Shareholders
Custodian
None
None
USD Corporate Bonds
Issuance
Issuing Date
Denomination
Listing
Offering Price
Total Amount
Coupon
Tenor and Maturity Date
Guarantor
Trustee
Underwriter
Senior Unsecured Notes
(Note)
04/03/2013
US$200,000 and integral multiples of US$1,000 in excess thereof
Singapore Exchange
2016 Notes: 99.988%
2018 Notes: 99.933%
US$1,500,000,000
2016 Notes: 0.950% p.a.
2018 Notes: 1.625% p.a.
2016 Notes: 3 years
Maturity: 04/03/2016
2018 Notes: 5 years
Maturity: 04/03/2018
TSMC
Citicorp International Limited
Goldman Sachs International
As of 02/29/2016
Legal Advisor
Auditor
Repayment
Outstanding
Jones Day
Maples and Calder
Deloitte & Touche
Bullet
US$1,500,000,000
Redemption or Early Repayment Clause
At issuer’s option
Covenants
Credit Rating
Limitations on (1) liens and (2) sale and leaseback transactions
A1 (Moody’s Investors Service, 03/15/2013)
A+ (Standard & Poor’s Rating Services, 03/15/2013)
Conversion Right
None
Other Rights of
Bondholders
Amount of Converted
or Exchanged Common
Shares, ADRs or Other
Securities
Dilution Effect and Other Adverse Effects on
Existing Shareholders
Custodian
Not Applicable
None
None
(Continued)
Note: Issued by TSMC’s wholly-owned subsidiary, TSMC Global Ltd., and unconditionally and irrevocably guaranteed by TSMC.
056
057
4.2.2 Convertible Bond: None.
4.2.3 Exchangeable Bond: None.
4.2.4 Shelf Registration: None.
4.2.5 Bond with Warrants: None.
4.3 Preferred Shares
4.3.1 Preferred Share: None.
4.3.2 Preferred Share with Warrants: None.
4.4 Issuance of American Depositary Shares
Issuing Date
10/08/1997
11/20/1998
01/12/1999 -
01/14/1999
07/15/1999
08/23/1999 -
09/09/1999
02/22/2000 -
03/08/2000
04/17/2000
06/07/2000 -
06/15/2000
Total Amount (US$)
594,720,000
184,554,440
35,500,000
296,499,641
158,897,089
379,134,599
224,640,000
1,167,873,850
05/14/2001 -
06/11/2001
240,999,660
06/12/2001
11/27/2001
02/07/2002 -
02/08/2002
11/21/2002 -
12/19/2002
297,649,640
320,600,000
1,001,650,000
160,097,914
07/14/2003 -
07/21/2003
908,514,880
11/14/2003
08/10/2005 -
09/08/2005
05/23/2007
1,077,000,000
1,402,036,500
2,563,200,000
Offering Price Per ADS
(US$)
24.78
15.26
17.75
24.516
28.964
57.79
56.16
35.75
20.63
20.63
16.03
16.75
8.73
10.40
10.77
8.6
10.68
11,682,000
58,410,000
14,428,000
72,140,000
20,000,000
59,800,000
18,348,000
87,357,200
100,000,000
163,027,500
240,000,000
100,000,000
299,000,000
91,740,000
436,786,000
500,000,000
815,137,500
1,200,000,000
TSMC Common
Shares from Selling
Shareholders
TSMC Common
Shares from Selling
Shareholders
TSMC Common
Shares from Selling
Shareholders
TSMC Common
Shares from Selling
Shareholders
(Pursuant to ADR
Conversion Sale
Program)
TSMC Common
Shares
from Selling
Shareholders
(Pursuant to ADR
Conversion Sale
Program)
(Note 3)
TSMC Common
Shares
from Selling
Shareholders
TSMC Common
Shares from Selling
Shareholders
TSMC Common
Shares from Selling
Shareholders
TSMC Common
Shares from Selling
Shareholders
Units Issued
24,000,000
12,094,000
2,000,000
12,094,000
5,486,000
6,560,000
4,000,000
32,667,800
Common Shares
Represented
Underlying Securities
120,000,000
60,470,000
10,000,000
60,470,000
27,430,000
32,800,000
20,000,000
163,339,000
TSMC Common
Shares from Selling
Shareholders
TSMC Common
Shares from Selling
Shareholders
TSMC Common
Shares from Selling
Shareholders
TSMC Common
Shares from Selling
Shareholders
TSMC Common
Shares from Selling
Shareholders
(Pursuant to ADR
Conversion Sale
Program)
TSMC Common
Shares from Selling
Shareholders
(Pursuant to ADR
Conversion Sale
Program)
TSMC Common
Shares from Selling
Shareholders
Cash Offering and
TSMC Common
Shares from Selling
Shareholders
(Note 3)
(Note 4)
Apportionment of
Expenses for Issuance
and Maintenance
Issuance and Listing
NYSE
Rights and Obligations
of ADS Holders
Same as those of Common Share Holders
Trustee
Not Applicable
Depositary Bank
Citibank,N.A.–NewYork
Custodian Bank (Note 1) Citibank, N.A. – Taipei Branch
ADSs Outstanding
(Note 2)
As of February 29, 2016, total number of outstanding ADSs was 1,072,635,045.
Terms and Conditions in
the Deposit Agreement
and Custody Agreement
See Deposit Agreement
and Custody Agreement
for Details
Closing Price Per ADS
(US$)
2015
01/01/2016-
02/29/2016
High
Low
Average
High
Low
Average
24.63
18.76
22.36
23.96
20.48
22.30
Note 1: Citibank, N.A., Taipei Branch has changed its name to “Citibank Taiwan Limited” on August 1, 2009.
Note 2: TSMC has in aggregate issued 813,544,500 ADSs since 1997, which, if taking into consideration stock dividends distributed over the period, would amount to 1,147,835,205 ADSs. Stock
dividends distributed in 1998, 1999, 2000, 2001, 2002, 2003, 2004, 2005, 2006, 2007, 2008 and 2009 were 45%, 23%, 28%, 40%, 10%, 8%, 14.08668%, 4.99971%, 2.99903%, 0.49991%,
0.50417% and 0.49998%, respectively. As of February 29, 2016, total number of outstanding ADSs was 1,072,635,045 after 75,200,160 were redeemed.
Note 3: All fees and expenses such as underwriting fees, legal fees, listing fees and other expenses related to issuance of ADSs were borne by the selling shareholders, while maintenance expenses such as
annual listing fees and accountant fees were borne by TSMC.
Note 4: All fees and expenses such as underwriting fees, legal fees, listing fees and other expenses related to issuance of ADSs were borne proportionately by TSMC and the selling shareholders, while
maintenance expenses such as annual listing fees and accountant fees were borne by TSMC.
058
059
4.5 Status of Employee Stock Option Plan
4.5.1 Issuance of Employee Stock Options
ESOP Granted
Approval Date by The Securities & Futures Bureau
Issue (Grant) Date
Number of Options Granted
Percentage of Shares Exercisable to Outstanding Common Shares
Option Duration
Source of Option Shares
Vesting Schedule
Shares Exercised
Value of Shares Exercised (NT$)
Shares Unexercised
Original Grant Price Per Share (NT$)
Adjusted Exercise Price Per Share (NT$)
Percentage of Shares Unexercised to Outstanding Common Shares
Impact to Shareholders’ Equity
First Grant
06/25/2002
08/22/2002
18,909,700
0.10154%
10 years
Second Grant
Third Grant
06/25/2002
11/08/2002
1,085,000
0.00583%
10 years
06/25/2002
03/07/2003
6,489,514
0.03485%
10 years
Fourth Grant
06/25/2002
06/06/2003
23,090,550
0.12399%
10 years
Fifth Grant
10/29/2003
12/03/2003
842,900
0.00416%
10 years
Sixth Grant
10/29/2003
02/19/2004
15,720
0.00008%
10 years
Seventh Grant
Eighth Grant
Ninth Grant
As of 02/29/2016
10/29/2003
05/11/2004
11,167,817
0.05510%
10 years
10/29/2003
08/11/2004
135,300
0.00058%
10 years
01/06/2005
05/17/2005
10,742,350
0.04620%
10 years
New Common Share
New Common Share
New Common Share
New Common Share
New Common Share
New Common Share
New Common Share
New Common Share
New Common Share
2nd Year: up to 50%
3rd Year: up to 75%
4th Year: up to 100%
2nd Year: up to 50%
3rd Year: up to 75%
4th Year: up to 100%
2nd Year: up to 50%
3rd Year: up to 75%
4th Year: up to 100%
2nd Year: up to 50%
3rd Year: up to 75%
4th Year: up to 100%
2nd Year: up to 50%
3rd Year: up to 75%
4th Year: up to 100%
2nd Year: up to 50%
3rd Year: up to 75%
4th Year: up to 100%
2nd Year: up to 50%
3rd Year: up to 75%
4th Year: up to 100%
2nd Year: up to 50%
3rd Year: up to 75%
4th Year: up to 100%
2nd Year: up to 50%
3rd Year: up to 75%
4th Year: up to 100%
20,585,621
696,435,850
-
NT$53.0
NT$25.6
0.00000%
1,416,203
45,875,186
-
NT$51.0
NT$24.6
0.00000%
7,584,554
174,820,504
-
NT$41.6
NT$20.2
0.00000%
24,838,979
849,375,434
-
NT$58.5
NT$28.3
0.00000%
583,111
29,807,359
-
NT$66.5
NT$50.1
0.00000%
15,416
744,182
-
NT$63.5
NT$47.8
0.00000%
10,344,528
457,708,004
-
NT$57.5
NT$43.2
0.00000%
128,014
4,982,968
-
NT$43.8
NT$38.0
0.00000%
8,937,082
425,035,008
-
NT$54.3
NT$47.2
0.00000%
Dilution to Shareholders’
Equity is limited
Dilution to Shareholders’
Equity is limited
Dilution to Shareholders’
Equity is limited
Dilution to Shareholders’
Equity is limited
Dilution to Shareholders’
Equity is limited
Dilution to Shareholders’
Equity is limited
Dilution to Shareholders’
Equity is limited
Dilution to Shareholders’
Equity is limited
Dilution to Shareholders’
Equity is limited
060
061
4.5.2 Employee Stock Options Granted to Management Team and to Top 10 Employees (Note 1)
Title
Name
Number of Options Granted
(Note 2)
% of Shares Exercisable to
Outstanding Common Shares
Exercised
Unexercised
Shares Exercised
Exercise Price Per
Share
Value of Shares
Exercised (NT$)
% of Shares
Exercised to
Outstanding
Common Shares
Shares Unexercised
Adjusted Grant
Price Per Share
Value of Shares
Unexercised (NT$)
As of 02/29/2016
% of Shares
Unexercised to
Outstanding
Common Shares
Employees
President of WaferTech
Director of WaferTech
Director of WaferTech
Director of WaferTech
Director of WaferTech
Director of WaferTech
Deputy Director of WaferTech
Sr. Manager of WaferTech
Manager of WaferTech
Manager of WaferTech
Tsung Kuo
Wayne Yeh
Charlton Ku
Men-Chee Chen
Felix Tai
Kingbird Lin
Chang-Ching Kin
Richard Thoits
Christian Gomez
Todd Dalebroux
Note 1: Officers were not granted TSMC employee stock options which expire after 2015.
Note 2: Number of options granted includes the additional shares due to stock dividends distributed in 2004, 2005, 2006, 2007, 2008 and 2009.
4.6 Status of Employee Restricted Stock
TSMC did not issue employee restricted stock in 2015, and as of the date of this Annual Report.
1,249,179
0.00482%
1,249,179
47.2
58,961,249
0.00482%
-
-
-
-
4.6.1 Status of Employee Restricted Stock: Not applicable.
4.6.2 Employee Restricted Stock Granted to Management Team and to Top 10 Employees: Not applicable.
4.7 Status of New Share Issuance in Connection with Mergers and Acquisitions
TSMC neither issued new shares in connection with mergers or acquisitions during 2015, nor as of the date of this Annual Report.
4.8 Financing Plans and Implementation: Not applicable.
062
063
5. Operational Highlights
5.1 Business Activities
5.1.1 Business Scope
As the founder and leader of the dedicated semiconductor foundry segment, TSMC provides a full range of integrated
semiconductor foundry services, including the most advanced process technologies, leading specialty technologies, the most
comprehensive design ecosystem support, excellent manufacturing productivity and product quality, advanced mask and packaging
services, and so on, to fulfill an increasing variety of customer needs. The Company strives to provide the best overall value to its
customers and TSMC believes its customers’ success is TSMC’s success. As a result, TSMC has won customer trust from around the
world and has experienced strong growth and success.
In May 2009, TSMC established the New Businesses organization to explore non-foundry related business opportunities. In 2011,
the New Businesses organization was formally separated from the main TSMC organization as two wholly owned subsidiaries,
TSMC Solid State Lighting Ltd. (TSMC SSL) and TSMC Solar Ltd., responsible for solid state lighting and solar business activities,
respectively. In January 2015, TSMC’s board of directors approved the sale of TSMC Solid State Lighting to Epistar. Upon the
closing of the sale, TSMC completely exited the LED industry. In August 2015, TSMC announced that TSMC Solar would cease
manufacturing operations by end of that month, as we believed that our solar business was no longer economically sustainable. All
outstanding warranties to existing customers will be honored.
5.1.2 Customer Applications
TSMC manufactured 8,941 different products for 470 different customers in 2015. These chips were used across the entire
spectrum of electronic applications, including computers and peripherals, information appliances, wired and wireless
communications systems, automotive and industrial equipment, consumer electronics such as DVDs, digital TVs, game consoles,
digital still cameras (DSCs), and many other applications.
The rapid evolution of end products drives customers to use TSMC’s innovative technologies and services, while at the same time
spurring TSMC’s own development of technology. As always, success depends on leading rather than following industry trends.
5.1.3 Consolidated Shipments and Net Revenue in 2015 and 2014
Unit: Shipments (thousand 12-inch equivalent wafers) / Net Revenue (NT$ thousands)
Wafer
Others (Note 2)
Total
Domestic (Note 1)
Export
Domestic (Note 1)
Export
Domestic (Note 1)
Export
2015
2014
Shipments
Net Revenue
Shipments
Net Revenue
1,588
7,175
N/A
N/A
1,588
7,175
100,189,156
702,748,813
5,535,154
35,024,245
105,724,310
737,773,058
1,738
6,525
N/A
N/A
1,738
6,525
112,726,728
611,020,808
5,766,553
33,292,376
118,493,281
644,313,184
Note 1: Domestic means sales to Taiwan.
Note 2: Others majorly include revenue associated with mask making, design services, and royalties.
064
064
065
065
065
5.1.4 Production in 2015 and 2014
Unit: Capacity / Output (million 12-inch equivalent wafers) / Amount (NT$ millions)
Year
2015
2014
Wafers
Capacity
9-10
8-9
Output
8-9
8-9
Amount
378,871
426,707
5.2 Technology Leadership
5.2.1 R&D Organization and Investment
In 2015, TSMC continued to invest in research and development, with total R&D
expenditure amounting to 8% of revenue, a level that equals or exceeds the R&D
investment of many other high-tech leaders.
TSMC recognizes that the technology challenge of continuing to extend Moore’s
Law, the doubling of semiconductor computing power every two years, is becoming
increasingly complex. The efforts of the R&D organization are focused on enabling
the Company to continuously offer its customers first-to-market, leading-edge
technologies and design solutions that contribute to their product success in today’s
challenging market environment. In 2015 the R&D organization met these challenges
by completing transfer to manufacturing of the industry leading 16FF+ technology,
the first integrated technology platform to make use of 3D FinFET transistors. The
R&D organization continues to fuel the pipeline of technological innovation needed
to maintain leadership. TSMC’s 10nm technology development is on track to meet
the goal of production start-up in 2016. TSMC 7nm technology is now in the full
development stage, while the 5nm node is under definition and subject to intensive
early development efforts.
R&D Expenditures
Amount: NT$ thousands
9
7
5
,
4
4
5
,
5
6
5
1
8
,
8
2
8
,
6
5
,
5
4
8
3
2
8
9
,
2014
2015
01/01/2016~
02/29/2016
In addition to CMOS logic, TSMC conducts R&D on a wide range of other semiconductor technologies that provide the functionality
customers require for mobile SoC and other applications. Highlights achieved in 2015 include: Chip-On-Wafer-On-Substrate
(CoWoS®) technology enhancement to include areas exceeding 1000mm2 in size; full qualification of 3D InFO technology
qualification and transfer to manufacturing; Through-Silicon Via (TSV) packaging ramp-up to high volume; development of
0.13µm Bipolar-CMOS-DMOS (BCD) technology for manufacture on 12-inch wafers; the addition of RF capability for 55nm e-Flash
technology aimed at IoT applications; qualification for manufacture of a 650V GaN High-Electron-Mobility Transistor (HEMT); and
qualification of the 55nm high-voltage process for display drivers
TSMC maintains a network of important external R&D partnerships and alliances with world-class research institutions, such as IMEC,
the well-respected European R&D consortium, where TSMC is a core partner. TSMC also provides funding for nanotechnology research
at leading universities worldwide to promote innovation and the advancement of nano-electronic technology. TSMC has established
four joint research centers within Taiwan to include National Taiwan University, National Chao Tung University, National Tsing Hua
University, and National Cheng Kung University. The goal of these centers is to develop greater understanding of the devices and
materials used in the manufacture of advanced Si technologies.
5.2.2 R&D Accomplishments in 2015
Highlights
● 10nm Technology
10nm technology will offer substantial power reduction for
the same chip performance compared to earlier technology
generations. Development activities in 2015 focused on
manufacturing baseline process setup, design rule fix, yield
learning, transistor performance improvement, and process/
product reliability evaluation. Key customers and IP vendors
have verified their IP with 10nm technology. 10nm technology
began customer product tape-out in the first quarter of 2016.
● 7nm Technology
7nm technology offers substantial density improvement and
power reduction with the same chip performance as 10nm
technology. Development activities in 2015 focused on
manufacturing baseline process setup, yield learning, transistor
and interconnect R/C performance improvement and reliability
evaluation. TSMC plans to continue 7nm full development in
2016 for risk production in 2017.
● Lithography
The main focus for RD lithography in 2015 is 10nm and 7nm
development. For 10nm development, the primarily focus is
on continuous improvement of overlay control and patterning
robustness in preparation for 10nm qualification. As for the
7nm development, new resist material and advanced mask
technology were optimized to provide additional patterning
enhancement and design rule shrinkage with immersion
process. Furthermore, TSMC will take the delivery of newest
generation of immersion scanner to meet the tighten overlay
control and imaging requirement for 7nm and beyond.
In 2015, the EUV program has made significant improvement
in laser power and its stability. The stability and improvement
in source power has enabled faster learning rate and process
development for advanced nodes. In addition, EUV resist
process, pellicle, and related mask blank have all made
significant progress. The EUV technology is stepping closer to
full scale RD and manufacturing readiness for advanced nodes.
● Mask Technology
Mask technology is an integral part of our advanced
lithography. In 2015, R&D successfully completed the
development of mask technology for the 10nm node. This
technology is being transferred to the mask production
organization. During the same period, solid progress was made
on the development of mask technology for EUV lithography,
including the reduction of native defects on mask blanks and
the fabrication of EUV masks for lithographic processing of
sub-10nm nodes.
Integrated Interconnect and Packaging
● 3D IC
In 2015, TSMC successfully qualified InFO PoP advanced
packaging technology, with a non-TSV, low-cost solution
for mobile customers. High Volume Manufacturing (HVM)
production ramp is expected in 2016. The CoWoS® technology
continues to expand its application from Field-Programmable
Gate Array (FPGA) to network and to high-performance
computing; the interposer size also expands to larger than
reticle dimension by CoWoS-XL technology.
● Advanced Package Development
TSMC offers a wide variety of lead-free packaging solutions
for mobile/handheld devices. In 2015, 10nm FinFET Si with
ultra-fine pitch copper bump Bump-on-Trace (BoT) packaging
was under development. It is expected to complete the
package qualification in the second quarter of 2016. In 2015,
a low-cost, innovative and highly reliable 2-mask UBM-Free
Integration (UFI) fan-in WLCSP technology is in mass production
for die size 5x5mm2, and passed qualification for larger die
sizes up to 7x7mm2.
● Advanced Interconnect
Development of low-resistance Cu and low-capacitance
dielectric continued to be the primary focus in 2015. At the
7nm node, a new patterning process and a novel dielectric
scheme have been developed to shrink line width/space and
reduce the capacitance between copper lines. A low damage
low-k was delivered to reduce capacitance impact. For the
5nm node and beyond, TSMC developed a design-friendly
advanced line patterning scheme and processes that allow
copper line width and spacing to be further reduced. A new
multi-via patterning process was employed to further improve
CD uniformity. A low-resistivity metal scheme with ultra-thin
barrier was demonstrated with excellent reliability performance.
066
067
Advanced Transistor Research
Innovation in transistor architectures and materials has enabled
increased speed and reduction of power consumption in
advanced logic technologies. TSMC is at the fore-front of
transistor research with a focus on devices with high mobility
channel materials, such as germanium and III-V compound
semiconductors. The Company’s track record in both p- and
n- channel germanium transistors, including record-breaking
device performance, was highlighted at the 2015 International
Electron Device Meeting (IEDM).
microphone, MEMS Si-pillar TSV technology, and BioMEMS
applications.
● GaN Technology
TSMC is the first and only company to offer both 100V and
650V GaN foundry service in a 6-inch fab. In 2015, the R&D
team completed 650V E-HEMT development and qualified for
manufacture a high electron mobility transistor configuration
for high-power, high-frequency applications with low Ron
(resistance when on) and high-breakdown voltage.
Specialty Technologies
TSMC offers a broad mix of technologies to address a wide
range of applications:
● Mixed Signal/Radio Frequency (MS/RF) Technology
In 2015, TSMC developed a 10nm silicon and EM
simulation-based LC-tank design solution to facilitate
high-speed SerDes circuit design with various options of
metal scheme and layout specifications to shorten design
turnaround time. TSMC also offered the IPD-II solution for
high-Q (Q>30 @700MHz) inductor and high-precision
thin-film resistor for 4G LTE application. In order to achieve
better performance in insertion loss and isolation, TSMC further
reduced the key parameter Ron-Coff to ~130 fs in 0.18µm
SOI process to enable cellar/Wi-Fi RF switch applications
as lower-cost alternatives replacing traditional compound
semiconductor-based solutions.
● Power IC/BCD Technology
The third generation of 0.18µm BCD technology adopted
TSMC proprietary device structure, which increased
world-leading performance with an even lower cost. With
this technology, mobile power management ICs can meet the
increasing power demand of mobile devices with higher-power
efficiency.
● Panel Drivers
40nm high-voltage low-power process technology was readied
for production with plans to complete qualification by the first
quarter of 2016. This technology supports Super Retina display
driver IC and touch-display driver integration IC for high-end
mobile phones. This process was made available for customer
tape-outs also in the first quarter of 2016.
● Flash/Embedded Flash Technology
TSMC achieved several important milestones in embedded flash
technologies in 2015. At the more mature 65nm/55nm node,
NOR-based cell technologies, including 1-T cell and Split-Gate
cell, were successfully put in production. At the 40nm node,
split-gate cell technology completed qualification for consumer
electronics applications such as IoT and smartcards and is
now undergoing customer product qualification. Embedded
flash development on the 28nm low-power and 28nm
high-performance mobile computing platforms is underway
for low-leakage applications in areas such as automobile
electronics and micro controller units (MCU).
5.2.3 Technology Platform
TSMC provides customers with advanced technology
platforms that include the comprehensive design infrastructure
required to optimize design productivity and cycle time.
These include: design flows for electronic design automation
(EDA); silicon-proven IP building blocks, such as libraries; and
simulation and verification design kits, i.e., process design kits
(PDK) and technology files.
The availability of 10FF saw improvements in design
infrastructure using an advanced CPU core as the vehicle
to support customers’ adoption of 10nm FinFET (EDA tool
certification results can be found on TSMC-Online.). TSMC
also extended its IP quality program (TSMC9000) to allow IP
audits to be performed either at TSMC or at TSMC-certified
laboratories. To help customers plan new product tape-outs
incorporating IP/Library from TSMC Open Innovation Platform®
(OIP) ecosystem, the OIP ecosystem added a portal to connect
customers to an ecosystem of 43 solution providers.
● Micro-electromechanical Systems (MEMS) Technology
In 2015, TSMC’s modular MEMS technology was qualified
for mass production of accelerometers and a pilot run
of high-resolution pressure sensors. Future plans include
development of next-generation high-sensitivity thin
5.2.4 Design Enablement
TSMC’s technology platforms provide a solid foundation for
design enablement. Customers can design directly using the
Company’s internally developed IP and tools or using those
that are available via our OIP partners.
Tech Files and PDKs
TSMC provides a broad range of process design kits (PDKs) for
digital logic, mixed-signal, radio frequency (RF), high-voltage
driver, CMOS Image Sensor (CIS) and embedded flash
technologies across a range of technology nodes from 0.5µm
to 10nm. In addition, the Company provides technology files
for DRC, LVS, RC extraction, automatic place and route, and
a layout editor to ensure process technology information
is accurately represented in EDA tools. By 2015, TSMC had
provided more than 7,500 technology files and more than 200
PDKs via TSMC-Online. There are more than 100,000 customer
downloads of these files every year.
Library and IP
TSMC and its alliance partners offer our customers a rich
portfolio of reusable IP, which are essential building blocks
for many circuit designs. In 2015, over 60% of new tape-outs
at TSMC adopted one or more libraries or IP from TSMC and/
or our IP partners, as the Company expanded its library and
silicon IP portfolio to contain more than 10,000 items, an 18%
increase over 2014.
Design Methodology and Flow
In 2015, TSMC addressed critical design challenges associated
with the new 10nm FinFET technology for digital and SoC
applications by announcing the readiness of reference flows
through OIP collaboration that feature FinFET-specific design
solutions and methodologies for performance, power and area
optimization.
5.2.5 Intellectual Property
A strong portfolio of intellectual property rights strengthens
TSMC’s technology leadership and protects our advanced
and leading edge technologies. In 2015, TSMC received a
record breaking 1,768 U.S. patents, as well as 779 issued
patents in Taiwan and the PRC, and other patents issued in
various other countries. In 2015, TSMC ranked #23 in the
“Top 50” U.S. patent grants. TSMC’s patent portfolio now
reaches almost 30,000 patents worldwide (including patent
applications in queue). We continue to implement a unified
strategic plan for TSMC’s intellectual capital management.
Strategic considerations and close alignment with the business
objectives drive the timely creation, management and use of
our intellectual property.
At TSMC, we have built a process to extract value from our
intellectual property by aligning our intellectual property
strategy with our R&D, operations, business objectives,
marketing, and corporate development strategies. Intellectual
property rights protect our freedom to operate, enhance our
competitive position, and give us leverage to participate in
many profit-generating activities.
We have worked continuously to improve the quality of our
intellectual property portfolio and to reduce the costs of
maintaining it. We plan to continue investing in our intellectual
property portfolio and intellectual property management
system to ensure that we protect our technology leadership
and receive maximum business value from our intellectual
property rights.
5.2.6 TSMC University Collaboration Programs
In recent years, TSMC has significantly expanded its interaction
with universities in Taiwan with the establishment of four
research centers located at the nation’s most prestigious
universities. The mission of these centers is twofold: to
increase the number of highly qualified students suitable
for employment in semiconductor industry, and to inspire
university professors to initiate research programs that
focus on the frontiers of semiconductor science, including
device, process and materials technology, semiconductor
manufacturing and engineering science, and specialty
technologies for electronic applications. TSMC continues to
expand and enhance the research portfolio at the four research
centers at National Taiwan University, National Chiao Tung
University, National Cheng Kung University and National Tsing
Hua University. In 2015, several hundred more high-caliber
students joined the research centers with backgrounds
representing the disciplines of electronics, physics, materials
engineering, chemistry, chemical engineering and mechanical
engineering.
In addition, TSMC also conducts strategic research projects at
top overseas universities, such as Stanford, MIT, UC Berkeley,
etc. The focus is on disruptive capabilities in transistors,
interconnect, patterning, modeling and special technologies.
TSMC University Shuttle Program
The TSMC University Shuttle Program was established to
provide professors at leading research universities worldwide
with access to the advanced silicon process technologies
needed to research and develop innovative circuit design
concepts. This program links motivated professors and
graduate students to enthusiastic managers at TSMC with the
goals of promoting excellence in the development of advanced
silicon design technologies and nurturing new generations of
engineering talent in the semiconductor field.
068
069
The program provides access to TSMC silicon process
technologies for digital, analog/mixed-signal circuits, RF designs
and micro-electromechanical system designs. Participants in
the TSMC University Shuttle Program include major university
research groups worldwide. TSMC and the University Shuttle
Program participants achieve “win-win” collaboration
through the program, which allows graduate students to
implement exciting designs and achieve silicon proof points for
innovations in various end-applications.
5.2.7 Future R&D Plans
To maintain and strengthen TSMC’s technology leadership,
the Company plans to continue investing heavily in R&D. In
addition to 10nm and 7nm CMOS nodes in the pipeline, the
Company’s reinforced exploratory R&D work is on track to
establish a solid foundation to feed into technology platforms
beyond the 7nm node. The Company’s exploratory work
focuses on new transistors and technologies, such as 3D
structures, strained-layer CMOS, high-mobility materials and
novel 3D IC devices. These studies emphasize innovation and
are guided by deep understanding of fundamental physics of
nanometer CMOS transistors and related technologies. The
Company also continues to collaborate with external research
bodies from academia and industry consortia alike with the
goal of extending Moore’s Law and paving the road to future
cost-effective technologies and manufacturing solutions for its
customers.
With a highly competent and dedicated R&D team and its
unwavering commitment to innovation, TSMC is confident
in its ability to deliver the best and most cost-effective SoC
technologies to its customers and to drive future business
growth and profitability for years to come.
Summary of TSMC’s Major Future R&D Projects
Project Name
Description
Risk Production
(Estimated Target
Schedule)
10nm logic platform
technology and applications
3rd generation FinFET CMOS platform
technology for SoC
7nm logic platform
technology and applications
4th generation FinFET CMOS platform
technology for SoC
2016
2017
3D IC
Cost-effective solution with better form
factor and performance for SiP
2016 ~ 2017
Next-generation lithography
Long-term research
EUV and multiple e-beam to extend
Moore’s Law
Specialty SoC technology (including
new NVM, MEMS, RF, analog) and
transistors for 5nm node and beyond
2016 ~ 2019
2015 ~ 2019
The projects above accounted for roughly 70% of the total R&D budget in 2016, estimated to be
around 8% of 2016 revenue.
5.3 Manufacturing Excellence
5.3.1 GIGAFAB® Facilities
Maintaining dependable capacity is a key part of TSMC’s
manufacturing strategy. The Company currently operates
three 12-inch GIGAFAB® facilities – Fab 12, Fab 14, and Fab
15. The combined capacity of the three facilities exceeded six
million 12-inch wafers in 2015. Production within these three
facilities supports 0.13µm, 90nm, 65nm, 40nm, 28nm, 20nm,
and 16nm process technologies, including each technology’s
sub-nodes. An additional portion of the capacity is reserved for
R&D work on leading-edge manufacturing technologies, which
currently supports the technology development of the 10nm
node and beyond.
TSMC has developed a centralized fab manufacturing
management system (Super Manufacturing Platform, SMP)
to provide customers with greater benefits in the form of
more consistent quality and reliability, improved flexibility
to cope with demand fluctuations, faster yield learning and
time-to-volume, and lower-cost product requalification.
5.3.2 Engineering Performance Optimization
As a professional semiconductor manufacturing and service
company with a diversified product portfolio, TSMC’s unique
manufacturing system is tailored to achieve production of
high complexity with precise control and optimized efficiency.
To achieve overall optimization of equipment, process and
yield, TSMC has introduced engineering big data analysis
and machine learning techniques and has applied statistical
process control, advanced equipment control, advanced
process control and circuit probing. To satisfy advanced and
accurate process control and ensure stable production of high
efficiency and effectiveness, the Company employs systems
of engineering big data mining and analysis, intelligent tool
tuning, and equipment chamber matching. Engineering
analysis platform for decision making, integrated with
intelligent operating systems to achieve self-diagnosis and
self-reactive actions, has produced remarkable results in yield
enhancement, workflow improvement, fault detection, cost
reduction and R&D cycle decrement.
TSMC has further analyzed the correlation between physical
measurement, Wafer Acceptance Test (WAT), defect
test, Certificate of Assurance (CoA), circuit probe and
production-related parameters, aiming to identify critical
variables influencing product quality to optimize yield
management and fulfill customers’ special process requirements
as well as diversified product demand simultaneously.
070
5.3.3 Lean and Intelligent Operations
TSMC continues to drive manufacturing excellence through lean and intelligent operations. The Company has developed a lean work
in process (WIP) line management system to control WIP levels precisely and equip a flexible demand/capacity modeling system to
agilely support customers’ urgent demands and provide customers with accurate on-time delivery and best-in-class cycle time.
To continuously improve fab operating efficiency, TSMC has introduced Internet of Things (IoT) and intelligent mobile devices. The
new applications help to improve data collecting, yield traceability, material transportation and workflow efficiency, especially at
mature fabs.
Following its commitment to manufacturing excellence, TSMC has integrated the technology of advanced data analysis, smart
diagnostic, self-reactive engine and operation knowledge to revolutionize the fab operation mode from “Auto” to “Intelligent,”
optimizing operating efficiency and quality, maximizing cost effectiveness and accelerating overall innovation.
5.3.4 Raw Materials and Supply Chain Risk Management
In 2015, TSMC continued to hold review meetings periodically with teams from operations, quality control and business to
proactively identify and manage the risks of insufficient supply capacity, quality issues and supply chain interruption. TSMC also
worked with its suppliers to enhance performance, quality, delivery and sustainability, as well as to support green procurement,
environmental protection and safety.
Raw Materials Supply
Major Materials
Major Suppliers
Market Status
Procurement Strategy
Raw Wafers
F.S.T.
S.E.H.
Siltronic
SUMCO
SunEdison
Chemicals
Lithographic
Materials
Gases
Slurry, Pad, Disk
Air Products
Ampoe
Avantor
BASF
Entegris
Hong-Kuang
Kanto PPC
SAFC
Wah Lee
Dow
JSR
Merck
Nissan
Shin-Etsu Chemical
Sumitomo
T.O.K.
Air Liquide
Air Products
Entegris
Linde LienHwa
OCI Materials
Taiyo Nippon Sanso
3M
Air Products
Asahi Glass
Cabot Microelectronics
Dow Chemical
Fujifilm Planar Solutions
Fujimi
Kinik
Sumitomo
These five suppliers together provide over 90% of the
world’s raw wafer supply.
● TSMC’s suppliers of silicon wafers are required to pass stringent quality certification
procedures.
Each supplier has multiple manufacturing sites in order to
meet customer demand, including plants in North America,
Asia, and Europe.
● TSMC procures wafers from multiple sources to ensure adequate supplies for volume
manufacturing and to appropriately manage supply risk.
● Raw wafer quality enhancement programs are in place to meet TSMC’s technology
advancement.
● TSMC regularly reviews the quality, delivery, cost, sustainability and service performance
of its wafer suppliers. The results of these reviews are incorporated into TSMC’s
subsequent purchasing decisions.
● A periodic audit of each wafer supplier’s quality assurance system ensures that TSMC
can maintain the highest quality in its own products.
These nine companies are the major worldwide suppliers
of chemicals.
● Most suppliers have relocated some of their operations closer to TSMC’s major
manufacturing facilities, thereby significantly improving procurement logistics.
● Each supplier’s products are regularly reviewed to ensure that TSMC’s specifications are
met and product quality is satisfactory.
These seven companies are the major worldwide suppliers of
lithographic materials.
● TSMC works closely with its suppliers to develop materials that meet all application and
cost requirements.
● TSMC and suppliers periodically conduct programs to improve their quality, delivery,
sustainability and green policy, and to ensure continuous progress of TSMC’s supply
chain.
● Some major suppliers have relocated or plan to duplicate their manufacturing sites
closer to TSMC’s major manufacturing facilities, thereby significantly improving
procurement logistics and reducing supply risks.
These six companies are the major worldwide suppliers of
specialty gases.
● The majority of the six suppliers are located in different geographic locations, which
minimizes supply risk for TSMC.
● TSMC conducts periodic audits to ensure that they meet TSMC’s standards.
These nine companies are the major worldwide suppliers of
CMP (Chemical Mechanical Polishing) materials.
● TSMC works closely with its suppliers to develop materials that meet all application and
cost requirements.
● TSMC and suppliers periodically conduct programs to improve their quality, delivery,
sustainability and green policy, and to ensure continuous progress of TSMC’s supply
chain.
● Most suppliers have relocated or duplicated their manufacturing sites closer to TSMC’s
major manufacturing facilities, thereby significantly improving procurement logistics
and reducing supply risks.
071
Suppliers Accounted for at Least 10% of Annual Consolidated Net Procurement
Unit: NT$ thousands
Supplier
Company A
VIS
Company B
Company C
Company D
Others
Total Net Procurement
2015
2014
Procurement
Amount
As % of 2015 Total
Net Procurement
Relation to TSMC
Procurement
Amount
As % of 2014 Total
Net Procurement
Relation to TSMC
7,981,126
7,148,777
6,452,073
5,457,120
4,336,724
22,323,841
53,699,661
15%
13%
12%
10%
None
Investee accounted for using
equity method
None
None
8%
None
42%
100%
8,496,410
7,424,566
6,147,991
4,598,275
5,471,062
18,889,285
51,027,589
17%
14%
None
Investee accounted for using
equity method
12%
None
9%
None
None
11%
37%
100%
5.3.5 Quality and Reliability
TSMC’s strong industry reputation stems from its commitment to provide customers with the highest-quality wafers and best
service for their products. Quality and Reliability (Q&R) services aim to achieve “quality on demand” to fulfill customers’ needs for
time-to-market delivery, reliable quality, and market competitiveness over a broad range of products.
Q&R technical services assist customers in the technology developmental stages to design in superior product reliability. Since
2008, Q&R has worked with R&D to successfully establish and implement new qualification methodologies for High-k/Metal
Gate (HKMG), and since 2013, for FinFET structures. In May 2012, Q&R began collaborating with Semiconductor Equipment and
Material International (SEMI) through a joint IC Quality Committee to enhance product quality of the semiconductor supply chain.
Recently, Q&R started working with R&D and the Backend Technology and Service Division to complete the Package-on-Package
(PoP) technology development and in 2014 began outsourced production at major assembly and testing houses for mobile product
applications. Since then, over-200 million PoP devices have been shipped to customers without major quality issues.
In 2014, Q&R conducted a deep-dive audit on new material suppliers for 20nm/16nm advanced technology and announced the
incoming material quality requests to enhance the suppliers’ delivery quality. In 2015, Q&R extended the audit scope to include
10nm advanced technology suppliers and encouraged these suppliers to join the National Quality Control Circle Competition for
self-initiative quality improvement. Most advanced technology material suppliers have achieved the goal of three sigma process
control. Q&R also implemented innovative statistical matching methodologies to enlarge the manufacturing window with better
quality control. The scope of the methodology includes raw materials, facilities, metrology and process tools, wafer acceptance test
(WAT) data and reliability performance. Since 2011, Q&R tightened the post-fab outgoing visual inspection criteria for wafer quality
improvement to Acceptable Quality Level (AQL) 0.4% from AQL 0.65%.
To sustain production quality and minimize risk to customers when deviations occur, manufacturing quality monitoring and event
management span all critical stages – from raw material supplies, mask making, and real-time in-process monitoring, to bumping,
wafer sort and reliability performance. Failure analysis and material and chemical studies play important roles in maintaining TSMC
quality. These capabilities are applied from the early stages of process development through assembly and packaging, including
analysis of incoming materials, airborne molecular contaminants, in-depth materials characterization for process development and
failure analysis of customer returns. In 2015, TSMC continued to invest aggressively in state-of-the-art technology for materials
analysis including electron and ion microscopes and surface analysis equipment. This resulted in further improvement in TSMC
world-class cycle times and capacity in the area of transmission electron microscopy (TEM). Given the changing needs of our
customers and the importance of ensuring the quality of incoming chemicals and materials, TSMC has implemented technologies
to improve detection of metal impurities with a stronger emphasis on dynamic fault isolation and design debugging capabilities
including the successful launch of our first focused ion beam (FIB) system dedicated to circuit editing. As a result, the Company has
improved its ability to detect metal contaminants in incoming chemicals down to the parts-per-trillion level in 2014. Furthermore,
in collaboration with customers and suppliers, significant progress has been made in dynamic fault isolation, traditionally a domain
of integrated device manufacturers and fabless companies. TSMC improved the efficiency of these types of analyses through
automation in 2015. With the growing presence of TSMC in the integrated circuit packaging area, the Company also bolstered
failure analysis capabilities for multichip packages. These
efforts, including the addition of new capabilities, will continue
into 2016.
By facilitating fine bump pitch lead-free backend solutions
for customer products, TSMC helped achieve compliance
with the electronic industry’s lead-free and green IC package
policies. By collaborating with the major outsource assembly
and testing subcontractors, Q&R qualified and released Cu
bump with elongated shape lead-free bumping and Cu
bumping. This made possible lead-free Cu bump packages
for 16nm FinFET technology products. It also enabled TSMC
customers to introduce lead-free 16nm FinFET products with
excellent assembly quality, and over 40 million units were
delivered without major quality issues in 2015. Q&R also
worked with R&D and qualified InFO technology through
both component level and board level reliability validation
to allow customer product implementation beginning in the
fourth quarter of 2015. For mainstream technologies, Q&R
qualified extreme low-leakage and high-endurance embedded
Flash IP, Integrated Passive Device (IPD), and a hybrid of
copper and copper-aluminum technology. Q&R continues
to build reliability testing and monitoring to ensure excellent
manufacturing quality of specialty technologies on automotive,
high-voltage products, CMOS image sensors, embedded-Flash
memory and micro-electro-mechanical system products.
Q&R is also responsible for leading the Company towards
the ultimate goal of zero-defect production through the use
of continuous improvement programs. Periodic customer
feedback indicates that products shipped from TSMC
have consistently met or exceeded their field quality and
reliability requirements. In 2015, a third-party audit verified
the effectiveness of TSMC quality management systems in
compliance with ISO/TS 16949: 2009 and IECQ QC 080000:
2012 certificates requirements.
5.4 Customer Trust
5.4.1 Customers
TSMC’s customers worldwide have a variety of successful
product specialties and excellent performance records in
various segments of the semiconductor industry. Customers
include fabless semiconductor companies, systems companies,
and integrated device manufacturers such as Advanced Micro
Devices, Inc., Broadcom Corporation, Huawei Tech, Marvell
Technology Group Ltd., MediaTek Inc., NVIDIA Corporation,
NXP Semiconductors N.V., OmniVision Technologies
Inc., Qualcomm Inc., Sony Corporation, Spreadtrum
Communications, Inc. Texas Instruments Inc., and many more.
Customer Service
TSMC believes that providing superior service is critical to
enhancing customer satisfaction and loyalty, which is very
important to retaining existing customers, attracting new
customers, and strengthening customer relationships. With
a dedicated customer service team as the main contact
window for coordination and facilitation, TSMC strives to
provide world-class design support, mask making, wafer
manufacturing, and backend services to achieve an optimum
experience for customers and, in return, to gain customer trust
and sustain company profitability.
To facilitate customer interaction and information access on
a real-time basis, TSMC-Online offers a suite of web-based
applications that provide an active role in design, engineering,
and logistics collaborations. Customers have 24/7 access
to critical information and customized reports. Design
Collaboration focuses on content availability and accessibility,
with close attention to complete, accurate, and current
information at each level of the design life cycle. Engineering
Collaboration includes online access to engineering lots, wafer
yields, wafer acceptance test (WAT) analysis, and quality
reliability data. Logistics Collaboration provides access to
data on any given order status in wafer fabrication, backend
process, and shipping.
Customer Satisfaction
To assess customer satisfaction and to ensure that our
customer needs are appropriately understood, TSMC conducts
the Annual Customer Satisfaction Survey (ACSS) with most
active customers, either by web or interview through an
independent consultancy.
Complementary to the survey, Quarterly Business Reviews
(QBRs) are also conducted by the customer service team so
that customers can give feedback to TSMC on a regular basis.
Through surveys, feedback reviews and intensive interaction
with customers, TSMC is able to maintain close touch for better
service and collaboration.
Customer feedback is routinely reviewed and considered by
executives and then developed into appropriate improvement
plans, all-in-all becoming an integral part of the customer
satisfaction process with a complete closed loop. TSMC has
maintained a focus on customer survey data not only to
evaluate past performance but also as a base to identify future
focus areas. TSMC acts on the belief that customer satisfaction
leads to loyalty, and customer loyalty leads to higher levels of
retention and expansion.
072
073
Customers that Accounted for at Least 10% of Annual Consolidated Net Revenue
Unit: NT$ thousands
Customer
Customer A
Customer B
Others
Total Net Revenue
2015
2014
Net Revenue
As % of 2015 Total
Net Revenue
Relation to TSMC
Net Revenue
As % of 2014 Total
Net Revenue
Relation to TSMC
134,158,421
134,117,206
575,221,741
843,497,368
None
None
16%
16%
68%
100%
157,631,427
71,184,627
533,990,411
762,806,465
21%
None
9%
None
70%
100%
5.4.2 Open Innovation Platform® (OIP) Initiative
Innovation has long been both an exciting proposition and a challenge. Competition among semiconductor companies is growing
more intense in the face of increasing customer consolidation and the commoditization of technology at more mature, conventional
levels. Companies must find ways to continue innovating in order to survive and prosper. One way to accelerate innovation is
through active collaboration with external partners. At TSMC this is known as “open innovation”. It is an “outside in” approach
to complement traditional “inside out” methods. TSMC has adopted this path to innovate via its Open Innovation Platform® (OIP)
initiative, which is a key part of the TSMC Grand Alliance.
The OIP initiative is a comprehensive design technology infrastructure that encompasses all critical IC implementation areas to
reduce design barriers and improve first-time silicon success. OIP promotes the speedy implementation of innovation amongst the
semiconductor design community and its ecosystem partners with TSMC’s IP, design implementation and DFM capabilities, process
technology and backend services.
A key element of OIP is a set of ecosystem interfaces and collaborative components initiated and supported by TSMC that more
efficiently empower innovation throughout the supply chain and, in turn, drive the creation and sharing of newly created revenue
and profits. TSMC’s Active Accuracy Assurance (AAA) initiative is critical to OIP, providing the accuracy and quality required by the
ecosystem interfaces and collaborative components.
TSMC’s Open Innovation model brings together the creative thinking of customers and partners under the common goal of
shortening design time, time-to-volume, time-to-market and, ultimately, time-to-revenue. The model features:
● The foundry segment’s earliest and most comprehensive electronic design automation (EDA) certification program, delivering
timely design tool enhancement required by new process technologies;
● The foundry segment’s largest, most comprehensive and robust silicon-proven IP (intellectual properties) and library portfolio, and;
● Comprehensive design ecosystem alliance programs covering market-leading EDA, library, IPs, and design service partners.
TSMC’s OIP Alliance consists of 23 EDA partners, 43 IP partners, and 25 design service partners. TSMC and its partners work
together proactively and engage much earlier and deeper than before in order to address mounting design challenges at advanced
technology nodes. Through this early and intensive collaboration effort, TSMC OIP is able to deliver the needed design infrastructure
with timely enhancement of EDA tools, early availability of critical IPs and quality design services when customers need them. Taking
full advantage of the process technologies once they reach production-ready maturity is critical to customers’ success.
In September 2015, TSMC hosted an OIP Ecosystem Forum at the Santa Clara Convention Center in California, with keynote
addresses from OIP ecosystem partners as well as TSMC executives. The forum was well attended by both customers and ecosystem
partners and demonstrated the value of collaboration through OIP to nurture innovations.
TSMC’s OIP Partner Management Portal facilitates communication with our ecosystem partners for efficient business productivity.
Designed with an intuitive interface, this portal can be accessed via a direct link from TSMC-Online.
5.5 Employees
5.5.1 Human Capital
Human capital is one of TSMC’s most important assets. The
Company is committed to providing quality jobs with good
compensation, meaningful work, and a safe work environment
for its employees. Moreover, TSMC is dedicated to fostering a
dynamic, enjoyable work environment. The Company’s efforts
in fostering a “Great Place to Work” are highly recognized, and
TSMC has received many awards.
TSMC believes that all employees should be treated with
dignity and respect. The Company is committed to upholding
workers’ rights and respects internationally proclaimed human
rights, as outlined by the United Nations Universal Declaration
on Human Rights and the International Labor Organization’s
fundamental conventions on core labor standards.
At the end of 2015, TSMC and its subsidiaries had over 45,272
employees worldwide, including 4,669 managers, 19,645
professionals, 3,789 assistants, and 17,169 technicians. The
following table summarized TSMC workforce at the end of
February 2016:
Workforce Structure for TSMC and Its Subsidiaries
2014/12/31
2015/12/31
(Note)
2016/02/29
Job
Total
Gender
Education
Managers
Professionals
Assistant Engineer/
Clerical
Technician
Male (%)
Female (%)
Ph.D.
Master’s
Bachelor’s
Other Higher
Education
High School
Average Age (years)
Average Years of Service (years)
4,385
18,552
3,530
17,124
43,591
58.0%
42.0%
4.2%
37.9%
26.7%
11.4%
19.8%
34.1
6.9
4,669
19,645
3,789
17,169
45,272
58.7%
41.3%
4.4%
39.2%
26.2%
12.2%
18.0%
34.6
7.5
4,738
19,702
3,797
17,069
45,306
59.0%
41.0%
4.4 %
39.4 %
26.3 %
12.2 %
17.7%
34.8
7.6
Note: The data shown no longer include TSMC Solid State Lighting, which was sold to Epistar
Corporation in February 2015. In addition, TSMC Solar ceased manufacturing operations in
August 2015 and was merged into TSMC on December 14, 2015.
5.5.2 Recruitment
TSMC’s growth depends on the continued contributions
of its devoted employees. In order to strengthen growth
momentum, the Company is dedicated to recruiting top-notch
professionals for all positions available. TSMC is an equal
employment opportunity employer and operates on the
principles of open-and-fair recruitment. The Company evaluates
all candidates according to their qualifications as related to the
requirement of each position without regard to race, gender,
age, religion, nationality or political affiliation.
TSMC’s continuous growth requires constant talent sourcing
and recruitment activities to support its business. The Company
recruited over 3,800 employees in 2015, including over 2,700
managers, professionals, and administrative staffs, as well as
over 1,100 assistants and technicians.
5.5.3 People Development
Employee development is an integral and critical factor for the
growth of a company and should be systematic, disciplined
and planned. TSMC is committed to cultivating a consistent
and diverse learning environment. To this end, the Company
has initiated the “TSMC Employee Training and Education
Procedure” to ensure the Company’s and the individuals’
development objectives can be achieved through the
integration of internal and external training resources.
Based on the nature of the individual’s job, work performance
and career development path, the Individual Development Plan
(IDP) is provided. At the same time, TSMC also actively develops
talent and creates a high-performance work environment
through development programs based on business needs. The
Company provides employees a diverse network of learning
resources, including on-the-job training, classroom training,
e-learning, coaching, mentoring, and job rotation.
The Company provides employees with a wide range of on-site
general, professional and management training programs. In
addition to engaging external experts as trainers, hundreds
of TSMC employees are trained to be qualified instructors to
deliver their valuable know-how in internal training courses.
074
075
TSMC’s compensation program includes a monthly salary, an
employee cash bonus based on quarterly business results, and
employees’ profit sharing bonus based on annual profit.
meetings, are in place to provide timely support. TSMC’s continuous efforts lie in reinforcing mutual and timely employee
communication, based on multiple channels and platforms, which in turn fosters harmonious labor relations and creates a win-win
situation for the Company and employees.
TSMC’s training programs include:
● New Employee Training: includes basic training and job
orientation for new employees. Furthermore, newcomers’
managers and the Company’s well-established Buddy System
are in place to support newcomers in their assimilation
process in both corporate culture and work requirements.
● General Training: refers to training required by government
regulations and/or Company policies, as well as training on
general subjects for all employees or employees of different
job functions. Training topics include industry-specific
safety, workplace health and safety, quality, fab emergency
response, languages, and personal effectiveness.
● Professional/Functional Training: provides technical and
professional training required by different functions within
the Company. TSMC offers training courses on equipment
engineering, process engineering, accounting, information
technology, and so forth.
● Management Training: programs are tailored to the needs of
managers at all levels, including new, experienced, and senior
managers; optional courses are also available.
● Direct Labor (DL) Training: enables production line employees
to acquire the knowledge, skills and attitudes they need
to perform their jobs well and to pass the certification for
operating equipment. Training includes DL Skill Training,
Technician “Train-the-Trainer” Training, and Manufacturing
Leader Training.
The purpose of the employee cash bonus and employees’ profit
sharing bonus programs is to reward employee contributions
appropriately, to encourage employees to work consistently
toward ensuring the success of TSMC, and to link employees’
interests with those of TSMC’s shareholders. The Company
determines the amount of the cash bonus and employees’
compensation based on operating results and industry
practice in the Republic of China. The amount and form of the
employee cash bonus and employees’ profit sharing bonus are
recommended by the Compensation Committee. In addition,
the profit sharing bonus is distributed upon the approval of
the Board of Directors. Individual awards are based on each
employee’s job responsibility, contribution and performance.
In addition to providing employees of TSMC’s overseas
subsidiaries with a locally competitive base salary, the Company
grants annual bonuses as a part of total compensation. The
annual bonuses are granted in line with local regulations,
market practices, and the overall operating performance of
each subsidiary, to encourage employee commitment and
development within the Company.
● Customized Training: programs are tailored to the needs of
5.5.5 Employee Engagement
the organization and/or the people development plan.
In 2015, TSMC conducted 1,337 internal training sessions,
which translated to a companywide total of 770,548 training
hours with the participation of 527,553 attendees. Employees
on average attended over 17 hours of training with the
training expenses reaching NT$85,540,407.
Apart from internal training resources, our employees are
also subsidized when pursuing external short-term courses,
for-credit courses and degrees.
5.5.4 Compensation
TSMC provides a diversified compensation program that is
competitive externally, fair internally, and adapted locally.
TSMC upholds the philosophy of sharing wealth with
employees in order to attract, retain, develop, motivate
and reward talented employees. With excellent operating
performance, employment at TSMC entitles employees to a
comprehensive compensation and benefits program above the
industry average.
Taiwan’s Labor Standards Act and the fundamental convention
of International Labour Organization prohibit all forms of
forced or compulsory labor. TSMC stands firmly with the
protocols and has never forced labor from involuntary persons
or menaced them with any penalty.
The Company encourages employees to maintain a healthy
and well-balanced life while achieving high efficiency and
effectiveness at work. To enrich employees’ work experience,
TSMC continuously implements programs to enhance their
communication, well-being, benefit, recognition and rewards.
The various initiatives include the following communication,
benefit and recognition programs:
Employee Communication
TSMC values two-way communication and is committed to
keeping communication channels between the management
level, subordinates and peers open and transparent. To ensure
that employees’ opinions and voices are heard, and their issues
are addressed effectively, impartial submission mechanisms,
including quarterly labor-management communication
A host of two-way communication channels are constructed to maintain the free flow of information between managers and
employees, including:
● Regular communication meetings for various levels of managers and employees.
● Periodic employee satisfaction surveys, with follow-up actions based on the survey findings.
● The corporate intranet, myTSMC, an internal website featuring Chairman’s talk, corporate messages, executive interviews, and
other activities of interest to employees.
● eSilicon Garden, a website hosting TSMC’s internal electronic publications providing real-time updates on major activities of the
Company, as well as inspirational content featuring outstanding teams and individuals.
● Complaints regarding major management, financial, and auditing issues are handled through two channels, both with high level
of confidentiality, including the independent Audit Committee and the Ombudsman system led by an appointed Vice President.
● Employee Opinion Box provides a channel for employees to express their suggestions or opinions regarding their work and the
overall work environment.
● Fab Caring Circle in each fab addresses the issues related to employees’ work and personal life; the system is dedicated mainly to
the Company’s direct labor workers.
TSMC Internal Communication Structure
Employees
Face-to-Face Meeting
● Functional/Work Unit/Skip-Level
Announcement
Fab/Functional Activity
Employee Portal
Employee Survey
HR Area Service Team
Communication Meeting by Request
eSilicon Garden
Announcement
Company-Wide Activity
Employee Assistance Program
● Wellness Center
● Counseling Service
● EWC Emergency Assistance
Employee Voice Channels
● Ombudsman System
● Internal Audit Committee
● Sexual Harassment Investigation
Committee
● Employee Opinion Box
● Fab Caring Circle
● Dadicated Line & SMS
Managers of All
Levels
Human Resources
System /
Committee Chair
Board of Directors and
Management Team
Core Values are the foundation of our Company. As part of our practice on “Integrity”, we abide by the law and go above and
beyond to act in accordance to the spirits of the law. With ‘commitment’, we provide employees with meaning jobs, safe working
environment and competitive packages in compensation and benefits. With regards to Labor Union, TSMC respects employees’
rights entitled by global labor standards and local regulations, including UN Global Compact’s Ten Principles and Taiwan’s
Labor Union Act. In addition, as a member of the Electronic Industry Citizenship Coalition (EICC), TSMC adopts the EICC Code of
Conduct (http://www.tsmc.com/english/csr/eicc_membership.htm) and does not impede employees’ freedom of association. The
principle and regulation above not only align with TSMC’s goal, but also provide practical standards and measurement for our
implementation.
076
077
The relationship between our management level and
employees has been harmonious over the years, thanks to
our transparent and effective communication channels;
though employees possess the right to form a labor union, no
employees have pursued this avenue and issued a request to
form one so far, underlying the achievement of the Company’s
dedication.
The award programs include:
● TSMC Medal of Honor, presented by the Chairman,
recognizes those who contribute significantly to the
Company’s business performance.
● TSMC Academy recognizes outstanding TSMC scientists
and engineers whose individual technical capabilities make
significant contributions to the Company.
● Outstanding Engineer Award for each fab and Total Quality
5.5.7 Retirement Policy
TSMC’s retirement policy is set according to the Labor
Standards Act and Labor Pension Act of the Republic of China.
With the Company’s sound financial system, TSMC ensures
employees a solid pension contribution and payments, which
encourages employees to set long-term career plans and
deepens their commitment to TSMC.
In 2015 and as of the date of this Annual Report, there have
been no losses resulting from labor disputes.
Excellence Award recognize employees’ continuous efforts in
creating value for the Company.
5.6 Material Contracts
Employee Benefit Programs
● Convenient on-site services: cafeterias, laundry services,
convenience stores, travel, banking, housing, and commuting
assistance – are accessible for employees in the fabs.
● Comprehensive health enhancement and management
programs: health enhancement programs include weight
control, in-fab clinic and dentist services, smoking cessation,
massage service, as well as seminars to raise personal
health awareness. Health management programs include
post health-exam follow-up activities for abnormal cases,
prevention of cerebrovascular disease, ergonomic hazards
management, and maternal care and protection. Employee
assistance programs include five free annual counseling
sessions for mental health and financial/legal issues, with
extensions available depending on the individual’s needs.
Diverse employee welfare programs: including 76 hobby
clubs, 22 speeches covering various topics, Sports Day, and
Family Day. In addition, holiday bonuses, marriage bonuses,
condolence allowances and emergency subsidies are also
available to address employees’ needs.
● Premium Sports Center: a variety of workout facilities available
to all employees and their families, as well as exercise sessions
conducted by professional instructors.
● Flexible Preschool Service: childcare service, operated to
meet employees’ work schedules, is available in three fabs in
Hsinchu and Tainan.
Employee Recognition
TSMC sponsors various internal award programs to recognize
outstanding achievements by employees, both individual and
as a team level. With these award programs, TSMC aims to
encourage continued employee development, which in turn
adds to the Company’s competitive advantage.
● Service Award represents TSMC’s appreciation of senior
employees’ dedication and commitment to the Company.
● Excellent Instructor Award praises the outstanding
performance and contribution of the Company’s internal
instructors in training courses for employees.
● Function-wide awards dedicated to innovation, including Idea
Forum, and TQE Awards, etc.
Apart from corporate-wide awards, in 2015 distinguished
TSMC employees continued to be recognized through a host
of prestigious external awards, including the Outstanding
Engineer Award, the Outstanding Young Engineer Award, and
the National Manager Excellence Award.
5.5.6 Retention
Continuous growth is a major component of TSMC’s
commitment to its stockholders and employees, and the
retention of outstanding employees is crucial in fulfilling
this commitment. From employee’s initial orientation
and adaptation to professional and career development,
TSMC works proactively to provide employees with good
compensation, innovative, meaningful and enjoyable work, as
well as a safe work environment.
TSMC continues to dedicating in employee retention, the
Company’s total compensation highly surpasses the average
compensation among industries. Also, the Company provides
surpassing leave programs for long-term retention planning.
For example, Ministry of Labor announced the amendment
of “Enforcement Rules of the Labor Standards Act“ in 2015:
to reduce national holidays from 19 days to 12 days. TSMC
remains 19-day national holidays.
In 2015, the Company recorded a healthy and manageable
turnover rate of 5%.
Investment Agreement and Shareholder Agreement
Term of Investment Agreement:
Effective as of 08/05/2012
Term of Shareholder Agreement:
Effective as of 10/31/2012 and may be terminated as provided
in the agreement
Contracting Party:
ASML Holding N.V. (ASML)
Summary:
TSMC joined the Customer Co-Investment Program of
ASML Holding N.V. (ASML) and entered into the investment
agreement and shareholder agreement. The agreements
include an investment of EUR837,815,664 by TSMC
Global to acquire a non-voting 5% in ASML’s equity with a
lock-up period of 2.5 years. TSMC Global has acquired the
aforementioned equity on October 31, 2012. The lock-up
period expired on May 1, 2015 and as of October 8, 2015, all
ASML shares have been disposed.
Research and Development Funding Agreement
Term of Agreement:
10/31/2012 - 12/31/2017
Contracting Party:
ASML Holding N.V. (ASML)
Summary:
TSMC shall provide EUR276 million to ASML’s research and
development programs from 2013 to 2017.
Note: TSMC is not currently party to any other material
contract, other than contracts entered into in the
ordinary course of our business. The Company’s
“Significant Contingent Liabilities and Unrecognized
Commitments” are disclosed in Annual Report section
(II), Financial Statements, page 78-79.
078
079
6. Financial Highlights and Analysis
6.1 Financial Highlights
6.1.1 Condensed Balance Sheet
Condensed Balance Sheet from 2012 to 2015 (Consolidated) (Note 1)
Unit: NT$ thousands
Item
Current Assets
Long-term Investments (Note 2)
Property, Plant and Equipment
Intangible Assets
Other Assets (Note 3)
Total Assets
Current Liabilities
Before Distribution
After Distribution
Noncurrent Liabilities
Total Liabilities
Before Distribution
After Distribution
Equity Attributable to Shareholders of the Parent
Capital Stock
Capital Surplus
Retained Earnings
Before Distribution
After Distribution
Others
Equity Attributable to Shareholders of the Parent
Before Distribution
After Distribution
Noncontrolling Interests
Total Equity
Before Distribution
After Distribution
2012
2013
250,325,436
65,717,240
617,562,188
10,959,569
16,790,075
961,354,508
148,473,947
226,247,254
89,786,655
238,260,602
316,033,909
259,244,357
55,675,340
408,411,468
330,638,161
(2,780,485)
720,550,680
642,777,373
2,543,226
723,093,906
645,320,599
358,486,654
89,183,810
792,665,913
11,490,383
11,228,217
2014
(Adjusted)
626,565,639
30,056,279
818,198,801
13,531,510
6,696,857
2015
746,743,991
34,993,583
853,470,392
14,065,880
8,244,452
1,263,054,977
1,495,049,086
1,657,518,298
189,777,934
267,563,785
225,501,958
415,279,892
493,065,743
259,286,171
55,858,626
518,193,152
440,407,301
14,170,306
847,508,255
769,722,404
266,830
847,775,085
769,989,234
201,013,629
317,697,110
247,707,125
448,720,754
565,404,235
259,296,624
55,989,922
705,165,274
588,481,793
25,749,291
1,046,201,111
929,517,630
127,221
1,046,328,332
929,644,851
212,228,594
(Note 4)
222,655,225
434,883,819
(Note 4)
259,303,805
56,300,215
894,293,586
(Note 4)
11,774,113
1,221,671,719
(Note 4)
962,760
1,222,634,479
(Note 4)
080
080
081
081
Note 1: 2012-2013 financial statements are prepared in accordance with 2010 Taiwan-IFRSs version. Starting in 2015, financial statements are prepared in accordance with 2013 Taiwan-IFRSs version;
financial statements are adjusted to retrospectively apply newly effected GAAP. Adjustments for the retrospective application of newly effected GAAP for 2014 include a decrease of NT$84,759
thousand in total assets, a decrease of NT$737,344 thousand in total liabilities before distribution and an increase of NT$652,585 thousand in total equity before distribution.
Note 2: Long-term investments consist of noncurrent available-for-sale financial assets, held-to-maturity financial assets, financial assets carried at cost and investments accounted for using equity method.
Note 3: Other assets consist of deferred income tax assets, refundable deposits, and other noncurrent assets.
Note 4: Pending for shareholders’ approval.
Condensed Balance Sheet － 2011 (Consolidated)－R.O.C. GAAP
Condensed Balance Sheet － 2011 (Unconsolidated)－R.O.C. GAAP
Unit: NT$ thousands
Item
Current Assets
Long-term Investments
Fixed Assets
Other Assets
Total Assets
Current Liabilities
Before Distribution
After Distribution
Long-term Liabilities
Other Liabilities
Total Liabilities
Before Distribution
After Distribution
Capital Stock
Capital Surplus
Retained Earnings
Before Distribution
After Distribution
Cumulative Transaction Adjustments
Unrealized Gain/Loss on Financial Instruments
Equity Attributable to Shareholders of the Parent
Before Distribution
After Distribution
Minority Interests
Total Equity
Before Distribution
After Distribution
Condensed Balance Sheet from 2012 to 2015 (Unconsolidated) (Note 1)
Unit: NT$ thousands
Item
Current Assets
Long-term Investments (Note 2)
Property, Plant and Equipment
Intangible Assets
Other Assets (Note 3)
Total Assets
Current Liabilities
Before Distribution
After Distribution
Noncurrent Liabilities
Total Liabilities
Before Distribution
After Distribution
Equity
Capital Stock
Capital Surplus
Retained Earnings
Before Distribution
After Distribution
Others
Total Equity
Before Distribution
After Distribution
2012
205,819,614
139,634,200
586,636,036
6,449,837
13,597,966
952,137,653
144,528,616
222,301,923
87,058,357
231,586,973
309,360,280
259,244,357
55,675,340
408,411,468
330,638,161
(2,780,485)
720,550,680
642,777,373
2011
225,260,396
34,458,504
490,374,916
24,171,126
774,264,942
117,006,687
194,755,355
20,458,493
4,756,211
142,221,391
219,970,059
259,162,226
55,846,357
322,191,155
244,442,487
(6,433,369)
(1,172,855)
629,593,514
551,844,846
2,450,037
632,043,551
554,294,883
2015
426,913,080
326,330,737
831,784,912
9,391,418
5,265,368
2013
257,623,763
165,545,159
770,443,494
7,069,456
7,897,131
2014
(Adjusted)
370,949,497
242,395,596
796,684,361
8,996,810
3,935,389
1,208,579,003
1,422,961,653
1,599,685,515
187,195,744
264,981,595
173,875,004
361,070,748
438,856,599
259,286,171
55,858,626
518,193,152
440,407,301
14,170,306
847,508,255
769,722,404
178,261,092
294,944,573
198,499,450
376,760,542
493,444,023
259,296,624
55,989,922
705,165,274
588,481,793
25,749,291
194,299,278
(Note 4)
183,714,518
378,013,796
(Note 4)
259,303,805
56,300,215
894,293,586
(Note 4)
11,774,113
1,046,201,111
929,517,630
1,221,671,719
(Note 4)
Unit: NT$ thousands
Item
Current Assets
Long-term Investments
Fixed Assets
Other Assets
Total Assets
Current Liabilities
Before Distribution
After Distribution
Long-term Liabilities
Other Liabilities
Total Liabilities
Before Distribution
After Distribution
Capital Stock
Capital Surplus
Retained Earnings
Before Distribution
After Distribution
Cumulative Transaction Adjustments
Unrealized Gain/Loss on Financial Instruments
Total Equity
Before Distribution
After Distribution
6.1.2 Condensed Statement of Comprehensive Income / Condensed Statement of Income
Condensed Statement of Comprehensive Income from 2012 to 2015 (Consolidated) (Note 1)
Unit: NT$ thousands (Except EPS: NT$)
Item
Net Revenue
Gross Profit
Income from Operations
Non-operating Income and Expenses
Income before Income Tax
Net Income
Other Comprehensive Income for the Year, Net of Income Tax
Total Comprehensive Income for the Year
Net Income (Loss) Attributable to:
Shareholders of the Parent
Noncontrolling Interests
Total Comprehensive Income (Loss) Attributable to:
Shareholders of the Parent
Noncontrolling Interests
Basic Earnings Per Share (Note 2)
2012
506,745,234
244,137,107
181,176,868
499,588
181,676,456
166,123,802
4,252,632
170,376,434
166,318,286
(194,484)
170,521,543
(145,109)
6.42
2013
597,024,197
280,945,507
209,429,363
6,057,759
215,487,122
188,018,937
16,352,248
204,371,185
188,146,790
(127,853)
204,505,782
(134,597)
7.26
2014
(Adjusted)
762,806,465
377,722,016
295,870,309
6,208,048
302,078,357
263,763,958
11,805,021
275,568,979
263,881,771
(117,813)
275,670,991
(102,012)
10.18
2011
158,563,352
129,400,844
454,373,533
19,070,145
761,407,874
109,514,430
187,263,098
18,000,000
4,299,930
131,814,360
209,563,028
259,162,226
55,846,357
322,191,155
244,442,487
(6,433,369)
(1,172,855)
629,593,514
551,844,846
2015
843,497,368
410,394,893
320,047,775
30,381,136
350,428,911
306,556,167
(14,714,182)
291,841,985
306,573,837
(17,670)
291,867,757
(25,772)
11.82
Note 1: 2012-2013 financial statements are prepared in accordance with 2010 Taiwan-IFRSs version. Starting in 2015, financial statements are prepared in accordance with 2013 Taiwan-IFRSs version;
financial statements are adjusted to retrospectively apply newly effected GAAP. Adjustments for the retrospective application of newly effected GAAP for 2014 include a decrease of NT$12,359
thousand in gross profit, a decrease of NT$19,984 thousand in income from operations, a decrease of NT$16,911 thousand in net income and a decrease of NT$46,054 thousand in total
comprehensive income for the year.
Note 2: Based on weighted average shares outstanding in each year.
Note 1: 2012-2013 financial statements are prepared in accordance with 2010 Taiwan-IFRSs version. Starting in 2015, financial statements are prepared in accordance with 2013 Taiwan-IFRSs version;
financial statements are adjusted to retrospectively apply newly effected GAAP. Adjustments for the retrospective application of newly effected GAAP for 2014 include a decrease of NT$82,771
thousand in total assets, a decrease of NT$735,381 thousand in total liabilities before distribution and an increase of NT$652,610 thousand in total equity before distribution.
Note 2: Long-term investments consist of held-to-maturity financial assets, financial assets carried at cost and investments accounted for using equity method.
Note 3: Other assets consist of deferred income tax assets, refundable deposits, and other noncurrent assets.
Note 4: Pending for shareholders’ approval.
082
083
Condensed Statement of Income － 2011 (Consolidated)－R.O.C. GAAP
6.1.3 Financial Analysis
Unit: NT$ thousands (Except EPS: NT$)
Item
Net Sales
Gross Profit
Income from Operations
Non-operating Income and Gains
Non-operating Expenses and Losses
Interest Revenue
Interest Expense
Income before Income Tax
Net Income
Net Income Attributable to Shareholders of the Parent
Basic Earnings Per Share (Note)
Note: Based on weighted average shares outstanding in each year
Condensed Statement of Comprehensive Income from 2012 to 2015 (Unconsolidated) (Note 1)
Unit: NT$ thousands (Except EPS: NT$)
Item
Net Revenue
Gross Profit
Income from Operations
Non-operating Income and Expenses
Income before Income Tax
Net Income
Other Comprehensive Income for the Year, Net of Income Tax
Total Comprehensive Income for the Year
Basic Earnings Per Share (Note 2)
2012
2013
500,369,525
234,850,311
176,820,141
6,932,246
183,752,387
166,318,286
4,203,257
170,521,543
6.42
591,087,600
271,644,860
204,653,892
11,062,658
215,716,550
188,146,790
16,358,992
204,505,782
7.26
2014
(Adjusted)
757,152,389
366,899,120
290,640,302
10,363,515
301,003,817
263,881,771
11,789,220
275,670,991
10.18
2011
427,080,645
194,069,228
141,557,418
5,358,527
1,768,268
1,479,514
626,725
145,147,677
134,453,260
134,201,279
5.18
2015
837,046,888
397,708,840
313,408,698
36,579,970
349,988,668
306,573,837
(14,706,080)
291,867,757
11.82
Note 1: 2012-2013 financial statements are prepared in accordance with 2010 Taiwan-IFRSs version. Starting in 2015, financial statements are prepared in accordance with 2013 Taiwan-IFRSs version;
financial statements are adjusted to retrospectively apply newly effected GAAP. Adjustments for the retrospective application of newly effected GAAP for 2014 include a decrease of NT$12,583
thousand in gross profit, a decrease of NT$19,356 thousand in income from operations, a decrease of NT$17,023 thousand in net income and a decrease of NT$46,150 thousand in total
comprehensive income for the year.
Note 2: Based on weighted average shares outstanding in each year.
Financial Analysis from 2012 to 2015 (Consolidated) (Note 1)
Capital Structure Analysis
Debts Ratio (%)
Long-term Fund to Property, Plant and Equipment (%)
Liquidity Analysis
Current Ratio (%)
Operating Performance
Analysis
Quick Ratio (%)
Times Interest Earned (Times)
Average Collection Turnover (Times)
Days Sales Outstanding
Average Inventory Turnover (Times)
Average Inventory Turnover Days
Average Payment Turnover (Times)
Property, Plant and Equipment Turnover (Times)
Total Assets Turnover (Times)
Profitability Analysis
Return on Total Assets (%)
Return on Equity attributable to Shareholders of the Parent (%)
Operating Income to Paid-in Capital Ratio (%)
Pre-tax Income to Paid-in Capital Ratio (%)
Net Margin (%)
Basic Earnings Per Share (NT$)
Diluted Earnings Per Share (NT$)
2012
24.78
131.63
168.60
142.39
177.92
9.64
37.86
8.38
43.56
19.38
0.91
0.58
19.19
24.68
69.89
70.08
32.78
6.42
6.41
2013
32.88
135.40
188.90
168.57
82.41
9.11
40.06
8.39
43.49
20.01
0.85
0.54
17.11
24.00
80.77
83.11
31.49
7.26
7.26
Cash Flow
Cash Flow Ratio (%)
191.93
183.05
Leverage
Industry Specific Key
Performance Indicator
Cash Flow Adequacy Ratio (%)
Cash Flow Reinvestment Ratio (%)
Operating Leverage
Financial Leverage
Billing Utilization Rate (%) (Note 3)
Advanced Technologies (28-nanometer and below) Percentage of Wafer Sales (%)
Sales Growth (%)
Net Income Growth (%)
94.71
11.46
2.32
1.01
91
12
18.7
23.9
88.35
12.16
2.40
1.01
91
30
17.82
13.12
2014
(Adjusted)
2015
(Note 2)
30.01
158.16
311.70
278.03
94.34
8.12
44.95
7.42
49.19
19.39
0.95
0.55
19.33
27.86
114.10
116.50
34.58
10.18
10.18
209.70
92.15
13.04
2.15
1.01
97
42
27.77
40.25
26.24
169.34
351.86
319.58
110.84
8.37
43.61
6.49
56.24
20.10
1.01
0.54
19.62
27.04
123.43
135.14
36.34
11.82
11.82
249.67
103.82
13.76
2.26
1.01
93
48
10.58
16.18
Condensed Statement of Income － 2011 (Unconsolidated)－R.O.C. GAAP
Note 1: Before 2012, financial statements are prepared in accordance with R.O.C. GAAP. 2012-2013 financial statements are prepared in accordance with 2010 Taiwan-IFRSs version. 2014-2015 financial
Unit: NT$ thousands (Except EPS: NT$)
Item
Net Sales
Gross Profit
Income from Operations
Non-operating Income and Gains
Non-operating Expenses and Losses
Interest Revenue
Interest Expense
Income before Income Tax
Net Income
Basic Earnings Per Share (Note)
Note: Based on weighted average shares outstanding in each year
2011
418,245,493
185,560,865
138,905,763
7,287,046
1,484,965
697,196
445,887
144,707,844
134,201,279
5.18
statements are prepared in accordance with 2013 Taiwan-IFRSs version.
Note 2: The deviation of 2015 vs. 2014 is less than 20%. No further analysis is required.
Note 3: Capacity includes wafers committed by Vanguard and SSMC.
*Glossary
1. Capital Structure Analysis
(1) Debt Ratio = Total Liabilities / Total Assets
(2) Long-term Fund to Property, Plant and Equipment Ratio = (Shareholders’ Equity +
Noncurrent Liabilities) / Net Property, Plant and Equipment
2. Liquidity Analysis
(1) Current Ratio = Current Assets / Current Liabilities
(2) Quick Ratio = (Current Assets - Inventories - Prepaid Expenses) / Current Liabilities
(3) Times Interest Earned = Earnings before Interest and Taxes / Interest Expenses
4. Profitability Analysis
(1) Return on Total Assets = (Net Income + Interest Expenses * (1 - Effective Tax Rate)) /
Average Total Assets
(2) Return on Equity Attributable to Shareholders of the Parent = Net Income Attributable to
Shareholders of the Parent / Average Equity Attributable to Shareholders of the Parent
(3) Operating Income to Paid-in Capital Ratio= Operating Income / Paid-in Capital
(4) Pre-tax Income to Paid-in Capital Ratio = Income before Tax / Paid-in Capital
(5) Net Margin = Net Income / Net Sales
(6) Earnings Per Share = (Net Income Attributable to Shareholders of the Parent - Preferred
Stock Dividend) / Weighted Average Number of Shares Outstanding
3. Operating Performance Analysis
5. Cash Flow
(1) Average Collection Turnover = Net Sales / Average Trade Receivables
(2) Days Sales Outstanding = 365 / Average Collection Turnover
(3) Average Inventory Turnover = Cost of Sales / Average Inventory
(4) Average Inventory Turnover Days = 365 / Average Inventory Turnover
(5) Average Payment Turnover = Cost of Sales / Average Trade Payables
(6) Property, Plant and Equipment Turnover = Net Sales / Average Net Property, Plant and
Equipment
(1) Cash Flow Ratio = Net Cash Provided by Operating Activities / Current Liabilities
(2) Cash Flow Adequacy Ratio = Five-year Sum of Cash from Operations / Five-year Sum of
Capital Expenditures, Inventory Additions, and Cash Dividend
(3) Cash Flow Reinvestment Ratio = (Cash Provided by Operating Activities - Cash Dividends)/
(Gross Property, Plant and Equipment + Long-term Investments + Other Noncurrent Assets
+ Working Capital)
(7) Total Assets Turnover = Net Sales / Average Total Assets
6. Leverage
(1) Operating Leverage = (Net Sales - Variable Cost) / Income from Operations
(2) Financial Leverage = Income from Operations / (Income from Operations - Interest
Expenses)
084
085
Financial Analysis － 2011 (Consolidated)－R.O.C. GAAP
Financial Analysis from 2012 to 2015 (Unconsolidated) (Note)
Capital Structure Analysis
Debts Ratio (%)
Liquidity Analysis
Long-term Fund to Fixed Assets (%)
Current Ratio (%)
Quick Ratio (%)
Times Interest Earned (Times)
Operating Performance Analysis
Average Collection Turnover (Times)
Days Sales Outstanding
Average Inventory Turnover (Times)
Average Inventory Turnover Days
Average Payment Turnover (Times)
Fixed Assets Turnover (Times)
Total Assets Turnover (Times)
Profitability Analysis
Return on Total Assets (%)
Return on Equity (%)
Operating Income to Paid-in Capital Ratio (%)
Pre-tax Income to Paid-in Capital Ratio (%)
Net Margin (%)
Basic Earnings Per Share (NT$)
Diluted Earnings Per Share (NT$)
Cash flow
Cash Flow Ratio (%)
Leverage
Industry Specific Key
Performance Indicator
Cash Flow Adequacy Ratio (%)
Cash Flow Reinvestment Ratio (%)
Operating Leverage
Financial Leverage
Billing Utilization Rate (%) (Note)
Advanced Technologies (28-nanometer and below) Percentage of Wafer Sales (%)
Sales Growth (%)
Net Income Growth (%)
2011
18.37
133.06
192.52
170.06
229.27
10.06
36.29
8.75
41.70
18.77
0.97
0.57
18.08
22.30
54.62
56.01
31.48
5.18
5.18
211.60
101.93
11.12
2.50
1.00
91
1
1.8
-17.0
Note: Capacity includes wafers committed by Vanguard and SSMC.
*Glossary
1. Capital Structure Analysis
(1) Debt Ratio = Total Liabilities / Total Assets
(2) Long-term Fund to Fixed Assets Ratio = (Shareholders’ Equity + Long-term Liabilities) / Net
Fixed Assets
2. Liquidity Analysis
(1) Current Ratio = Current Assets / Current Liabilities
(2) Quick Ratio = (Current Assets - Inventories - Prepaid Expenses) / Current Liabilities
(3) Times Interest Earned = Earnings before Interest and Taxes / Interest Expenses
3. Operating Performance Analysis
(1) Average Collection Turnover = Net Sales / Average Trade Receivables
(2) Days Sales Outstanding = 365 / Average Collection Turnover
(3) Average Inventory Turnover = Cost of Sales / Average Inventory
(4) Average Inventory Turnover Days = 365 / Average Inventory Turnover
(5) Average Payment Turnover = Cost of Sales / Average Trade Payables
(6) Fixed Assets Turnover = Net Sales / Average Net Fixed Assets
(7) Total Assets Turnover = Net Sales / Average Total Assets
4. Profitability Analysis
(1) Return on Total Assets = (Net Income + Interest Expenses * (1 - Effective Tax Rate)) /
Average Total Assets
(2) Return on Equity = Net Income / Average Shareholders’ Equity
(3) Operating Income to Paid-in Capital Ratio = Operating Income / Paid-in Capital
(4) Pre-tax Income to Paid-in Capital Ratio = Income before Tax / Paid-in Capital
(5) Net Margin = Net Income / Net Sales
(6) Earnings Per Share = (Net Income - Preferred Stock Dividend) / Weighted Average Number
of Shares Outstanding
5. Cash Flow
(1) Cash Flow Ratio = Net Cash Provided by Operating Activities / Current Liabilities
(2) Cash Flow Adequacy Ratio = Five-year Sum of Cash from Operations / Five-year Sum of
Capital Expenditures, Inventory Additions, and Cash Dividend
(3) Cash Flow Reinvestment Ratio = (Cash Provided by Operating Activities - Cash Dividends) /
(Gross Fixed Assets + Long-term Investments + Other Assets + Working Capital)
6. Leverage
(1) Operating Leverage = (Net Sales - Variable Cost) / Income from Operations
(2) Financial Leverage = Income from Operations / (Income from Operations - Interest
Expenses)
Capital Structure Analysis
Debt Ratio (%)
Long-term Fund to Property, Plant and Equipment Ratio (%)
Liquidity Analysis
Current Ratio (%)
Operating Performance
Analysis
Quick Ratio (%)
Times Interest Earned (Times)
Average Collection Turnover (Times)
Days Sales Outstanding
Average Inventory Turnover (Times)
Average Inventory Turnover Days
Average Payment Turnover (Times)
Property, Plant and Equipment Turnover (Times)
Total Assets Turnover (Times)
Profitability Analysis
Return on Total Assets (%)
Return on Equity (%)
Operating Income to Paid-in Capital Ratio (%)
Pre-tax Income to Paid-in Capital Ratio (%)
Net Margin (%)
Basic Earnings Per Share (NT$)
Diluted Earnings Per Share (NT$)
Cash flow
Cash Flow Ratio (%)
Leverage
Cash Flow Adequacy Ratio (%)
Cash Flow Reinvestment Ratio (%)
Operating Leverage
Financial Leverage
Analysis of deviation of 2015 vs. 2014 over 20%:
Times Interest Earned (Times) increased by 20% mainly due to increase in pre-tax income.
2012
24.32
137.67
142.41
117.49
195.42
9.87
36.98
9.13
39.97
18.22
0.96
0.58
19.45
24.68
68.21
70.88
33.24
6.42
6.41
189.88
93.23
11.36
2.37
1.01
2013
29.88
132.57
137.62
118.35
104.10
9.26
39.40
9.06
40.30
18.55
0.87
0.55
17.58
24.00
78.93
83.20
31.83
7.26
7.26
179.11
86.78
12.32
2.46
1.01
2014
(Adjusted)
26.48
156.24
208.09
171.82
120.82
8.29
44.02
7.90
46.18
18.64
0.97
0.58
20.22
27.86
112.09
116.08
34.85
10.18
10.18
230.29
90.72
13.30
2.19
1.01
2015
23.63
168.96
219.72
186.00
144.41
8.58
42.54
6.87
53.11
19.73
1.03
0.55
20.42
27.04
120.87
134.97
36.63
11.82
11.82
264.94
102.35
13.85
2.31
1.01
Note: Before 2012, financial statements are prepared in accordance with R.O.C. GAAP. 2012-2013 financial statements are prepared in accordance with 2010 Taiwan-IFRSs version. 2014-2015 financial
statements are prepared in accordance with 2013 Taiwan-IFRSs version.
*Glossary
1. Capital Structure Analysis
(1) Debt Ratio = Total Liabilities / Total Assets
(2) Long-term Fund to Property, Plant and Equipment Ratio = (Shareholders’ Equity +
Noncurrent Liabilities) / Net Property, Plant and Equipment
2. Liquidity Analysis
(1) Current Ratio = Current Assets / Current Liabilities
(2) Quick Ratio = (Current Assets - Inventories - Prepaid Expenses) / Current Liabilities
(3) Times Interest Earned = Earnings before Interest and Taxes / Interest Expenses
3. Operating Performance Analysis
(1) Average Collection Turnover = Net Sales / Average Trade Receivables
(2) Days Sales Outstanding = 365 / Average Collection Turnover
(3) Average Inventory Turnover = Cost of Sales / Average Inventory
(4) Average Inventory Turnover Days = 365 / Average Inventory Turnover
(5) Average Payment Turnover = Cost of Sales / Average Trade Payables
(6) Property, Plant and Equipment Turnover = Net Sales / Average Net Property, Plant and
Equipment
(7) Total Assets Turnover = Net Sales / Average Total Assets
4. Profitability Analysis
(1) Return on Total Assets = (Net Income + Interest Expenses * (1 - Effective Tax Rate))/
Average Total Assets
(2) Return on Equity = Net Income / Average Shareholders’ Equity
(3) Operating Income to Paid-in Capital Ratio= Operating Income / Paid-in Capital
(4) Pre-tax Income to Paid-in Capital Ratio = Income before Tax / Paid-in Capital
(5) Net Margin = Net Income / Net Sales
(6) Earnings Per Share = (Net Income - Preferred Stock Dividend) /Weighted Average Number
of Shares Outstanding
5. Cash Flow
(1) Cash Flow Ratio = Net Cash Provided by Operating Activities / Current Liabilities
(2) Cash Flow Adequacy Ratio = Five-year Sum of Cash from Operations / Five-year Sum of
Capital Expenditures, Inventory Additions, and Cash Dividend
(3) Cash Flow Reinvestment Ratio = (Cash Provided by Operating Activities - Cash Dividends)/
(Gross Property, Plant and Equipment + Long-term Investments + Other Noncurrent Assets
+ Working Capital)
6. Leverage
(1) Operating Leverage = (Net Sales - Variable Cost) / Income from Operations
(2) Financial Leverage = Income from Operations / (Income from Operations - Interest
Expenses)
086
087
Financial Analysis － 2011 (Unconsolidated)－R.O.C. GAAP
6.1.4 Auditors’ Opinions from 2011 to 2015
Capital Structure Analysis
Debt Ratio (%)
Liquidity Analysis
Long-term Fund to Fixed Assets Ratio (%)
Current Ratio (%)
Quick Ratio (%)
Times Interest Earned (Times)
Operating Performance Analysis
Average Collection Turnover (Times)
Days Sales Outstanding
Average Inventory Turnover (Times)
Average Inventory Turnover Days
Average Payment Turnover (Times)
Fixed Assets Turnover (Times)
Total Assets Turnover (Times)
Profitability Analysis
Return on Total Assets (%)
Return on Equity (%)
Operating Income to Paid-in Capital Ratio (%)
Pre-tax Income to Paid-in Capital Ratio (%)
Net Margin (%)
Basic Earnings Per Share (NT$)
Diluted Earnings Per Share (NT$)
Cash flow
Cash Flow Ratio (%)
Cash Flow Adequacy Ratio (%)
Cash Flow Reinvestment Ratio (%)
Operating Leverage
Financial Leverage
Leverage
*Glossary
1. Capital Structure Analysis
(1) Debt Ratio = Total Liabilities / Total Assets
(2) Long-term Fund to Fixed Assets Ratio = (Shareholders’ Equity + Long-term Liabilities) / Net
Fixed Assets
2. Liquidity Analysis
(1) Current Ratio = Current Assets / Current Liabilities
(2) Quick Ratio = (Current Assets - Inventories - Prepaid Expenses) / Current Liabilities
(3) Times Interest Earned = Earnings before Interest and Taxes / Interest Expenses
3. Operating Performance Analysis
(1) Average Collection Turnover = Net Sales / Average Trade Receivables
(2) Days Sales Outstanding = 365 / Average Collection Turnover
(3) Average Inventory Turnover = Cost of Sales / Average Inventory
(4) Average Inventory Turnover Days = 365 / Average Inventory Turnover
(5) Average Payment Turnover = Cost of Sales / Average Trade Payables
(6) Fixed Assets Turnover = Net Sales / Average Net Fixed Assets
(7) Total Assets Turnover = Net Sales / Average Total Assets
2011
17.31
142.52
144.79
122.41
325.54
10.40
35.09
9.61
37.97
18.17
1.02
0.57
18.40
22.30
53.60
55.84
32.09
5.18
5.18
217.99
99.13
11.07
2.54
1.00
Year
2011
2012
2013
2014
2015
CPA
Hung-Peng Lin, Shu-Chieh Huang
Hung-Peng Lin, Shu-Chieh Huang
Yi-Hsin Kao, Hung-Wen Huang
Yi-Hsin Kao, Hung-Wen Huang
Yi-Hsin Kao, Hung-Wen Huang
Audit Opinion
An Unqualified Opinion
An Unqualified Opinion
An Unqualified Opinion
An Unqualified Opinion
An Unqualified Opinion
Deloitte & Touche
12F, No. 156, Sec. 3, Min-Sheng E. Rd., Taipei, Taiwan, R.O.C.
Tel: 886-2-2545-9988
6.1.5 Audit Committee’s Review Report
The Board of Directors has prepared the Company’s 2015 Business Report, Financial Statements, and proposal for allocation of
profits. The CPA firm of Deloitte & Touche was retained to audit TSMC’s Financial Statements and has issued an audit report
relating to the Financial Statements. The Business Report, Financial Statements, and profit allocation proposal have been reviewed
and determined to be correct and accurate by the Audit Committee members of Taiwan Semiconductor Manufacturing Company
Limited. According to Article 14-4 of the Securities and Exchange Act and Article 219 of the Company Law, we hereby submit this
report.
Taiwan Semiconductor Manufacturing Company Limited
Chairman of the Audit Committee: Sir Peter Leahy Bonfield
4. Profitability Analysis
(1) Return on Total Assets = (Net Income + Interest Expenses * (1 - Effective Tax Rate)) /
Average Total Assets
(2) Return on Equity = Net Income / Average Shareholders’ Equity
(3) Operating Income to Paid-in Capital Ratio = Operating Income / Paid-in Capital
(4) Pre-tax Income to Paid-in Capital Ratio = Income before Tax / Paid-in Capital
(5) Net Margin = Net Income / Net Sales
(6) Earnings Per Share = (Net Income - Preferred Stock Dividend) / Weighted Average Number
of Shares Outstanding
5. Cash Flow
(1) Cash Flow Ratio = Net Cash Provided by Operating Activities / Current Liabilities
(2) Cash Flow Adequacy Ratio = Five-year Sum of Cash from Operations / Five-year Sum of
Capital Expenditures, Inventory Additions, and Cash Dividend
(3) Cash Flow Reinvestment Ratio = (Cash Provided by Operating Activities - Cash Dividends) /
(Gross Fixed Assets + Long-term Investments + Other Assets + Working Capital)
6. Leverage
(1) Operating Leverage = (Net Sales - Variable Cost) / Income from Operations
(2) Financial Leverage = Income from Operations / (Income from Operations - Interest
Expenses)
February 2, 2016
6.1.6 Financial Difficulties
The Company should disclose the financial impact to the Company if the Company and its affiliated companies have incurred any
financial or cash flow difficulties in 2015 and as of the date of this Annual Report: None.
6.1.7 Consolidated Financial Statements and Independent Auditors’ Report along with Parent Company Only Financial
Statements and Independent Auditors’ Report
Please refer to Annual Report section (II), Financial Statements.
088
089
6.2 Financial Status and Operating Results
6.2.1 Financial Status
Consolidated
Unit: NT$ thousands
Item
Current Assets
Long-term Investments (Note 2)
Property, Plant and Equipment
Intangible Assets
Other Assets (Note 3)
Total Assets
Current Liabilities
Noncurrent Liabilities
Total Liabilities
Capital Stock
Capital Surplus
Retained Earnings
Others
Equity Attributable to Shareholders of the Parent
Total Equity
2015
746,743,991
34,993,583
853,470,392
14,065,880
8,244,452
2014
(Adjusted)
(Note 1)
626,565,639
30,056,279
818,198,801
13,531,510
6,696,857
1,657,518,298
1,495,049,086
212,228,594
222,655,225
434,883,819
259,303,805
56,300,215
894,293,586
11,774,113
1,221,671,719
1,222,634,479
201,013,629
247,707,125
448,720,754
259,296,624
55,989,922
705,165,274
25,749,291
1,046,201,111
1,046,328,332
Difference
120,178,352
4,937,304
35,271,591
534,370
1,547,595
162,469,212
11,214,965
(25,051,900)
(13,836,935)
7,181
310,293
189,128,312
(13,975,178)
175,470,608
176,306,147
%
19%
16%
4%
4%
23%
11%
6%
-10%
-3%
0%
1%
27%
-54%
17%
17%
Note 1: Starting in 2015, financial statements are prepared in accordance with 2013 Taiwan-IFRSs version; financial statements are adjusted to retroactively apply newly effected GAAP. Please refer to 6.1
financial highlights for adjustments for the retrospective application of newly effected GAAP for 2014.
Note 2: Long-term investments consist of noncurrent available-for-sale financial assets, held-to-maturity financial assets, financial assets carried at cost and investments accounted for using equity method.
Note 3: Other assets consist of deferred income tax assets, refundable deposits, and other noncurrent assets.
● Analysis of Deviation over 20%
The increase in other assets was mainly due to increase in deferred income tax assets and other noncurrent assets.
The increase in retained earnings was mainly due to net income of 2015, partially offset by distribution of 2014 earnings.
The decrease in others was mainly due to reclassification of unrealized gain from available-for-sale financial assets to profit or loss
upon disposal, partially offset by increase in currency exchange differences arising from translation of foreign operations in 2015.
● Major Impact on Financial Position
The above deviations had no major impact on TSMC’s financial position.
● Future Plan on Financial Position: Not applicable.
Unconsolidated
Unit: NT$ thousands
Item
Current Assets
Long-term Investments (Note 2)
Property, Plant and Equipment
Intangible Assets
Other Assets (Note 3)
Total Assets
Current Liabilities
Noncurrent Liabilities
Total Liabilities
Capital Stock
Capital Surplus
Retained Earnings
Others
Total Equity
2015
426,913,080
326,330,737
831,784,912
9,391,418
5,265,368
2014
(Adjusted)
(Note 1)
370,949,497
242,395,596
796,684,361
8,996,810
3,935,389
1,599,685,515
1,422,961,653
194,299,278
183,714,518
378,013,796
259,303,805
56,300,215
894,293,586
11,774,113
178,261,092
198,499,450
376,760,542
259,296,624
55,989,922
705,165,274
25,749,291
1,221,671,719
1,046,201,111
Difference
55,963,583
83,935,141
35,100,551
394,608
1,329,979
176,723,862
16,038,186
(14,784,932)
1,253,254
7,181
310,293
189,128,312
(13,975,178)
175,470,608
%
15%
35%
4%
4%
34%
12%
9%
-7%
0%
0%
1%
27%
-54%
17%
Note 1: Starting in 2015, financial statements are prepared in accordance with 2013 Taiwan-IFRSs version; financial statements are adjusted to retroactively apply newly effected GAAP. Please refer to 6.1
financial highlights for adjustments for the retrospective application of newly effected GAAP for 2014.
Note 2: Long-term investments consist of held-to-maturity financial assets, financial assets carried at cost and investments accounted for using equity method.
Note 3: Other assets consist of deferred income tax assets, refundable deposits, and other noncurrent assets.
● Analysis of Deviation over 20%
The increase in long-term investments was mainly due to increase in investments accounted for using equity method in 2015.
The increase in other assets was mainly due to increase in deferred income tax assets.
The increase in retained earnings was mainly due to net income of 2015, partially offset by distribution of 2014 earnings.
The decrease in others was mainly due to decrease in unrealized gain from available-for-sale financial assets, partially offset by
increase in currency exchange differences arising from translation of foreign operations in 2015.
● Major Impact on Financial Position
The above deviations had no major impact on TSMC’s financial position.
● Future Plan on Financial Position: Not applicable.
090
091
6.2.2 Financial Performance
Consolidated
Unit: NT$ thousands
Item
Net Revenue
Cost of Revenue
Gross Profit before Realized Gross Profit on Sales to Associates
Realized Gross Profit on Sales to Associates
Gross Profit
Operating Expenses
Other Operating Income and Expenses, Net
Income from Operations
Non-operating Income and Expenses
Income before Income Tax
Income Tax Expenses
Net Income
Other Comprehensive Income, Net of Income Tax
Total Comprehensive Income for the Year
Total Net Income Attributable to Shareholders of the Parent
Total Comprehensive Income Attributable to Shareholders of
the Parent
2015
843,497,368
433,117,601
410,379,767
15,126
410,394,893
88,466,500
(1,880,618)
320,047,775
30,381,136
350,428,911
43,872,744
306,556,167
(14,714,182)
291,841,985
306,573,837
291,867,757
2014
(Adjusted)
(Note)
762,806,465
385,113,005
377,693,460
28,556
377,722,016
80,849,570
(1,002,137)
295,870,309
6,208,048
302,078,357
38,314,399
263,763,958
11,805,021
275,568,979
263,881,771
275,670,991
Difference
80,690,903
48,004,596
32,686,307
(13,430)
32,672,877
7,616,930
(878,481)
24,177,466
24,173,088
48,350,554
5,558,345
42,792,209
(26,519,203)
16,273,006
42,692,066
16,196,766
%
11%
12%
9%
-47%
9%
9%
-88%
8%
389%
16%
15%
16%
-225%
6%
16%
6%
Note: Starting in 2015, financial statements are prepared in accordance with 2013 Taiwan-IFRSs version; financial statements are adjusted to retroactively apply newly effected GAAP. Please refer to 6.1
financial highlights for adjustments for the retrospective application of newly effected GAAP for 2014.
● Analysis of Deviation over 20%
Decrease in realized gross profit on sales to associates: The decrease was mainly due to higher sales to associates in the fourth
quarter of 2015.
Decrease in other operating income and expenses, net: The decrease was mainly due to impairment losses on property, plant
and equipment and intangible assets, partially offset by net gain on disposal of property, plant and equipment, gain from lease
agreement modification in 2015, and the absence of an impairment loss on noncurrent assets held for sale in 2014.
Increase in non-operating income and expenses: The increase was mainly due to higher net gain on disposal of available-for-sale
financial assets and interest income in 2015.
Decrease in other comprehensive income, net of income tax: The decrease was mainly due to reclassification of unrealized gain from
available-for-sale financial assets to profit or loss upon disposal and decrease in currency exchange gains arising from translation of
foreign operations in 2015.
● Sales Volume Forecast and Related Information
For additional details, please refer to “1. Letter to Shareholders” on pages 2-5 of this Annual Report.
● Major Impact on Financial Performance
The above deviations had no major impact on TSMC’s financial performance.
● Future Plan on Financial Performance: Not applicable.
Unconsolidated
Unit: NT$ thousands
Item
Net Revenue
Cost of Revenue
Gross Profit before Realized Gross Profit on Sales to Subsidiaries
and Associates
Realized Gross Profit on Sales to Subsidiaries and Associates
Gross Profit
Operating Expenses
Other Operating Income and Expenses, Net
Income from Operations
Non-operating Income and Expenses
Income before Income Tax
Income Tax Expenses
Net Income
Other Comprehensive Income, Net of Income Tax
Total Comprehensive Income for the Year
2015
837,046,888
439,356,165
397,690,723
18,117
397,708,840
83,953,035
(347,107)
313,408,698
36,579,970
349,988,668
43,414,831
306,573,837
(14,706,080)
291,867,757
2014
(Adjusted)
(Note)
757,152,389
390,284,816
366,867,573
31,547
366,899,120
76,267,867
9,049
290,640,302
10,363,515
301,003,817
37,122,046
263,881,771
11,789,220
275,670,991
Difference
79,894,499
49,071,349
30,823,150
(13,430)
30,809,720
7,685,168
(356,156)
22,768,396
26,216,455
48,984,851
6,292,785
42,692,066
(26,495,300)
16,196,766
%
11%
13%
8%
-43%
8%
10%
-3936%
8%
253%
16%
17%
16%
-225%
6%
Note: Starting in 2015, financial statements are prepared in accordance with 2013 Taiwan-IFRSs version; financial statements are adjusted to retroactively apply newly effected GAAP. Please refer to 6.1
financial highlights for adjustments for the retrospective application of newly effected GAAP for 2014.
● Analysis of Deviation over 20%
Decrease in realized gross profit on sales to subsidiaries and associates: The decrease was mainly due to higher sales to subsidiaries
and associates in the fourth quarter of 2015.
Decrease in other operating income and expenses, net: The decrease was mainly due to impairment loss on property, plant and
equipment recognized in 2015.
Increase in non-operating income and expenses: The increase was mainly due to higher share of profits of subsidiaries and
associates in 2015.
Decrease in other comprehensive income, net of income tax: The decrease was mainly due to increase in share of other
comprehensive loss of subsidiaries and associates and decrease in currency exchange gains arising from translation of foreign
operations in 2015.
● Sales Volume Forecast and Related Information
For additional details, please refer to “1. Letter to Shareholders” on pages 2-5 of this Annual Report.
● Major Impact on Financial Performance
The above deviations had no major impact on TSMC’s financial performance.
● Future Plan on Financial Performance: Not applicable.
092
093
6.2.3 Cash Flow
Consolidated
Unit: NT$ thousands
Cash Balance 12/31/2014
Net Cash Provided by
Operating Activities in 2015
Net Cash Used in Investing and
Financing Activities in 2015
Cash Balance 12/31/2015
Remedy for Liquidity Shortfall
Investment Plan
Financing Plan
358,449,029
529,879,438
(325,639,537)
562,688,930
None
None
● Analysis of Cash Flow
NT$529.9 billion net cash generated by operating activities: mainly from net income and depreciation and amortization expenses.
NT$217.2 billion net cash used in investing activities: primarily for capital expenditures, partially offset by proceeds from disposal of
available-for-sale financial assets.
NT$108.4 billion net cash used in financing activities: primarily for payment of cash dividends.
● Remedial Actions for Liquidity Shortfall: As a result of positive operating cash flows and cash on-hand, remedial actions are not
required.
● Cash Flow Projection for Next Year: Not applicable.
Unconsolidated
Unit: NT$ thousands
Cash Balance 12/31/2014
Net Cash Provided by
Operating Activities in 2015
Net Cash Used in Investing and
Financing Activities in 2015
Cash Balance 12/31/2015
Remedy for Liquidity Shortfall
Investment Plan
Financing Plan
184,859,232
514,772,831
(435,138,480)
264,493,583
None
None
● Analysis of Cash Flow
NT$514.8 billion net cash generated by operating activities: mainly from net income and depreciation and amortization expenses.
NT$254.8 billion net cash used in investing activities: primarily for capital expenditures.
NT$180.3 billion net cash used in financing activities: primarily for payment of cash dividends and capital injection in subsidiaries.
● Remedial Actions for Liquidity Shortfall: As a result of positive operating cash flows and cash on-hand, remedial actions are not
required.
● Cash Flow Projection for Next Year: Not applicable.
6.2.4 Recent Years Major Capital Expenditures and Impact on Financial and Business
Unit: NT$ thousands
Plan
Actual or Planned Source of Capital
Production Facilities, R&D and
Production Equipment
Cash flow generated from operations
Others
Total
Cash flow generated from operations
Total Amount
for 2015 and 2014
Actual Use of Capital
2015
2014
538,886,932
253,301,353
285,585,579
7,169,931
546,056,863
4,215,482
257,516,835
2,954,449
288,540,028
Based on capital expenditures listed above and projected for 2016, it is estimated that TSMC’s annual production capacity will
increase by approximately 1 million 12-inch equivalent wafers in 2016.
6.2.5 Long-term Investment Policy and Results
TSMC’s long-term investments, accounted for under the equity method, were all made for strategic purposes. However, when an
investment is no longer of strategic value it may be considered a financial investment. In 2015, the investment gain from these
investments amounted to NT$33,694,186 thousand (NT$4,132,128 thousand on a consolidated basis), mainly from the disposal
gain of ASML shares. For future investments, TSMC will continue to focus on strategic purposes through prudent assessments.
6.3 Risk Management
6.3.1 Risk Management (RM) Organization Chart
Our Board of Directors plays a key role in helping the Company
identify and manage economic risks. Our Risk Management
organization periodically briefs our Audit Committee on the
ever-changing risk environment facing TSMC, the focus of
our enterprise risk management, and risk assessment and
mitigation efforts. Our Audit Committee’s Chairperson also
briefs the Board on such discussion and actions.
TSMC and its subsidiaries are committed to proactively and cost
effectively integrating and managing strategic, operational,
financial and hazardous risks together with potential
consequences to operations and financial results. TSMC
operates an Enterprise Risk Management (ERM) program based
on both its corporate vision and its long-term sustainability,
as well as on its responsibility to both industry and society.
ERM seeks to provide the appropriate management of risks by
TSMC on behalf of all stakeholders. A Risk MAP that considers
likelihood and impact severity is applied for identifying and
prioritizing corporate risks. Various risk treatment strategies
are also adopted in response to identified corporate risks.
The Company’s risk management includes the management
of “strategic risks,” “operational risks,” ‘’financial risks,”
“hazardous risks,” and “risks associated with climate change
and non-compliance with environmental and climate related
laws and regulations, and other international laws, regulations
and accords,” etc.
To reduce supply chain risks, TSMC created a cross-functional
taskforce comprised of members from fab operations,
material management, risk management and quality system
management to work with suppliers to develop business
continuity plans, and enhance supply chain resilience capability
to effectively manage the risks faced by its suppliers. As a result
of those efforts, there was no interruption in TSMC’s supply
chain in 2015.
As TSMC continued to expand production capacity with
advanced technology in 2015, seismic protection engineering
design, risk treatment practices and green factory projects were
initiated and implemented, beginning in the design phase for
all new fabs.
Board of Directors/
Audit Committee
RM Steering Committee
Materials Management
and Risk Management
RM Executive Council
RM Program
Organization Functions
● RM Steering Committee
Consists of functional heads (with Internal Audit head sitting as
an observer)
Reports to Audit Committee
Reviews risk control progress
Identifies and approves the prioritized risk lists
● RM Executive Council
Consists of representatives from each function
Identifies and assesses risks
Implements risk control program and ensures effectiveness
Improves transparency and how risks are managed
● RM Program
Coordinates the RM Working Committee activities
Facilitates functional risk management activities
Initiates cross function communication for risk mitigation
Consolidates ERM reports into the RM Steering Committee
6.3.2 Strategic Risks
Risks Associated with Changes in Technology and
Industry
● Industry Developments
The electronics industries and semiconductor market are
cyclical and subject to significant, and often rapid, increases
and decreases in product demand. TSMC’s semiconductor
foundry business is affected by market conditions in such
highly cyclical electronics and semiconductor industries.
Variations in order levels from customers may result in volatility
in the Company’s revenues and earnings.
From time to time, the electronics and semiconductor
industries have experienced significant, and sometimes
prolonged, periods of downturn and overcapacity. Because
TSMC is, and will continue to be, dependent on the
094
095
requirements of electronics and semiconductor companies
for its services, periods of downturn and overcapacity in the
general electronics and semiconductor industries could lead to
reduced demand for overall semiconductor foundry services,
including TSMC’s services. If TSMC cannot take appropriate
actions such as reducing its costs to sufficiently offset declines
in demand, the Company’s revenues, margins, and earnings
will suffer during periods of downturn and overcapacity.
● Changes in Technology
The semiconductor industry and its technologies are
constantly changing. TSMC competes by developing process
technologies using increasingly advanced nodes and on
manufacturing products with more functions. TSMC also
competes by developing new derivative technologies. If
TSMC does not anticipate these changes in technologies and
rapidly develop new and innovative technologies, or if the
Company’s competitors unforeseeably gain sudden access to
additional technologies, TSMC may not be able to provide
foundry services on competitive terms. In addition, TSMC’s
customers have significantly decreased the time in which their
products or services are launched into the market. If TSMC
is unable to meet these shorter product time-to-market,
TSMC risks losing these customers. These factors have also
been intensified by the shift of the global technology market
to consumer driven products such as mobile devices, and
increasing concentration of customers and competition (all
further discussed among these risk factors). If TSMC is unable
to innovate new technologies that meet the demands of its
customers or overcome the above factors, its revenues may
decline significantly. Although TSMC has concentrated on
maintaining a competitive edge in research and development,
if TSMC fails to achieve advances in technologies or processes,
it may become less competitive.
Regarding the response measures for the above-mentioned
risks, please refer to “2.2.4 TSMC Position, Differentiation and
Strategy” on page 10-11 of this Annual Report.
Risks Associated with Decrease in Demand and Average
Selling Price
A vast majority of the Company’s revenue is derived from
customers who use TSMC’s services in communication devices,
personal computers, consumer electronics products and
industrial/standard products. Any decrease in the demand for
any one of these products may decrease the demand for overall
global semiconductor foundry services, including TSMC’s
services, and may adversely affect the Company’s revenues.
Further, semiconductor manufacturing facilities require
substantial investment to construct and are largely fixed cost
assets once they are in operation. Because the Company owns
most of its manufacturing capacities, a significant portion of
TSMC’s operating costs is fixed. In general, these costs do not
decline when customer demand or TSMC’s capacity utilization
rates drop, and thus declines in customer demand, among
other factors, may significantly decrease margins. Conversely,
as product demand rises and factory utilization increases,
the fixed costs are spread over increased output, which can
improve TSMC’s margins. In addition, the historical and current
trend of declining average selling prices (“ASP”) of end use
applications places downward pressure on the prices of the
components that go into such applications. If the ASP of end
use applications continues decreasing, the pricing pressure
on components produced by the Company may lead to a
reduction of TSMC’s revenues, margin and earnings.
Risks Associated with Competition
The markets for TSMC’s foundry services are highly competitive.
TSMC competes with other foundry service providers, as well
as integrated device manufacturers that devote a significant
portion of their manufacturing capacity to foundry operations.
Some of these companies may have access to more advanced
technologies and greater financial resources than TSMC, such
as the possibility of receiving direct or indirect government
bailout, economic stimulus funds, or other incentives that may
be unavailable to TSMC.
The Company’s competition may, from time to time, also
decide to undertake aggressive pricing initiatives in one or
several technology nodes. Increases in these competitive
activities may decrease TSMC’s customer base, its ASP, or both.
If TSMC is unable to compete with any and each of these
new competitors with better technologies and manufacturing
capacity and capabilities, TSMC risks losing customers to these
new contenders.
Risks Associated with Changes in the Government
Policies and Regulatory Environment
TSMC management closely monitors all domestic and foreign
governmental policies and regulations that might impact
TSMC’s business and financial operations. As of February 29,
2016, the following changes or developments in governmental
policies and regulations may influence the Company’s business
operations:
The Taiwan Financial Supervisory Commission (FSC) requires
listed companies, starting from January 1, 2015, to prepare
their consolidated financial statements in accordance with
the 2013 version of following FSC endorsed standards
and interpretations: “International Financial Reporting
Standards,” “International Accounting Standards,” and
relevant Interpretations (collectively, “2013 Taiwan-IFRSs
version”). TSMC has already prepared its 2015 annual and
interim consolidated financial statements in accordance with
2013 Taiwan-IFRSs version and the Guidelines Governing the
Preparation of Financial Reports by Securities Issuers.
Since the “Labor Safety and Health Act” of Taiwan was
amended and renamed the “Occupational Safety and Health
Act” in July 2013, the Ministry of Labor has been revising and
publishing regulations regarding chemicals management in
2015, including the “Regulation of New Chemical Substances
Registration” and the “Regulation of Controlled Chemicals
Designation and Operation Permission”. Over the years,
TSMC has consistently maintained a safe and healthy work
environment with robust protective measures in place, and
has taken robust measures to comply with these laws and
regulations. With respect to environmental laws, the “Water
Pollution Control Act” was amended in February 2015 and
related regulations such as the “Water Pollution Control Act
Enforcement Rules” and the “Water Pollution Control Measures
and Test Reporting Management Regulations” were also
amended and published accordingly. TSMC has been a leader
on waste water treatment and has taken proper measures
in compliance with latest laws and regulations. In addition,
the “Greenhouse Gas Reduction and Management Act”
was published in July 2015 in Taiwan in response to climate
change, and related regulations are expected to be released
over the next three years. TSMC has been implementing various
long-term energy saving and carbon reduction programs since
2000 and will keep track of regulatory updates to ensure our
compliance with these laws and regulations.
In September 2015, the Taiwan government relaxed its rules
to allow semiconductor companies to establish 12-inch wafer
fabs in mainland China through sole proprietorship. To seize
the business opportunities in China, TSMC has submitted
its investment application to the Investment Commission
of Ministry of Economic Affaires (MOEA) for approval in
December 2015 to set up a 12-inch wafer manufacturing
facility and a design service center in Nanking.
Other than the above laws and regulations, it is not expected
that other governmental policies or regulatory changes would
materially impact TSMC’s operations and financial condition.
6.3.3 Operational Risks
Risks Associated with Capacity Expansion
TSMC performs long-term market demand forecast for its
products and services to manage its overall capacity. Recently,
TSMC has been adding capacity to its 300mm wafer fabs in
the Hsinchu Science Park, Southern Taiwan Science Park and
Central Taiwan Science Park, based on its market demand
forecast. Expansion of the Company’s capacity will increase
its costs. For example, the Company will need to purchase
additional equipment, hire additional personnel and train
personnel to operate the new equipment. If the increased
capacity cannot be utilized effectively, TSMC’s financial
performance may be adversely affected by these increased
costs.
In order to mitigate the risk associated with capacity expansion,
TSMC continuously watches the change of market conditions
and works closely with its customers. When market demand
is not as expected, the Company will adjust its capacity plans
in a timely manner to reduce the impact on its financial
performance.
Risks Associated with Sales Concentration
Over the years, TSMC’s customer profile and the nature of its
customers’ businesses have changed dramatically. While it
generates revenue from hundreds of customers worldwide,
TSMC’s ten largest customers accounted for approximately
63% of net revenue in both 2014 and 2015, respectively. The
Company’s largest customer accounted for approximately
21% and 16% of net revenue in 2014 and 2015, respectively.
The Company’s second largest customer in 2015 accounted
approximately for 16% of our net revenue, with approximately
9% in 2014.
This customer concentration results in part from the changing
dynamics of the electronics industry with the structural shift
to mobile devices and applications and software that provide
the content for such devices. There are only a limited number
of customers who are successfully exploiting this new business
model paradigm.
Also, in order to respond to the new business model paradigm,
TSMC has seen the change of nature in its customers’ business
models. For example, there is a growing trend toward the
rise of system houses that operate in a manner that makes
their products and services more marketable in a changing
consumer market. Also, since the global semiconductor
industry is becoming increasingly competitive, some of our
customers have engaged in industry consolidations in order to
remain competitive. Such consolidations have taken the form
of mergers and acquisitions. If more of our major customers
consolidate, this will further decrease the overall number of
our customer pool. The loss of, or significant curtailment of,
purchases by one or more of the Company’s top customers,
including curtailment due to increased competitive pressures,
industry consolidation, a change in their designs, or change
in their manufacturing sourcing policies, or practices of these
customers, or the timing of customer or distributor inventory
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adjustments, or change in its major customers’ business
models may adversely affect TSMC’s results of operations and
financial condition.
TSMC maintains a close watch on these trends and works
closely with its customers to respond to these changes and to
strengthen the Company’s market position.
Risks Associated with Purchase Concentration
● Raw Materials
TSMC’s production operations require that it obtains adequate
supplies of raw materials, such as silicon wafers, gases,
chemicals and photoresist, on a timely basis. In the past,
shortages in the supply of some materials, whether by specific
vendors or by the semiconductor industry generally, have
resulted in occasional industry-wide price adjustments and
delivery delays. In addition, major natural disasters, political
or economic turmoil occurring within the country of origin of
such raw materials may also significantly disrupt the availability
of such raw materials or increase their prices. Also, since TSMC
procures some raw materials from sole-source suppliers, there
is a risk that the need for such raw materials may not be met
or that back-up supplies may not be readily available. TSMC
revenue and earnings could decline if the Company is unable
to obtain adequate supplies of the necessary raw materials
in a timely manner or if there are significant increases in the
costs of raw materials that the Company cannot pass on to
customers. To reduce the supply chain risk and to manage the
cost actively, TSMC is committing resources toward developing
new supply sources. In addition, TSMC continually encourages
its suppliers to reduce their supply chain risk by decentralizing
production plants, and to intensify their cost competitiveness
by moving their production site to Taiwan from higher-cost
areas.
In the meantime, being aware of the risk of fewer back-up
suppliers, TSMC is engaging early and deeply with suppliers
on managing quality, and capacity issues because ramping
at unprecedented speed leaves TSMC with very little time
to re-tune its process. At leading technology nodes, TSMC
requires world-class material quality, manufactured at
world-class facilities, with world-class processes. In regard
to streamlining the supply chain risk management, TSMC
intensifies supplier site audits and extends supply chain best
practices to suppliers’ suppliers to mitigate capacity and
quality risks. Moreover, TSMC continually refines its planning
system and enhances demand forecast alignments with critical
suppliers for adequate supply capacity planning, especially
for steep ramping of new nodes. TSMC developed a Supply
Chain Risk Assessment for critical suppliers to put in place
requirements on regulatory compliance, environmental
impact and social responsibility. Any regulatory violations or
any environmental impact event as well as failure of meeting
TSMC’s expectation in sustainability requirements may result in
business reduction or termination.
● Equipment
The Company’s operations and ongoing expansion plans
depend on its ability to obtain an appropriate amount of
equipment and related services from a limited number of
suppliers in a market that is characterized from time to time
by limited supply and long delivery cycles. During such times,
supplier-specific or industry-wide lead times for delivery can
be as long as six months or more. To better manage its supply
chain, the Company has implemented various business models
and risk management contingencies with suppliers to shorten
the procurement lead time. Further, the growing complexities,
especially in next-generation lithographic technologies, may
delay the timely availability of the equipment and parts
needed to exploit time-sensitive business opportunities and
also increase the market price for such equipment and parts.
If TSMC is unable to obtain equipment in a timely manner to
fulfill its customers’ demands on technology and production
capacity, or at a reasonable cost, its financial condition and
results of operations could be negatively Impacted.
Risks Associated with Intellectual Property Rights
The Company’s ability to compete successfully and to achieve
future growth will depend in part on the continued strength
of its intellectual property portfolio. While TSMC actively
enforces and protects its intellectual property rights, there can
be no assurance that its efforts will be adequate to prevent
the misappropriation or improper use of its proprietary
technologies, software, trade secrets or know-how. Also, the
Company cannot assure that, as its business or business models
expand into new areas, it will be able to develop independently
the technologies, patents, software, trade secrets or know-how
necessary to conduct its business or that it can do so without
unknowingly infringing the intellectual property rights of
others. As a result, TSMC may have to rely on, to a certain
degree, licensed technologies and patent licenses from others.
To the extent that the Company relies on licenses from others,
there can be no assurance that it will be able to obtain any or
all of the necessary licenses in the future on terms it considers
reasonable or at all. The lack of necessary licenses could expose
TSMC to claims for damages and/or injunctions from third
parties, as well as claims for indemnification by its customers
in instances where it has contractually agreed to indemnify its
customers against damages resulting from infringement claims.
TSMC has received, from time-to-time, communications
from third parties asserting that TSMC’s technologies, its
manufacturing processes, or the design of the semiconductors
made by TSMC or the use of those semiconductors by its
customers may infringe their patents or other intellectual
property rights. Because of the nature of the industry, the
Company may continue to receive such communications in
the future. These assertions have at times resulted in litigation.
Recently, there has been a notable increase in the number
of assertions made and lawsuits initiated by certain litigious,
non-practicing entities and these litigious, non-practicing
entities are also becoming more aggressive in their monetary
demands and requests for court-issued injunctions. Such
lawsuits or assertions may increase TSMC’s cost of doing
business and may potentially be extremely disruptive if these
non-practicing entities succeed in blocking the trade of
products and services offered by TSMC.
The Company has or expanding its manufacturing operations
into certain offshore jurisdictions. To mitigate the risk of
intellectual property misappropriation, TSMC has implemented
heightened safeguards against such misappropriation.
If TSMC fails to obtain or maintain certain technologies or
intellectual property licenses (or fail to prevent our intellectual
property from being misappropriated) and, if litigation relating
to alleged intellectual property matters occurs, it (i) could
prevent the Company from manufacturing particular products
or selling particular services or applying particular technologies;
and (ii) reduce our ability to compete effectively against entities
benefiting from our misappropriated intellectual property,
which could reduce its opportunities to generate revenue.
TSMC has taken related measures to minimize potential loss of
shareholder value arising from intellectual property claims and
litigation filed against the Company. These measures include:
strategically obtaining licenses from certain semiconductor
and other technology companies as needed; timely securing
intellectual property rights for defensive and/or offensive
protection of TSMC technology and business; and aggressively
defending against baseless litigation.
Risks Associated with Litigation
As is the case with many companies in the semiconductor
industry, TSMC has received from time-to-time
communications from third parties asserting that its
technologies, its manufacturing processes, or the design
of the semiconductors made by TSMC or the use of those
semiconductors by its customers may infringe upon their
patents or other intellectual property rights. These assertions
have at times resulted in litigation by or against the Company
and settlement payments by the Company. Irrespective of the
validity of these claims, TSMC could incur significant costs
in the defense thereof or could suffer adverse effects on its
operations.
In June 2010, Keranos, LLC. filed a complaint in the U.S. District
Court for the Eastern District of Texas alleging that TSMC,
TSMC North America, and several other leading technology
companies infringe three expired U.S. patents. In response,
TSMC, TSMC North America, and several co-defendants in the
Texas case filed a lawsuit against Keranos in the U.S. District
Court for the Northern District of California in November 2010,
seeking a judgment declaring that they did not infringe the
asserted patents, and that those patents were invalid. These
two litigations have been consolidated into a single lawsuit
in the U.S. District Court for the Eastern District of Texas. In
February 2014, the Court entered a final judgment in favor
of TSMC, dismissing all of Keranos’ claims against TSMC with
prejudice. Keranos appealed the final judgment to the U.S.
Court of Appeals for the Federal Circuit, and in August 2015,
the Federal Circuit remanded the case back to the Texas court
for further proceedings. The outcome cannot be determined at
this time.
In December 2010, Ziptronix, Inc. filed a complaint in the U.S.
District Court for the Northern District of California accusing
TSMC, TSMC North America and one other company of
infringing several U.S. patents. In September 2014, the Court
granted summary judgment of noninfringement in favor of
TSMC and TSMC North America. Ziptronix, Inc. can appeal
the Court’s order. In August 2015, Tessera Technologies, Inc.
announced it had acquired Ziptronix. The outcome cannot be
determined at this time.
In September 2013, Zond Inc. filed a complaint in U.S. District
Court for the District of Massachusetts against TSMC, certain
TSMC subsidiaries and other companies alleging infringing of
several U.S. patents. Subsequently, TSMC and Zond initiated
additional legal actions in the U.S. District Courts for the
District of Delaware and the District of Massachusetts over
several additional patents owned by Zond. In March 2015,
all pending litigations between the parties in the U.S. District
Courts for the District of Massachusetts and the District of
Delaware were dismissed.
In March 2014, DSS Technology Management, Inc. (DSS)
filed a complaint in the U.S. District Court for the Eastern
District of Texas alleging that TSMC, TSMC North America,
TSMC Development and several other companies infringe
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one U.S. patent. TSMC Development has subsequently been
dismissed. In May 2015, the Court entered a final judgment of
noninfringement in favor of TSMC and TSMC North America.
DSS has appealed the final judgment to the U.S. Court of
Appeals for the Federal Circuit. In November 2015, the Patent
Trial and Appeal Board (PTAB) determined after concluding
an Inter Partes Review that the patent claims asserted by DSS
in the District Court litigation are unpatentable. DSS appealed
the PTAB’s decision in January 2016. The outcome cannot be
determined at this time.
Other than the matters described above, TSMC was not
involved in any other material litigation in 2015 and is not
currently involved in any other material litigation.
Risks Associated with Mergers and Acquisitions
During 2015 and as of the date of this Annual Report, there
were no such risks for TSMC.
Risks Associated with Recruiting Qualified Personnel
The Company relies on the continued services and
contributions of its executive officers and skilled technical
and other personnel. TSMC’s business could suffer if we
lose, for whatever reasons, the services and contributions of
some of these personnel and we cannot adequately replace
them. We may be required to increase or reduce the number
of employees in connection with any business expansion
or contraction, in accordance with market demand for our
products and services. Since there is intense competition for
the recruitment of these personnel, we cannot ensure that we
will be able to fulfill our personnel requirements in a timely
manner during an economic upturn.
Future R&D Plans and Expected R&D Spending
For additional details, please refer to “5.2.7 Future R&D Plans”
on page 70 of this Annual Report.
Changes in Corporate Image and Impact on Company’s
Crisis Management
TSMC has established an excellent corporate image around
the world based on its core values of “Integrity, Commitment,
Innovation, and Customer Trust,” as well as its outstanding
operations, rigorous corporate governance, and dedication
to corporate social responsibility to pursue sustainable
development, equality and justice, and a harmonious society to
live and work.
in 2015. Amid TSMC’s continuing efforts to be a better
corporate citizen and carry out its social responsibilities, the
Company was not only selected as a component of the Dow
Jones Sustainability Indices (DJSI) for a 15th consecutive year,
but also recognized by the DJSI as the Semiconductors and
Semiconductor Equipment Industry Group Leader for a third
consecutive year, and led the group in 10 out of 21 categories,
including operational eco-efficiency, product stewardship,
supply chain management, human capital development, and
talent attraction and retention, further strengthening the
Company’s public reputation.
In addition, TSMC’s awards in 2015 include the Taiwan
Institute for Sustainable Energy 2015 Taiwan Corporate
Sustainability Award “Gold Medal For Sustainability Report”
and “Sustainable Water Management Award”; the Taiwan
Stock Exchange’s first Corporate Governance Award for listed
companies, No. 1 in the R.O.C. Ministry of Economic Affairs
“Top 20 Innovative Taiwan Companies”; No. 1 in the IEEE
Spectrum’s “Patent Power Scorecard” for the Semiconductor
Manufacturing sector, The R.O.C. Ministry of Economic
Affairs Industrial Development Bureau “Green Factory
Label”; The R.O.C. Environmental Protection Administration
“Annual Enterprise Environmental Protection Award”; The
R.O.C. Environmental Protection Administration “Energy
Conservation and Carbon Reduction Action Mark”; The R.O.C.
Environmental Protection Administration “Enterprise Green
Procurement Award”; The R.O.C. Ministry of Economic Affairs
“Excellence in Carbon Reduction Award” and “Excellence in
Water Conservation Award”; The R.O.C. Ministry of Health
and Welfare “Excellence in Health Award”; Ranked No. 1 for
Large Companies in the CommonWealth Magazine Corporate
Citizenship Award; The CSR Model Award for the GlobalViews
Magazine Annual Corporate Social Responsibility Survey, and
the GlobalViews Magazine CSR Model Award for “Promotion
of Public Service”.
As an important member of the technology industry, TSMC
has always endeavored to act as a positive force in society, and
maintains departments such as Brand Management, Customer
Service, Public Relations, Employee Relations, Investor Relations,
Risk Management, Fab Industrial Safety and Environmental
Protection, Internal Audit, and the TSMC Foundation to
coordinate the Company’s resources and further enhance
TSMC’s positive corporate image.
TSMC was honored with awards for its achievements in
operations, corporate governance, innovation, profit growth,
investor relations, environmental protection and other fields
To address potential events that may affect the Company’s
public image, including fires and workplace accidents, TSMC
maintains an Emergency Response Procedure Manual, and
health and safety supervisors for each fab hold meetings
of the “Environment, Health, and Safety Technical Board”
every month. In addition, relevant departments hold
regular drills and continuously improve their emergency
response and notification procedures. At the same time,
TSMC has established communications criteria for all types
of stakeholders, and the Public Relations Department is
responsible for external communications. In the event of
the above emergencies, all departments immediately deploy
emergency response measures to reduce casualties and
minimize the impact on the surrounding environment,
Company property, and manufacturing operations, and also
alert the Public Relations Department at the first stage of
response to ensure smooth channels of communications to
maintain the Company’s image.
Risks Associated with Change in Management
During 2015 and as of the date of this Annual Report, there
were no such risks for TSMC.
6.3.4 Financial Risks
Economic Risks
● Interest Rate Fluctuation
TSMC are exposed to interest rate risks related to our debt
issuances and investment portfolio. TSMC’s interest income
and expenses are most sensitive to fluctuations in R.O.C.
and U.S. interest rates. Changes in R.O.C. and U.S. interest
rates affect the interest earned on the Company’s cash, cash
equivalent and marketable securities and the fair value of those
securities as well as interest paid on and the fair value of our
debt.
TSMC’s investment policy is to achieve a return that will allow
TSMC to preserve capital and maintain liquidity requirements.
TSMC uses a combination of internal and external
management to execute our investment strategy. TSMC
typically invests in highly-rated securities, and limit the amount
of credit exposure to any one issuer. The policy requires
investments generally to be investment grade, with the primary
objective of minimizing the potential risk of principal loss.
TSMC’s investments in both fixed rate and floating rate interest
earning securities carry a degree of interest rate risk. Fixed rate
securities may have their fair market value adversely impacted
due to a rise in interest rates, while floating rate securities may
produce less income than predicted if interest rates fall.
In order to limit its exposure to interest rate risks, on the
liability side, TSMC finances its funding needs primarily through
internal generation of cash and the issuance of long-term,
fixed-rate debt. On the investment side, TSMC places its
investment mainly in short tenor time deposits as well as in
liquid and highly-rated short term fixed income securities to
preserve principal and maintain liquidity. We have entered,
and may enter in the future, into interest rate futures to hedge
interest rate risk on our fixed-income investments.
● Foreign Exchange Volatility
More than half of TSMC’s capital expenditures and
manufacturing costs are denominated in currencies other
than NT dollars, primarily in US dollars, Japanese yen and
Euros. In 2015, more than 90% of the Company’s revenues
were denominated in US dollars and currencies other than
NT dollars. Therefore, any significant fluctuation to its
disadvantage in such exchange rates would have an adverse
effect on TSMC’s financial condition. For example, because
TSMC’s functional currency is denominated in NT dollars,
every 1% depreciation of the US dollar against the NT dollar
exchange rate may result in approximately 0.4 percentage
point decrease in TSMC’s operating margin based on TSMC’s
2015 results.
Conversely, if the U.S. dollar appreciates significantly versus
other major currencies, the demand for the products and
services of TSMC’s customers and for its goods and services will
likely decrease, which will negatively affect TSMC’s revenues.
TSMC utilizes short-term debt denominated in foreign
currencies and derivative financial instruments, including
currency forward contracts and cross currency swaps, to
partially hedge its currency exposure.
Fluctuations in the exchange rate between the US dollar and
the NT dollar may affect the US dollar value of the Company’s
common shares and the market price of the Company’s
American Depositary Shares (ADSs) and of any cash dividends
paid in NT dollars on TSMC’s common shares represented by
ADSs.
● Inflation and Deflation and Resulting General Market
Volatility
The global economy is becoming more vulnerable to sudden
unexpected fluctuations in inflationary and deflationary
expectations and conditions. Both high inflation and deflation
adversely affect an economy, at both the macro and micro
levels, by reducing economic efficiency and disrupting saving
and investment decisions. Recently, dramatic fall in oil prices
and negative interest rates in major world economies have
exacerbated global fluctuations in inflationary and deflationary
expectations. These macro-economic changes have resulted
in general market volatility across all assets classes. Such
fluctuations and volatility may negatively affect the costs of
TSMC’s operations and the business operations of its customers
who may be forced to plan their purchases of TSMC’s goods
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and services within an uncertain economy. Therefore, the
demand for TSMC’s products and services could unexpectedly
fluctuate severely in accordance with expectations of inflation
or deflation as affected by macro market volatility.
Risks Associated with External Financing
Planning capital requirements is challenging in the highly
dynamic, cyclical and rapidly changing semiconductor industry,
especially during times of general market volatility in the fixed
income, interest rates, foreign currencies, and equities markets.
From time to time – and increasingly so for the foreseeable
next few years – TSMC will continue to need significant
capital to fund its operations and manage its capacity in
accordance with market demand. TSMC’s continued ability
to obtain sufficient external financing is subject to a variety of
uncertainties, including:
● TSMC’s future financial condition, results of operations and
cash flow
● General market conditions for financing activities
● Market conditions for financing activities of semiconductor
companies
● Social, economic, financial, political and other conditions in
Taiwan and elsewhere
Sufficient external financing may not be available to the
Company on a timely basis, on reasonable market terms, or
at all. As a result, TSMC may be forced to curtail its expansion
and modification plans or delay the deployment of new or
expanded services until it obtains such financing.
Risks Associated with High-risk/high-leveraged
Investment; Lending, Endorsements, and Guarantees for
Other Parties; and Financial Derivative Transactions
TSMC did not make high-risk or high-leveraged financial
investments during 2015 and up to the date of this report.
TSMC provided a guarantee to TSMC Global, a wholly owned
subsidiary of TSMC, for its issuance of US dollar-denominated
senior unsecured corporate bonds of US$1,500 million in April
2013. As of February 29, 2016, TSMC and the Company’s
subsidiaries had no intercompany loan outstanding.
The financial transactions of a “derivative” nature that TSMC
entered into were strictly for hedging purposes and not for
any trading or speculative purpose. For more information,
please refer to pages 33-35 of the Annual Report section (II),
Financial Statements. The fair market value of TSMC’s trading
and available-for-sale financial securities is subject to prevailing
market conditions and may fluctuate from TSMC’s carrying
value from time to time, which may impact the returns of
those securities.
To control various types of financial transactions, the Company
has established internal policies and procedures based on
sound financial and business practices, all in compliance
with the relevant rules and regulations issued by the Taiwan
Securities and Futures Bureau. TSMC policies and procedures
include “Policies and Procedures for Financial Derivative
Transactions,” “Procedures for Lending Funds to Other Parties,”
“Procedures for Acquisition or Disposal of Assets,” and
“Procedures for Endorsement and Guarantee”.
Risks Associated with Strategic Investments
From time to time, TSMC has made or will make a series
of strategic investments. There is no guarantee that any of
such investments will be successful commercially. Any such
investment will incur risks, which may result in losses even
with careful management. Any such loss resulting from such
investments may result in significant impairment charges, lower
profit margin and ultimately lower distributable earnings. For
further information on these investments, please refer to “8.
Subsidiary Information and Other Special Notes” on pages
126-131 of this Annual Report.
Risks Associated with Impairment Charges
Under Taiwan-IFRSs, TSMC is required to evaluate its
investments, tangible and intangible assets for impairment
whenever triggering events or changes in circumstances
indicate that the asset may be impaired. If certain criteria are
met, TSMC is required to record an impairment charge. TSMC
is also required under Taiwan-IFRSs to evaluate goodwill for
impairment at least on an annual basis or more frequently
whenever triggering events or changes in circumstances
indicate that goodwill may be impaired and the carrying value
may not be recoverable. TSMC holds investments in certain
publicly listed and private companies, some of which have
incurred certain impairment charges disclosed in the Annual
Report section (II), Financial Statements.
The determination of an impairment charge at any given time
is based significantly on the projected results of the Company’s
operations over a number of years subsequent to that time.
Consequently, an impairment charge is more likely to occur
during a period when the Company’s operating results are
otherwise already depressed.
TSMC has established the process and system to closely
monitor and assess the risk of any impairment charge.
However, the management is unable to estimate the extent or
timing of any impairment charge for future years, or whether
such impairment charge required may have a material adverse
effect on the Company’s net income.
6.3.5 Hazardous Risks
TSMC maintains a comprehensive risk management system
dedicated to the conservation of natural resources, the
safety of people, and the protection of property. In order to
effectively handle emergencies and natural disasters at each
facility, management has developed comprehensive plans and
procedures that focus on risk prevention, emergency response,
crisis management, and business continuity. TSMC has adopted
local and international standards for Environmental, Safety
and Health (ESH) management. All TSMC manufacturing fabs
have been ISO 14001 certified (Environmental Management
System), OHSAS 18001 certified (Occupational Health and
Safety Management System), and QC 080000 certified
(Hazardous Substance Process Management System). All
manufacturing fabs in Taiwan have also been TOSHMS (Taiwan
Occupational Safety and Health Management System) certified.
The new fabs will also acquire the above certificates within 18
months after volume production.
The Company pays special attention to preparedness for
emergencies or disasters, such as typhoons, floods, droughts
caused by climate change, earthquakes, environmental
contamination, large-scale product returns, service disruption
of IT systems, strikes, pandemics (such as H1N1 influenza),
and sudden and unexpected disruptions to the supply of
raw materials or water, electricity, and other public utilities.
TSMC has established a company-wide task force dedicated
to managing the risk of a water shortage that might arise
due to climate change. This task force keeps watch on the
external supply and internal demand for water. Cross-company
consolidations and external collaborations with public agencies
are also ongoing in the industrial parks to ensure and sustain a
stable water supply.
TSMC has further strengthened its business continuity plans,
which include periodic risk assessment, risk mitigation, and
implementation through the establishment of emergency task
forces when necessary, combined with the preparation of a
thorough analysis of the emergency, its impact, alternative
actions, and solutions for each possible scenario together
with appropriate precautionary and/or recovery measures.
Each task force is given the responsibility of ensuring TSMC’s
ability to conduct business while minimizing personal
injury, business disruption, and financial impact under the
circumstances. TSMC’s business continuity plan is periodically
reviewed according to results of test scenarios or practical
implementation for ensuring effective and successful business
continuity. Customers are informed of TSMC’s strong business
continuity capability in order to establish resilience and
flexibility in both their supply chain and insurance placement.
The Company has also conducted a continuous improvement
project, including evaluating building anti-seismic capability,
holding earthquake emergency response drills, enhancing
tool anchorage or seismic isolation facilities, training and
preparedness for tool salvage, and has improved TSMC
business continuity procedures with reference to ISO 22301
business continuity management.
TSMC and many of its suppliers use highly combustible
and toxic materials in its manufacturing processes and are
therefore subject to the risk of loss arising from explosion,
fire, or environmental influences which cannot be completely
eliminated. Although the Company maintains many
overlapping risk prevention and protection systems, as well
as fire and casualty insurance, TSMC’s risk management
and insurance coverage may not be sufficient to cover all
of the Company’s potential losses. If any of TSMC’s fabs or
vendor facilities were to be damaged, or cease operations
as a result of an explosion, fire or environmental influences,
it could reduce the Company’s manufacturing capacity and
may cause it to lose important customers, thereby having a
potentially adverse and material impact on TSMC’s financial
performance. In addition to periodic fire protection system
inspection and firefighting drills, the Company has also carried
out a corporate-wide fire risk mitigation project focused on
management and hardware improvements.
6.3.6 Risks Associated with Climate Change and Non-
compliance with Environmental and Climate
Related Laws and Regulations, and Other
International Laws, Regulations and Accords
The manufacturing, assembling and testing of our products
require the use of metals, chemicals and materials that are
subject to environmental, climate-related, health and safety,
and humanitarian conflict-free sourcing laws (such as the
U.S. SEC rule for filing Form SD to disclose the origins of
certain strategic minerals), regulations and guidelines issued
worldwide.
Although TSMC may be eligible for various exemptions and/
or extensions of time for compliance, the Company’s failure to
comply with any of these applicable laws or regulations could
result in:
● significant penalties and legal liabilities, such as the denial of
import permits;
● the temporary or permanent suspension of production of the
affected products;
● unfavorable alterations in TSMC manufacturing, fabrication
and assembly and test processes;
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● challenges from customers that place TSMC at a significant
competitive disadvantage, such as loss of actual or potential
sales contracts in case the Company is unable to satisfy the
conditions regarding conflict-free minerals sourcing laws or
requirements by our customers;
● restrictions on TSMC operations or sales;
● damage to TSMC goodwill and reputation; and
● loss of tax benefits, including termination of current tax
incentives, disqualification of tax credit application and
repayment of the tax benefits that TSMC is not entitled to.
Existing and future environmental- and climate-related laws
and regulations as well as applicable international accords
to which TSMC is subject, could also require it, among
other things, to do the following: (a) purchase, use or
install expensive pollution control, reduction or remediation
equipment; (b) implement climate change mitigation programs
and “abatement or reduction of greenhouse gas emissions”
programs, or “carbon credit trading” programs; (c) modify
product designs and manufacturing processes, or incur other
significant expenses associated with such laws and regulations
such as obtaining substitute raw materials or chemicals that
may cost more or be less available for our operations. It is
still unclear whether such necessary actions would affect the
reliability or efficiency of TSMC products and services.
The contingencies resulting from the actual and potential
impact of local or international laws and regulations, as
well as international accords on environmental or climate
change, could harm the Company’s business and operational
results by increasing expenses or requiring TSMC to alter its
manufacturing, assembly and test processes.
Increasing climate change and environmental concerns could
affect the results of our operations if any customers request
that TSMC provide products and services that exceed any
existing standard(s) of environmental compliance. If TSMC
is unable to offer such products or offer products that are
compliant, but are not as reliable due to the lack of reasonably
available alternative technologies or materials, it may lose
market share to competitors.
In addition, the Company’s inability to timely obtain
environmental related approvals needed to undertake the
development and construction of a new fab or expansion
project may delay, limit or increase the cost of our expansion
plans that could also in turn adversely affect TSMC’s business
and operational results. In light of increased public interest in
environmental issues, the Company’s operations and expansion
plans may be adversely affected or delayed responding to
public concern and social environmental pressures even if the
Company’s operations comply with all applicable laws and
regulations.
Further, energy costs in general could increase significantly due
to climate change and other regulations. Therefore, TSMC’s
energy costs may increase significantly if utility or power
companies pass on their costs, either fully or partially, such as
those associated with carbon taxes, emission caps and carbon
credit trading programs.
TSMC believes that climate change should be regarded as an
important corporate risk, which must be controlled to improve
our competitiveness. Climate change risks include legal risk,
physical risk and other risks. TSMC’s control measures are as
follows:
● Climate regulatory risk control
The greenhouse gas (GHG) control regulations and agreements
of countries around the world are becoming increasingly
stringent. Enterprises are legally required to regularly disclose
GHG-related information, and also limit GHG emissions. The
cost of production, including materials and energy, may also
grow along with future legal requirements, such as carbon or
energy taxes. TSMC continues to monitor legislative trends and
communicate with various governments through industrial
organizations and associations to set reasonable and feasible
legal requirements.
● Conflict minerals risk control
For additional details, please refer to the section of “Supplier
and Contractor Management” of “7.2.3 Safety and Health” on
pages 119-120 of this Annual Report.
● Climate disaster risk control
Abnormal climate caused by the greenhouse effect has
increased the frequency and severity of climate disasters
– storms, floods, drought, and water shortages – causing
considerable impacts on business operations and supply
chains. TSMC believes that climate change control should
take into account both mitigation and adaption, and this
requires cooperation among government, society and
industry to reduce risk. To ensure electricity and raw water
supplies, therefore, in addition to water-saving measures
at the Company’s own facilities and those of upstream and
downstream partners, TSMC participates in the Taiwan Science
Park Industrial Union Experts Committee platform, and is
actively involved in regular meetings with Taipower Company
and the Taiwan Water Corporation to discuss supply and
allocation for response issues.
owned 6.38% of TSMC’s outstanding shares as of February 29,
2016, has from time to time in the past sold TSMC shares in
the form of ADSs in several transactions.
As of the date of this Annual Report, no shareholder owns
10% or more of TSMC’s total outstanding shares.
Risks Associated with Cyber Attacks
Even though we have established a comprehensive internet
and computing security network, we cannot guarantee
that our computing systems which control or maintain
vital corporate functions like our manufacturing operations
and enterprise accounting would be completely immune
to crippling cyber viral attacks launched by third party to
gain unauthorized access to our internal network systems
to sabotage our operations and goodwill. In the event of a
serious cyber attack, our systems may lose important corporate
data and our production lines may be shutdown indefinitely
pending the resolution of such attack. These cyber attacks may
also attempt to steal our trade secrets and other intellectual
properties and other sensitive information, such as personal
information of our employees and proprietary information of
our customers and other stakeholders. Malicious hackers may
also try to introduce computer viruses or corrupted software
into our network systems to disrupt our operations or spy for
sensitive information. These attacks may result in us having
to pay damages for our delayed or disrupted orders or incur
significant expenses in attempting to re-establish control over
our network. If we are not able to timely resolve the technical
difficulties caused by such cyber attacks, our financial results
as well as our commitments to our customers and other
stakeholders may be materially impaired.
Other Material Risks
During 2015 and as of the date of this Annual Report, TSMC’s
management is not aware of any other risk event that could
impart a potentially material impact on the financial status of
the Company.
● Other climate risk controls
Climate change is a concern to the global supply chain,
necessitating energy conservation, carbon reduction, and
disaster prevention. For example, The Electronic Industry
Citizenship Coalition (EICC) has also required members’
suppliers to disclose GHG emissions information. TSMC not
only discloses its own GHG emissions information each year,
but it also assists and requires its suppliers to establish a GHG
inventory system and conduct reduction programs. TSMC’s
suppliers are required by TSMC to submit GHG emissions and
reduction information as an important index of sustainability
scoring in its procurement strategy.
To mitigate risks resulting from climate change, TSMC
continues to actively carry out energy conservation measures,
voluntary perfluorinated compounds (PFC) emission reduction
projects, and GHG inventory and verification every year. TSMC
has publicly disclosed climate change information every year
through the following channels:
● TSMC has disclosed GHG emissions and reduction-related
information for evaluation by the Dow Jones Sustainability
Index every year since 2001.
● TSMC’s GHG-related information has been disclosed in its CSR
report on the Company website annually since 2008. TSMC
also provides information to customers and investors upon
request.
● Since 2005, TSMC has been participating in an annual survey
held by the nonprofit Carbon Disclosure Project (CDP), which
includes GHG emission and reduction information for all
TSMC fabs and subsidiaries.
● Every year since 2006, TSMC has followed the ISO 14064-1
standard to conduct a GHG inventory and acquire verification
by an accrediting agency. TSMC also reports GHG inventory
data to the Taiwan Environmental Protection Administration
(EPA) and the Taiwan Semiconductor Industry Association
(TSIA).
6.3.7 Other Risks
Potential Impact and Risks Associated with Sales of
Significant Numbers of Shares by TSMC’s Directors,
and/or Major Shareholders Who Own 10% or More of
TSMC’s Total Outstanding Shares
The value of TSMC shareholders’ investment may be reduced
by possible future sales of TSMC shares owned by the major
shareholders.
One or more of our existing shareholders may, from time to
time, dispose of significant numbers of our common shares
or ADSs. For example, the National Development Fund, which
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7. Corporate Social Responsibility
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7.1 Overview
TSMC Corporate Social Responsibility Policy
TSMC believes a companyÕ s corporate social responsibility is to uplift society. To focus TSMCÕ s CSR efforts, Chairman Dr. Morris
Chang and the management team, after extensive discussions held in 2015, declared Ó Uplifting SocietyÓ as the Company vision
and identified three primary missions: Ò Acting with Integrity,Ó Ò Strengthening Environmental ProtectionÓ , and Ò Caring for the
DisadvantagedÓ . In November 2015, Chairman Chang approved the Ò TSMC Corporate Social Responsibility PolicyÓ as an official
Company document to serve as a guide in developing a CSR procedure, which was completed in December 2015. Ò TSMC
Corporate Social Responsibility ProcedureÓ defines TSMCÕ s CSR scope, the roles and responsibilities of CSR Committee members and
management to fulfill the vision and carry out the missions as a good corporate citizen.
TSMC Corporate Social Responsibility Policy
Since its establishment, TSMC has not only strived for the highest achievements in its core business of dedicated IC foundry
services but has also actively developed positive relationships with all stakeholders including employees, shareholders, customers,
suppliers, and society to fulfill its responsibility as a corporate citizen and pursue a sustainable future.
Vision
● To Uplift Society
Mission
● Acting with Integrity
● Strengthening Environmental Protection
● Caring for the Disadvantaged
Guiding Principles
Acting with Integrity: TSMC believes in acting ethically, following the law, and balancing the interests of all stakeholders. The
Company endeavors to use the experience of developing a sustainable business to drive the industry and supply chain into a
positive cycle and to act together with them as an uplifting force in society.
Strengthening Environmental Protection: TSMC strives to achieve environmental sustainability and continues to promote green
fabs, green manufacturing, and green supply chains. The Company seeks the most efficient use of energy and resources and is
committed to reducing waste and preventing pollution. TSMC is eager to share its environmental experience and expertise and
aims to collaborate with government, academia, and all of society to address the challenges of climate change.
Caring for the Disadvantaged: TSMC believes in equality, justice, and a safe and prosperous society. The Company combines
its resources with employee volunteer service to commit money, material and labor to the two main areas of Ò educationÓ
and Ò living.Ó TSMC hopes to provide underprivileged students in rural regions with diverse learning opportunities and give
disadvantaged groups necessary aid and emergency relief for the common good of society.
Chairman
Morris Chang
November, 2015
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The Scope of Corporate Social Responsibility
The goal of TSMC’s corporate social responsibility is to uplift society. The CSR Matrix below, set by Chairman Dr. Morris Chang,
clearly defines the scope of that responsibility. The horizontal axis shows the seven areas where TSMC aims to set an example:
morality, business ethics, economy, rule of law, sustainability, work/life balance and happiness, and philanthropy; and on the vertical
axis are actions that TSMC has taken to fulfill its responsibilities.
Responsibilities of TSMC CSR Committee Members
Committee Members
Responsibilities
Legal
Customer Service
Materials Management
Quality and Reliability
Corporate Governance, Code of Conduct, Legal Compliance, Intellectual Property, Protection of Confidential
Information
Customers Service and Satisfaction, Customer Trust, Customer Confidentiality
Materials and Supply Chain Risk Management, Supplier Management, Conflict Minerals, EICC
Product Quality and Reliability, Product Recall Mechanism
TSMC CSR Matrix
TSMC
Integrity
Law Compliance
Anti-Corruption
Anti-Bribery
Anti-Cronyism
Environmental Protection
Climate Control
Energy Conservation
Corporate Governance
Provide Well-paying Jobs
Good Shareholder Return
Employees’ Work-life Balance
Encourage Innovation
Good Work Environment
Volunteers Organization
Education and Culture Foundation
Society
Morality
Business Ethics
Economy
Rule of Law
Sustainability
Work/Life Balance
Happiness
Philanthropy
Research and Development
Innovation Management, Green Products
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Risk Management
Risk Management, Crisis Management, Emergency Response and Action Plan
Finance
Investor Relations
Operations
Environment, Health, and Safety
Financial Disclosure, Dividend Policy, Tax Strategy
Resolving Issues of Stakeholder Concern, Establishing Trusting Long-term Relationships, Effective Two-way
Communication, Annual Report Production
Operational Eco-efficiency, Pollution Prevention, Water Resource Risk Management, Green Manufacturing
Environmental Policy and Management System, Climate Change Mitigation and Adaption, Pollution Prevention, Energy
Consumption Efficiency, Carbon Emissions and Carbon Rights Management, Product Environmental Responsibility,
Response Mechanism for Environmental Issues, Environmental Spending, Green Supply Chain, Policy and Management
Systems for Occupational Health and Safety, Workplace Health and Safety, Occupational Disease Prevention and Health
Promotion, Communication of ESH Regulations
Human Resources
Talent Recruitment and Retention, Employee Health and Safety, Employee Training and Development, Compensation
and Benefits, Freedom of Association and Collective Bargaining, Labor Relations and Whistleblower Procedures, Labor
Rights Violations and Reporting Procedures, Management of Working Hours, Child Labor
TSMC Education and Culture Foundation, TSMC
Volunteer Society
Corporate Citizenship, Philanthropy, Community Relations
Stakeholders
Government
Employees
Society
Customers
Suppliers
Customers
Employees
Customers
Customers
Employees
Government
Society
Investors
Government
Investors
Investors
Customers
Investors
Employees
Customers
Government
Society
Suppliers
Investors
Employees
Society
CSR Management
In 2011, Chairman Dr. Morris Chang appointed the Chief Financial Officer to establish a CSR Committee to serve as the center for
decision-making and action for the Company’s corporate social responsibility initiatives. CSR was added as a regular agenda item for
the Board of Directors beginning in 2012, and the CFO reports annually to the Board the results of the prior year’s CSR activities and
the upcoming year’s action plans.
The CSR Committee is TSMC’s interdepartmental coordination platform for carrying out CSR initiatives. Led by the CFO, the
committee is comprised of members from each functional organization and holds meetings quarterly to discuss issues of interest
to stakeholders, such as employees, shareholders, customers, suppliers, governments, society, and others. The committee sets
objectives and plans and reviews progress to systematically and effectively fulfill the Company’s corporate social responsibilities.
Through close cooperation among various internal organizations, CSR has become an integral part of TSMC’s daily operations.
Stakeholder Engagement
TSMC’s approach to stakeholder relations is divided into four stages: identification, analysis, planning and engagement. In
order to pursue sustainable operations, TSMC establishes direct communications with each of its stakeholders. The Company
communicates with stakeholders through multiple channels established by CSR-related units and listens to their economic, social
and environmental concerns. Furthermore, clearly identified CSR Committee members take ownership of each CSR issue, whether
economic, environmental or social, and are responsible for developing appropriate responses to global and social trends, the
Company’s current situation, and other stakeholders concerns in order to continue promoting positive social change.
Public Relations
Stakeholder Engagement, Mechanism for Reflecting Issues of Social Concern, Media Relations, CSR Report Production
Society
TSMC believes that integrity is fundamental to a company’s sustainability. From a CSR perspective, TSMC also believes that customer
trust is enhanced if the Company follows the law, insists on transparency, and shows good corporate governance. These practices,
along with outstanding business results, mean investors will be more willing to invest in the Company over the long term and
employees will be more likely to make a mutual commitment to the Company to fulfill its core values, leading to stronger coherence
within the Company. At TSMC’s urging, suppliers – both upstream and downstream – have been working together to strengthen
environmental protection by building a green supply chain. With the engagement of all stakeholders, the Company’s resources
can be amplified to create even more value for society. In summary, carrying out TSMC’s social responsibilities gives the Company
greater competitive advantage and benefits all stakeholders.
DJSI Industry Group Leader
In 2015, TSMC was recognized by the Dow Jones Sustainability Indices (DJSI) as the Semiconductors and Semiconductor
Equipment Industry Group Leader for the third consecutive year, once again highlighting the company’s dedication to corporate
social responsibility, leadership in adopting international sustainability management standards, and continued innovation in the
economic, environmental, and social dimensions. Moreover, TSMC is one of only two semiconductor companies chosen as the
World Indices components for the past 15 consecutive years.
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2015 CSR Awards and Recognitions
Category
Overall CSR
Organization
Awards and Recognitions
Dow Jones Sustainability World Indices (DJSI)
● DJSI Semiconductors and Semiconductor Equipment “Industry Group Leader“ for the 3rd consecutive year
● RobecoSAM Sustainability Award “Gold Class“
● RobecoSAM Sustainability Award: Industry Leader
● Membership in the Dow Jones Sustainability World Indices for a 15th consecutive year
FORTUNE
Barron’s
● Selected as one of The World’s Most Admired Companies
● Selected as Top 100 World’s Most Respected Companies
MSCI Global Sustainability Index Series
● Selected as MSCI Global Sustainability Index component
CommonWealth Magazine
Globalviews Magazine
Taiwan Institute of Sustainable Energy
Economy, Governance
Institutional Investor Magazine
IR Magazine
FinanceAsia
R.O.C. Ministry of Economic Affairs Industrial
Development Bureau
● Excellence in Corporate Social Responsibility Award – Large cap – 1st Place
Corporate Social Responsibility Award:
● Technology and Traditional Industry Group – Model Award
● Public Welfare Promoting – Model Award
Taiwan Corporate Sustainability Awards:
● Taiwan Top 50 Corporate Responsibility Report Awards – Electronics Industry – Gold Class
● Sustainable Water Management Award
● Best CEO (Technology/Semiconductors) –1st Place (buy-side) – All-Asia
● Best CFO (Technology/Semiconductors) – 2nd Place (buy-side) – All-Asia
● Best CFO (Technology/Semiconductors) – 1st Place (sell-side) – All-Asia
● Best Investor Relations (Technology/Semiconductors) – 1st Place (buy-side) – All-Asia
● Best Investor Relations – (Technology/Semiconductors) – 1st Place (sell-side) – All-Asia
● Best Investor Relations Professional (Technology/Semiconductors) – 1st Place (buy-side) – All-Asia
● Best Investor Relations Professional (Technology/Semiconductors) – 1st Place (sell-side) – All-Asia
● Asia’s Best Analyst and Investor Days
● Grand prix for best overall investor relations (Large cap)
● Best in Sector – Technology
● Best IR by a Taiwanese company
● Asia’s Best Companies 2015 – Taiwan
● Best Managed Public Company – Ranked No. 2 in Taiwan
● Most Committed to a Strong Dividend Policy – Ranked No. 2 in Taiwan
● Best Corporate Governance – Ranked No. 3 in Taiwan
● Best CEO – Ranked No. 1 in Taiwan
● Best CFO – Ranked No. 2 in Taiwan
● Ranked No. 1 in Survey of Top 20 Innovative Companies in Taiwan
IEEE Spectrum Magazine
● Ranked No. 1 in “Patent Power Scorecard for Semiconductor Manufacturing” Sector
ROC Securities & Futures Institute
● 12th Information Disclosure of Public Companies Ranking – Ranked A++
Taiwan Stock Exchange
● Ranked in top 5% in First Corporate Governance Evaluation of Listed Companies
China Credit Information Service
● Ranked No. 1 in Profitability for Taiwan Companies
Financial Times
FORTUNE
● Selected as member of FT Global 500
● Selected as member of Fortune Global 500
Environment, Safety and
Health
U.S. Green Building Council Leadership in Energy and
Environmental Design (LEED) Certification
● “Gold” class certification – Fab 14 Phase 5 and Phase 6 Manufacturing Facilities
Note: Up to the end of 2015, TSMC received 18 U.S. LEED certifications (2 “Platinum” class and 16 “Gold” class
certifications)
R.O.C. Ministry of the Interior “Ecology, Energy
Saving, Waste Reduction and Health (EEWH)”
Certification
● “Diamond” class certification – Fab 15 Phase 1/2 Manufacturing Facility, Fab 15 Phase 3/4 Manufacturing Facility and
Fab 15 Phase 1 Office Building
Note: Up to the end of 2015, TSMC received 10 Taiwan EEWH “Diamond” class Green Building certifications
R.O.C. Ministry of Economic Affairs Industrial
Development Bureau “Green Factory Label”
● Fab 15
ISO 50001 Energy Management System Certification
● Fab 14A, Fab 14B
R.O.C. Environmental Protection Administration
● “Annual Enterprise Environmental Protection Award” – Fab 6
● “Energy Conservation and Carbon Reduction Action Mark” – Fab 8, Fab 12A, Fab 14B
● “Enterprise Green Procurement Award” – Fab 2 and 5, Fab 12A
● “National Environmental Education Award” – Fab 2 and 5, Advanced Backend Fab
R.O.C. Ministry of Economic Affairs
● “Excellence in Carbon Reduction Award” – Fab 2 and 5, Fab 14A
● “Water Conservation Award” –Fab 3 , Fab 12B
R.O.C. Ministry of Labor
“Excellence in Labor Safety and Hygiene Award” – Fab 2
Hsinchu Science Park Administration
● “Water Conservation Award” – Fab 12B
● “Excellence in Labor Safety and Hygiene Award” – Fab 12A
Central Taiwan Science Park Administration
● “Excellence in Labor Safety and Hygiene Award” – Fab 15
Southern Taiwan Science Park Administration
● “Excellence in Environmental Protection” – Fab 14B
Hsinchu County Environmental Protection Bureau
● “Enterprise Environmental Protection Evaluation” – Fab 2 and 5, Fab 3, Fab 12A, Fab 12B
● “Enterprise Green Procurement Award” – Fab 2 and 5
Environmental Protection Bureau of Hsinchu City
● “Enterprise Environmental Protection Evaluation” – Fab 8, Fab 12A
● “Enterprise Green Procurement Award” – Fab 12A
Environmental Protection Bureau of Tainan City
● “Environmental Education Award” – Fab 6
Employees
Health Promotion Administration, Ministry of Health
and Welfare
● “Excellence in Health Award“
Department of Health, Tainan City Government
● “Excellence Healthy Workplace Award“
7.2 Environmental, Safety and Health (ESH)
Management
TSMC believes its environmental, safety and health practices
must not only comply with legal requirements, but also
measure up to, or exceed, recognized international practices.
TSMC’s ESH policy aims to reach the goals of “zero incident”
and “sustainable development,” and to make TSMC a
world-class company in environmental, safety and health
management. The Company’s strategies for reaching these
goals are to comply with regulations, promote safety and
health, strengthen recycling and pollution prevention, manage
ESH risks, instill an ESH culture, establish a green supply chain,
and fulfill its related corporate social responsibilities.
All TSMC manufacturing facilities have received ISO 14001:
2004 certification for environmental management systems
and OHSAS 18001: 2007 certification for occupational safety
and health management systems. All fabs in Taiwan have
also been TOSHMS (Taiwan Occupational Safety and Health
Management System) certified since 2009.
TSMC strives for continuous improvement and actively seeks
to enhance climate change management, pollution prevention
and control, power and resource conservation, waste reduction
and recycling, safety and health management, fire and
explosion prevention and minimize the impact of earthquake
damage, in order to reduce the overall environmental, safety
and health risk.
In 2006, in order to meet regulatory and customer needs
for the management of hazardous materials, TSMC began
to adopt the IECQ QC 080000 Hazardous Substance Process
Management (HSPM) System. All TSMC manufacturing
facilities have been QC 080000 certified since 2007. By
practicing QC 080000, TSMC ensures that its products comply
with regulatory and customer requirements, including the
“European Union’s Restriction of Hazardous Substances (RoHS)
Directive,“ “EU Registration, Evaluation, Authorization and
Restriction of Chemicals (REACH),“ the “Montreal Protocol on
Substances that Deplete the Ozone Layer,“ [the halogen free in
electronic products initiative], and Perfluorooctane Sulfonates
(PFOS) restriction standards.
Since 2011, TSMC has adopted ISO 50001 Energy
Management System for the continuous improvement of
energy conservation. TSMC Fab 12 Phase 4 data center is
Taiwan’s first facility to earn the ISO 50001 certification for a
high-density computing data center. As of early 2016, TSMC
has three fabs – Fab 12 Phase 4/5/6, Fab 14 Phase 3/4 and Fab
15 – that earned the ISO 50001 certifications. Other TSMC fabs
also implement energy management measures consistent with
ISO 50001.
TSMC regularly communicates with suppliers and contractors
regarding environmental, safety and health issues and
encourages them to improve their ESH performance. In line
with this policy, TSMC uses priority work management and
self-management to govern work performed by contractors.
TSMC requires contractors performing level-one high-risk
operations to complete certification for technicians and
to establish their own OHSAS 18001 safety and health
management system. This self-management is aimed at
increasing the sense of responsibility of TSMC’s contractors,
with the goal of promoting safety awareness and technical
improvement for all contractors in the industry.
TSMC collaborates with suppliers to improve the sustainability
of the Company’s supply chain regarding ESH-related issues,
such as environmental protection, safety and hygiene code
compliance, daily management, fire protection, and conflict
mineral management. TSMC not only performs ESH audits at
its suppliers’ manufacturing sites but also proactively assists
them with improving ESH performance.
Besides the requirement of ESH code compliance, energy/
water saving and carbon management of TSMC’s supply chain
are essential to the Company’s green supply chain ideals.
Since 2009, TSMC has required suppliers to establish carbon
inventory procedures. Since 2010, TSMC has collaborated
with selected suppliers to establish product carbon footprints
and has received PAS2050 certifications for 6-inch, 8-inch and
12-inch finished wafers. In 2015, TSMC calculated its carbon
footprint and water footprint, which were certified by the third
party for ISO 14067 and ISO 14046, respectively. We not only
provide such information to customers but also continue to
promote carbon reduction and water conservation at TSMC
and in the supply chain from a life cycle point of view.
TSMC also monitors potential climate change related risks
in the supply chain, investigates the supply chain’s carbon
emission, electricity usage and water usage, and encourages
suppliers to conduct energy saving, carbon reduction,
water conservation and waste reduction measures. The
ESH management programs of TSMC suppliers are tied to a
sustainability index that includes three components: the Green
Index, the Social Index and the Risk Index. The Green Index
includes environmental management systems, regulatory
compliance, hazardous substance management, conflict
mineral investigation, greenhouse gas inventory and other
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green activities. The Social Index includes labor and ethical
conduct. Both of the Green and Social indices are consistent
with the Electronic Industry Citizenship Coalition (EICC)
Code of Conduct. The Risk Index includes safety and health
management, fire prevention, natural disaster mitigation, IT
interruption recovery, transportation reliability, supply chain
management and business continuity plan. This sustainability
index is applied to TSMC’s critical suppliers.
7.2.1 Environmental Protection
Greenhouse Gas (GHG) Emission Reduction
TSMC is an active participant in international environmental
regulatory and protection programs. TSMC achieved its
voluntary PFC emissions reduction goal as per its commitment
to the World Semiconductor Council (WSC) and the Taiwan
Environmental Protection Administration (EPA) in 2010.
The “Greenhouse Reduction and Management Act” established
by Environmental Protection Administration Executive Yuan,
R.O.C. (Taiwan) have been in effect since July 1, 2015. The
related sub-regulations will be established and announced
soon, and TSMC is preparing to take action. In 2005, TSMC
was the semiconductor leading company to complete the GHG
inventory program and make a complete inventory of its GHG
emissions and to gain ISO 14064 certification. The purpose
of the inventory is to serve as a baseline reference for TSMC’s
strategy to reduce GHG emissions, to meet domestic regulatory
requirements, and to prepare for carbon trading and corporate
carbon asset management. All TSMC facilities conduct an
annual GHG inventory. The inventory shows that the major
direct GHG emissions are perfluorinated compounds (PFCs),
which are used in the semiconductor manufacturing process.
The primary indirect GHG emission is electricity consumption.
The Company has taken measures to reduce its emission of
GHGs. TSMC endorsed a memorandum of understanding to
the Taiwan Semiconductor Industry Association, the Taiwan
EPA, and the WSC, set up the corporate PFC emission reduction
policy and action plans proactively whereby the Company
committed to reducing PFC emissions to 10% below the
average of 1997 and 1999 by 2010, a commitment that it was
proud to achieve. This emissions target remains fixed as TSMC
continues to grow and expand its manufacturing facilities.
TSMC is active in the WSC’s activities to set up a global
voluntary PFC emissions reduction goal for the next ten years,
and has incorporated past experience to develop best practices.
The implementation of best practices has been adopted by
the WSC as a major element of the 2020 goal. In 2013, in
accordance with the “EPA Early Actions for Carbon Credit of
Greenhouse Gases Reduction” regulation, TSMC applied for the
recognition of greenhouse reduction from 2005 to 2011 that
committed to the WSC and EPA, and received 5.28 million tons
carbon dioxide credits in 2015. Those carbon credits can be
used to offset greenhouse gas emissions of new manufacturing
facilities regulated by Environmental Impact Assessment
(EIA) Act. It will mitigate climate change risk to support the
Company’s sustainable operation.
Coal-fired power generators, the major source of electricity in
Taiwan, emit large amounts of carbon dioxide (CO2). TSMC
has not only adopted energy-conserving designs for both its
manufacturing fabs and offices, but has also continuously
improved the energy efficiency of facilities during operation.
These efforts simultaneously reduce both carbon dioxide gas
emissions and costs.
In 2015, TSMC purchased 100 million kilowatt hours (kWh)
of green power, actively participating in the R.O.C. Ministry
of Economic Affairs’ voluntary “Green Power Purchasing
Program”. TSMC’s commitment made up nearly 13% of
Taiwan Power Company’s total green power available for
purchase under the program in 2015. Since green power
generated with zero carbon emissions, the purchase of 100
million kWh of green power will reduce 52 million kilograms
CO2 emission, equivalent to the carbon absorbed by 5.2 million
trees in one year. TSMC hopes that by taking action to support
Taiwan’s renewable energy development, it can continue to
pursue sustainability, support a low-carbon environment, and
reduce the impact of global warming.
Air and Water Pollution Control
The Company has installed effective air and water pollution
control equipment in each wafer fab to meet regulatory
emissions standards. In addition, TSMC maintains backup
pollution control systems, including emergency power
supplies, to lower the risk of pollutant emission in the event of
equipment breakdown. TSMC centrally monitors the operations
of air and water pollution control equipment around the clock
and treats system effectiveness as an important tracking item
to ensure the quality of emitted air and discharged water.
To make the most effective use of Taiwan’s limited water
resources, all TSMC fabs make an effort to increase
water reclamation rates by adjusting the water usage of
manufacturing equipment and improving wastewater
reclamation systems. All fabs are meeting or exceeding the
process water reclamation rate standard of the Science Park
Administration. New fabs are able to reclaim more than 85%
of process water, and outperforming most semiconductor fabs around the world. TSMC also strives to reduce non-manufactur-
ing-related water consumption, including water used in air conditioning systems, sanitary facilities, cleaning, landscaping and
kitchens. TSMC uses an intranet website to collect and measure water recycling volumes company-wide.
Since water resources are inherently local, TSMC shares its water saving experiences with other semiconductor companies through
the Association of Science-Based Industrial Park to promote water conservation in order to achieve the Science Park’s goals and
ensure a long-term balance of supply and demand.
Waste Management and Recycling
The Company has a designated unit responsible for waste recycling and disposal. To meet the goal of sustainable resource
utilization, TSMC’s priorities are: 1) reduce process waste, 2) increase on-site reuse, and 3) increase off-site recycling; the last choice
is treatment or disposal. To achieve raw material reduction, resource recycling and the goal of zero waste, TSMC built an in-house
waste sulfuric acid pre-treatment system in 2015 for electronic grade sulfuric acid can be used as waste water treatment agents
after wafer fabrication process. In order to track the waste flow, TSMC carefully selects waste disposal and recycling contractors and
performs annual audits of certification documents and site operations. TSMC also adopts proactive actions to strengthen vendor
auditing effectiveness. For example, all waste transportation contractors are requested to join the “GPS Satellite Fleet” so that all
the cleanup transportation routes and abnormal stays for all trucks can be traced, a program that all contractors joined in 2015. In
addition, all waste recycling and treatment vendors have installed CCTV at operating sites to review and audit the waste handling.
Meanwhile, TSMC also conducts an ongoing survey of recycling product tracking. Such actions were taken to ensure lawful and
proper waste recycling and treatment. TSMC achieved a 95% waste recycling rate in 2015, while our landfill rate was below 1% for
the sixth consecutive year.
Environmental Accounting
The purpose of TSMC’s environmental accounting system is to identify and calculate environmental costs for internal management.
At the same time, the Company can also evaluate the savings or economic benefits of environmental protection programs so as
to promote cost-effective programs. While environmental expenses are expected to continue growing, environmental accounting
can help TSMC manage these costs more effectively. TSMC’s environmental accounting measures various environmental costs,
establishes independent environmental account codes, and provides these to all units for use in annual budgeting. The Company’s
economic benefit evaluation calculates cost savings for reduction of energy, water or waste and benefits from waste recycling in
accordance with our environmental protection programs.
The environmental benefits disclosed in this report include real income from projects such as waste recycling and savings from major
environmental projects. In 2015, 367 environmental projects of TSMC fabs were completed and the total benefits, including waste
recycling, were more than NT$1,053 million.
2015 Environmental Cost of TSMC Fabs in Taiwan
Unit: NT$ thousands
Classification
1. Direct Costs for Reducing Environmental Impact
Description
Investment
Expense
(1) Pollution Control Cost
Fees for air pollution control, water pollution control, and others
(2) Resource Conservation Cost
Costs for resource (e.g. water) conservation
(3) Waste Disposal and Recycling
Costs for waste treatment (including recycling, incineration and landfill)
2. Indirect Cost for Reducing Environmental
Impact (Environmental Managerial Cost)
3. Other Environmental Costs
Total
1) Cost of training (2) Environmental management system and certification
expenditures (3) Environmental impact measurement and monitoring fees (4)
Environmental protection product costs (5) Environmental protection organization
fees
(1) Costs for decontamination and remediation (2) Environmental damage
insurance fees and environmental taxes and expenses (3) Costs related to
environmental settlement, compensations, penalties and lawsuits
4,904,897
1,557,383
-
117,717
3,232,928
-
1,048,089
220,401
-
-
6,579,997
4,501,418
112
113
2015 Environmental Efficiency of TSMC Fabs in Taiwan
Unit: NT$ thousands
Category
Description
1. Cost Savings of Environmental Protection
Energy savings: completed 152 projects
Projects
Water savings: completed 42 projects
Waste reduction: completed 173 projects
2. Real Income from Industrial Waste Recycling
Recycling of used chemicals, wafers, targets, batteries, lamps, packaging materials, paper cardboard, metals, plastics,
and other waste
Total
Efficiency
402,519
105,979
148,700
396,209
1,053,407
Other Environmental Protection Programs
TSMC conducts “Product Life Cycle Assessments” (Product LCA), collecting and analyzing data across the entire semiconductor
manufacturing chain from raw material suppliers to finished products, including statistics for such items as energy, raw material
consumption, and pollution. The Product LCA study has established “Eco-Profiles” for all TSMC fabs and helps the Company to meet
international regulations, such as the European Union’s “Energy-Using Product” directive. These “Eco-Profiles” can also be provided
to customers who require such documentation. In 2015, TSMC calculated product average carbon footprint and water footprint of
all its fabs in Taiwan, which were certified by the third party for ISO 14067 and ISO 14046, respectively. We not only provide such
information to customers but also continue to promote carbon reduction and water conservation at TSMC and in the supply chain
from a life cycle point of view.
TSMC also follows “green procurement” procedures that require raw material suppliers to declare that the materials they supply
do not contain any environmental harmful prohibited substances. This ensures that products manufactured by TSMC comply with
customer requirements and the regulatory requirements of the European Union’s RoHS Directive. TSMC also encourages employees
to use “Green Mark” products in offices, such as recycled paper, desktop PCs, LCD monitors, and batteries.
Since 2006 TSMC has adopted standards from both the Taiwan “Green Building” and the green building evaluation of the U.S.
Green Building Council - Leadership in Energy and Environmental Design (LEED) for new fab and office building designs to achieve
better energy and resource efficiency than conventional designs. At the same time, TSMC continues to upgrade existing office
buildings to comply with the LEED standard each year. From 2008 to 2015, 18 of TSMC’s fabs and office buildings achieved LEED
certifications: 2 Platinum and 16 Gold class. Meanwhile, TSMC also received 3 Taiwan’s Diamond class Intelligent Building and 10
Taiwan’s EEWH (Ecology, Energy Saving, Waste Reduction and Health) Diamond class certification.
TSMC believes that all manufacturing companies should convert their facilities into green factories to improve the environment and
lower construction costs. Therefore, the Company freely shares its practical experience with industry, government, and academia. As
of the end of 2015, more than 8,730 visitors from 230 different industry, government, academic, and general community groups
contacted TSMC to gain understanding on the Company’s green factory practices. TSMC led the industry to support the Taiwan
government in establishing the “Green Factory Labeling System” since 2009, a system that included “Clean Production Evaluation”
and “Green Factory Evaluation.” TSMC received Taiwan’s first “Green Factory Label” and six labels in total for Fab 12 Phase 4, Fab
14 Phase 3 and Phase 4, Fab 12 Phase 5 and Phase 6, and Fab 15 Phase 1 and Phase 2.
Environmental Compliance Record
In 2015 and as of the date of this Annual Report, TSMC had not received any environmental penalties or fines.
7.2.2 Green Products
TSMC collaborates with its upstream material and equipment
suppliers, design ecosystem partners and downstream
assembly and testing service providers to minimize
environmental impact. We reduce the resources and energy
consumed for each unit of production and are able to provide
more advanced, power efficient and ecologically sound
products, such as lower-power-consumption chips for mobile
devices, high-efficiency LED drivers chips for Flat Panel Display
Backlighting and indoor/outdoor Solid State LED lighting,
and “Energy Star” certified low standby AC-DC adaptors
chips, etc. By leveraging TSMC’s superior energy-efficient
technologies, these chips are used for supporting sustainable
city infrastructure, greener vehicles, smart girds, and so
on. In addition to helping customers design low-power,
high-performance products to reduce resource consumption
over the product’s life cycle, TSMC implements clean
manufacturing practices that provide additional “Green Value”
to customers and other stakeholders.
TSMC-manufactured ICs are used in a broad variety of
applications covering various segments of the computer,
communications, consumer, industrial and other electronics
markets. Through TSMC’s manufacturing technologies,
customers’ designs are realized and their products are
incorporated into people’s lives. These chips, therefore, make
significant contributions to the progress of modern society.
TSMC works hard to achieve profitable growth while providing
products that add environmental and social value. Listed below
are several examples of how TSMC-manufactured products
significantly contribute to the environment and society.
Environmental Contribution by TSMC Foundry Services
1. Continue to Drive Technology to Lower Power
Consumption and Save Resources
● TSMC continues to drive the development of advanced
semiconductor process technologies to support customer
designs that result in the most advanced, energy-saving, and
environmentally friendly products to support sustainability.
In each new technology generation, circuitry line widths
shrink, making transistors smaller and reducing product
power consumption. TSMC’s 28nm technology, for example,
can accommodate approximately four times the number
of electronic components as 55nm technology. ICs made
with 28nm technology in active or standby mode consume
roughly one-third the power of 55nm products, according to
TSMC’s internal test results.
● TSMC has led the dedicated foundry segment in offering
28nm process technology and shipped over 4.5 million
wafers to customers in total from 2011 to 2015. TSMC
provides 28nm High Performance (28HP), 28nm High
Performance Low Power (28HPL), 28nm Low Power (28LP),
28nm High Performance Mobile Computing (28HPM), 28nm
High Performance Compact (28HPC) for mobile computing
and 28nm High Performance Compact Plus (28HPC+) for
mobile computing to meet customers’ various needs for
more advanced, energy-saving, and environmentally friendly
products.
● TSMC continues to deliver Performance-per-Watt scaling
in its 20nm SoC (20SoC), 16nm FinFET Plus (16FF+), and
10nm FinFET process technologies. With energy-efficient
transistors and interconnects, the 20nm SoC process can
reduce total power consumption of the 28nm process by
a third. By migrating from planar to FinFET technology, the
16FF+ process can further reduce total power consumption
to about 30% of 28nm technology. TSMC’s 10nm technology
continues FinFET evolution for even better performance and
lower power; total power consumption is only 20% of 28nm
technology. TSMC’s 16FF+ started volume production in
mid-2015, only one year after the Company introduced 20nm
technology. In addition, 10nm FinFET technology began
customer product tape-out in the first quarter of 2016.
● TSMC quickly ramped its 28nm and below technologies.
Wafer revenue contribution from 28nm and below
technologies grew significantly from 1% in 2011 to 48%
in 2015. TSMC’s objective is to continue our R&D efforts in
28nm and below technologies and to increase the wafer
revenue contribution from 28nm and below technologies,
helping the Company achieve both profitable growth and
energy savings.
28nm-and-below Contribution to Total Wafer Revenue (Unit: %)
2011
1
2012
12
2013
30
2014
42
2015
48
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115
Chip Die Size Cross-Technology Comparison
Die size reduces as line width shrinks
1
0.53
0.48
0.25
0.13
0.12
0.068
55nm
45nm
40nm
28nm
20SoC
16FF+
10nm
Chip Total Power Consumption
Cross-Technology Comparison
More power is saved as line width shrinks
1
55LP
(1.2V)
0.6
40LP
(1.1V)
0.3
0.2
0.09
0.06
28HPM
(0.9V)
20SoC
(0.9 V)
16FF+
(0.8 V)
10nm
(0.75 V)
2. Provide Leading Power Management IC Process with the
Highest Efficiency
● TSMC’s leading manufacturing technology helps customers
design and manufacture green products. Power management
ICs are the most notable green IC products. Power
management ICs are the key components that regulate and
supply power to all IC components. TSMC’s analog power
technology R&D team uses 6-inch, 8-inch and 12-inch wafer
fabs to develop Bipolar-CMOS-DMOS (BCD) and Ultra-High
Voltage (UHV) technology, producing industry-leading power
management chips with more stable and efficient power
supplies and lower energy consumption for broad-based
applications in consumer, communication, and computer
markets. TSMC’s BCD is the best fit technology for
high-efficiency LED drivers for Flat Panel Display Backlighting
and indoor/outdoor Solid State LED lighting. In addition,
TSMC’s UHV with 400V~800V options is the best fit
technology for green product applications, such as “Energy
Star” low standby AC-DC adaptors, Solid State LED lighting,
and high-efficiency DC brushless motors.
● TSMC also provides analog and power-friendly design
platforms. Customers use these platforms to develop
energy-saving products.
● Power management ICs generate material revenue to TSMC’s
industrial market segment. In 2015, TSMC’s HV/Power
technologies collectively shipped more than 2 million wafers
to customers. In total, power management ICs manufactured
by TSMC accounted for more than one-third of global
computer, communication and consumer systems.
HV/Power Technologies Shipments (Unit: 8-inch equivalent wafer)
2011
>800K
2012
2013
2014
2015
>1,000K
>1,300K
>1,800K
>2,000K
3. Green Manufacturing that Lowers Energy Consumption
TSMC continues to develop technologies for more advanced
and efficient manufacturing services that reduce energy/
resource consumption and pollution per unit as well as power
consumption and pollution during product use. In each new
technology generation, circuitry line widths shrink, making
circuits smaller and lowering the energy and raw materials
consumed for per unit manufacturing. In addition, the
Company continuously provides process simplification and new
design methodology based upon its manufacturing excellence
to help customers reduce design and process waste to produce
more advanced, energy-saving and environmentally-friendly
products. To see the total energy savings and benefits realized
in 2015 through TSMC’s green manufacturing, please refer to
pages 113-114, “Environmental Accounting”.
Social Contribution by TSMC Foundry Services
1. Unleash Customers’ Mobile and Wireless Chip Innovations
that Enhance Mobility and Convenience
● The rapid growth of smartphones and tablets in recent
years reflects strong demand for mobile devices. Mobile
devices offer remarkable convenience, and TSMC contributes
significant value to these devices, including: (1) new process
technology helps chips achieve faster computing speeds in
a smaller die area, leading to smaller form factors for these
electronic devices. In addition, SoC technology integrates
more functions into one chip, reducing the total number of
chips in electronic devices and resulting in a smaller system
form factor; (2) new process technology also helps chips
consume less energy. People can therefore use mobile devices
for a longer period of time; and (3) with more convenient
wireless connectivity such as 3G/4G and WLAN/Bluetooth,
people communicate more efficiently and can “work anytime
and anywhere,” significantly improving the mobility of
modern society.
● Mobile computing related products, such as Baseband,
RF Transceiver, Application Processors (AP), Wireless Local
Area network (WLAN), imaging sensors, and Near Field
Communication (NFC), Bluetooth, Global Positioning System
(GPS) among others, represent 51% of TSMC wafer revenue
in 2015. TSMC’s growth in recent years has largely been
driven by the growing global demand for these mobile IC
products.
Contribution of Mobile Computing Related Products to TSMC Wafer Revenue
(Unit: %)
2011
36
2012
40
2013
44
2014
48
2015
51
Note: Mobile computing related products were re-classified in 2014.
2. Unleash Customers’ MEMS (Micro Electro Mechanical
Systems) Innovations that Enhance Human Health and
Safety
● In addition to smart-phones, tablets, and many other
consumer electronic devices, TSMC-manufactured MEMS
chips are widely used in medical treatment and health
care applications. By leveraging the Company’s advanced
technologies, more and more chips for these applications
are introduced to the market, providing major contributions
to modern medicine. Customers’ MEMS products are used
in a number of advanced medical treatments as well as in
preventative health care applications. Examples include early
warning systems to minimize the injury from falls for the
elderly, systems to detect physiological changes, car safety
systems and other applications that greatly enhance human
health and safety.
7.2.3 Safety and Health
Safety and Health Management
TSMC’s safety and health management is built on the
framework of the OHSAS 18001 system and adheres to the
management principle of “Plan, Do, Check, Act” to prevent
accidents and protect employee safety and health as well as
Company assets. All TSMC fabs in Taiwan have also received
Taiwan Occupational Safety and Health Management System
(TOSHMS) certification.
Besides accident prevention, TSMC has established emergency
response procedures to protect employees and contractors if
a disaster should occur, as well as to prevent and to minimize
the negative impact on society and the environment. TSMC
continually communicates with its suppliers to ensure that
potential risk in the operation of production equipment is
minimized, and rigorously follows safety control procedures
when installing production equipment. The Company places
stringent controls on high-risk operations and also evaluates
the seismic tolerance of its facilities and equipment to reduce
the risk of earthquake damage.
For epidemics, TSMC has established company-level prevention
committees and procedures for emergency response to
outbreaks of infectious diseases.
Working Environment and Employee Safety and Health
Protection
TSMC’s ESH policy is focused on establishing a safe working
environment, preventing occupational injury and illness,
keeping employees healthy, enhancing every employee’s
awareness and sense of accountability to ESH, and building an
ESH culture. TSMC safety and health management operations
apply to:
● Equipment Safety and Health Management
In addition to meeting regulatory requirements and internal
standards, as well as mitigating ESH-related risks when building
or rebuilding facilities, TSMC also maintains procedures
governing new equipment and raw materials, safety approvals
for bringing new tools online, updating safety rules, seismic
protection measures, and other safety measures.
TSMC requires that all new tools meet SEMI-S8 requirements
and that appropriate supplementary control measures be
taken to reduce ergonomic risk. Moreover, TSMC endeavors
to automate 300mm front-opening unified pod (FOUP)
transportation to prevent accumulative damage caused by
long-term manual handling of 300mm FOUPs. TSMC 300mm
fabs have completed automatic transportation control.
● Environmental, Safety and Health Evaluation of New Tools
and New Chemical Substances
TSMC, as a technology leader in the worldwide semiconductor
industry, operates many diversified process tools and new
chemicals in the R&D stage. Before using those new tools and
new chemicals, they are reviewed carefully by the “New Tools
and New Chemical Review Committee”. The purpose is to
ensure that new tools are compliant with the semiconductor
industry’s safety standards (such as SEMI S2) and that new
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117
chemicals’ environmental, safety and health concerns can be
well controlled, including engineering controls, application of
personal protection equipment, and operational safety training
during storage, transportation, usage, and disposal.
cooperation in handling accidents and to effectively minimize
any damage caused by disasters. At least every two years, fab
directors invite fab management and support functions and
run crisis management drills for the potentially high-risk events
such as earthquake, fire, and flood (Tainan site).
● General Safety Management, Training and Audit
All TSMC manufacturing facilities hold environmental, safety
and health committee meetings on a monthly basis. TSMC
takes preventive measures such as controls on high-risk work,
contractor management, chemical safety management,
personal protective equipment requirements, and safety audit
management. In addition, TSMC maintains detailed disaster
response procedures and performs regular drills designed
to minimize harm to employees and property, as well as the
impact on society and the environment in the event of a
disaster.
● Working Environment Hazardous Factors Management
TSMC conducts workplace hazard assessment and
interventions to provide a comfortable and safe workplace
to employees. TSMC also requires employees to use personal
protective equipment (PPE) to prevent hazardous exposures.
TSMC performs semi-annual workplace environment
assessments of physical and chemical hazards, including CO2
concentration, illumination, noise, and hazardous chemical
substances regulated by domestic laws. The Company performs
exposure assessment and takes hierarchy management for
chemicals with health hazard from 2015 on. If abnormal
measurements or events happen or the result of exposure
assessment indicates there is adverse health effect for
employees, site ESH professionals conduct onsite observation
and interventions to reduce exposure to acceptable levels.
● Emergency Response
The planning and execution of an effective emergency response
should adapt high risk events from risk assessment as selective
scenarios, the scope should cover severe events to have
continuous improvement and practice drills. TSMC’s emergency
response plans include procedures for rapid response crisis
management and disaster recovery to potential incidents.
All TSMC fabs conduct major annual emergency response
exercises and evacuation drills. TSMC’s -Tainan site fabs
continue their spot drills, which have been recognized as good
practices. TSMC’s on-site service contractors also participate
in emergency response planning and exercises to ensure
In addition to the regular emergency response drills held
by engineering and facilities departments each quarter, the
Company’s laboratory, canteen, dormitory, and shuttle bus
personnel also hold emergency response drills to prepare
for events such as earthquakes, chemical leakage, ammonia
release, fires and automobile accidents.
● Emerging Infectious Disease Response
TSMC has a dedicated corporate ESH organization to monitor
emerging infectious diseases around the world, to assess
any potential impact on the workplace, and to provide an
appropriate strategic response plan. In previous outbreaks
(such as SARS in 2003 and the H1N1 influenza outbreak in
2009), TSMC convened the Corporate Influenza Response
Committee to develop the Company’s strategies. These
strategies include educating employees in prevention and
response, publishing guidelines for managers, establishing
guidelines for employee sick leave due to flu, and installing
alcohol-based hand sanitizers at appropriate locations. The
Committee also monitors the status of employee leave due
to illness and, at the same time, develops a continuous plan
to address manpower shortages as well as minimize business
impact.
TSMC believes that employees’ physical and mental health
is not only fundamental to maintaining normal business
operations but also part of a corporation’s responsibility.
● Employee Physical and Mental Health Enhancement
To protect and promote employee physical and mental health,
TSMC strives to eliminate cardiovascular disease that might
be induced by overwork, night work or shift work; to prevent
workplace violence, and to reduce ergonomic hazards. The
Company seeks to promote mental health by collaborating
with site ESH, site medical personnel, and physicians of
occupational medicine. At the beginning of 2015, 48
employees with high risk for cardiovascular diseases, which is
better than the average of general population, were screened
out and, through planned personal health management, their
risk profiles were reduced to moderate and low for 7 (15%)
and 29 (60%) respectively. Regarding ergonomic hazard
prevention, 61 employees with musculoskeletal disorders were
identified with on-site operation visit, of which 9 have been
either addressed with long-time follow-up or reassigned to
another work. In order to promote employee mental health,
in 2015, TSMC held 22 metal health symposiums with a total
employee participation of 2,209, and the satisfaction rate was
over 85%. TSMC also institutes hazard assessments, controls,
lectured by a doctor, hierarchy management measures, and
work adjustment or reassignment for work which is potentially
hazardous to maternal health. In total, 1,078 pregnant
employees were evaluated, of which two were reassigned to
another work.
Health promotion activities for employees include fitness
programs, women’s health care programs, mother’s rooms,
body weight control programs, sleep problem management,
massage and chiropractic services, hepatitis and flu
vaccinations, and health lectures. TSMC believes employees
who are physically and mentally healthy can enjoy a better
quality of life and be more productive.
● Contractor Self Evaluation and Management of Health
To mitigate safety risks resulting from the sudden onset
of illness, TSMC launched the Contractor Self Evaluation
and Management of Health Program at Fab12B in 2014.
Contractors performing high-risk work, such as work at
heights and at cleanroom ceilings, are required to check the
health status in advance for those workers undertaking such
high-risk tasks. Those determined to have chronic illness
and self-reported symptoms must visit a doctor for physical
evaluation and treatment to reduce health and safety risks in
workplace.
Supplier and Contractor Management
● Supplier Management
As a means of enhancing its supply chain management,
TSMC is committed to communicating with and encouraging
its contractors and suppliers to improve their quality, cost
effectiveness, delivery performance and sustainability on
environmental protection, safety and health. Through
regular communication with senior managers, site audits
and experience sharing, TSMC collaborates with major
suppliers and contractors to enhance partnership and ensure
continual improvement for better performance and increased
joint contributions to society. As noted above, contractors
performing high-risk activities must lay out clearly defined
safety precautions and preventative measures. In addition,
contractors working on high-risk engineering projects must
establish OHSAS 18001 systems and the workers must
successfully complete work skill training.
● Supply Chain Sustainability
TSMC works with its suppliers in several fields of sustainable
development, such as greening the supply chain, carbon
management for climate change, mitigation of fire risk,
ESH management and business continuity plans for natural
disasters.
Since becoming a full member of the Electronic Industry
Citizenship Coalition (EICC) in 2015, TSMC has completed the
adoption of the EICC Code of Conduct across the Company
by performing self-assessments at its facilities worldwide and
reviewing policies and procedures in the areas of labor, health
and safety, environment, ethics, and management system.
To enhance supply chain sustainability and streamline the
supply chain’s risk management, TSMC is committed to
collaborating with its suppliers to maintain full compliance with
the Taiwan environmental, safety, health and fire regulations,
and to establish the necessary management capability as well
as continuous enhancement.
TSMC is subject to the U.S. Securities & Exchange Commission
(SEC) disclosure rule on conflict minerals released under Rule
13p-1 of the U.S. Securities Exchange Act of 1934. As a
recognized global leader in the high-tech supply-chain, the
Company acknowledges its corporate social responsibility
to strive to procure conflict free minerals in an effort to
recognize humanitarian and ethical social principles that
protect the dignity of all people. To this end, TSMC has
implemented a series of compliance safeguards in accordance
with leading industry practices such as adopting the due
diligence framework in the OECD’s Model Supply Chain
Policy for a Responsible Global Supply Chain of Minerals from
Conflict-Affected and High Risk Areas issued in 2011.
TSMC is one of the strongest supporters of the Electronic
Industry Citizenship Coalition and the Global e-Sustainability
Initiative (GeSI), and this will help our suppliers source
conflict-free minerals through their jointly developed
Conflict-Free Smelter Program (CFSP). TSMC has asked its
suppliers to disclose and timely update information on smelters
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119
and mines since 2011. TSMC also encourage its suppliers to
source minerals from facilities or smelters that have received
a “conflict-free” designation by a recognized industry group
(such as the EICC). TSMC also requires those who haven’t
received such designation to become compliant with CFSP or
an equivalent third-party audit program. TSMC requires the
use of tantalum, tin, tungsten and gold in its products that are
conflict-free. TSMC will continue to renew our supplier survey
annually and require our suppliers to improve and expand
their disclosure to fulfill regulatory and customer requirements.
For further information, please see our Form SD filed with the
U.S. SEC. (http://www.tsmc.com/english/investorRelations/
sec_filings.htm)
7.3 TSMC Education and Culture Foundation
The TSMC Education and Culture Foundation (TSMC
Foundation) is led by TSMC Vice Chairman F.C. Tseng, who
serves as the Foundation’s Chairman. Established in 1998 to
coordinate the Company’s financial sponsorship as part of
its efforts in corporate social responsibility, the Foundation
devotes its resources to education, promotion of the arts
and cultural events, community building, and the employee
Volunteer Program.
In 2015, the TSMC Foundation contributed over NT$68.4
million to its long-term projects for arts promotion and
humanity education. In 2015, the Foundation sponsored
the National Theatre and Concert Hall to invite the Royal
Concertgebouw Orchestra to visit Taiwan and, with the
National Symphony Orchestra, jointly produce the opera
Fidelio. Both of these performances provided the Taiwan
people with extraordinary performing arts. With contributions
such as these, the Foundation hopes to lead the trend of
promoting the arts and enriching the spiritual life of society in
general.
Commitment to Education
Education is the most important priority for the progress of a
nation. The TSMC Foundation tailors its various programs to
target a whole range of educational needs at various age levels.
At the primary school level, the Foundation emphasizes
aesthetics education, and for many years has contributed
resources to a variety of children’s art education programs,
including the “TSMC Aesthetic Tour,” which, over the past
13 years, has taken more than 90,000 children from remote
townships to visit the National Palace Museum, the Taipei Fine
Arts Museum and other fine arts sites.
At the high school level, to enhance the student appreciation
of the sciences and humanities, the Foundation supports and
organizes science camps, contests, and humanity activities. The
Foundation continued to sponsor The Center for Advanced
Science Education at National Taiwan University to hold the
competition, “TSMC Cup – Competition of Scientific Story
Telling”. This year the competition focused on “light” and
invited senior high school students to read respected books
on the subject, write essays on reading and thought, and
deliver short scientific talks on cultivating logical thinking,
argumentation and presentation.
The Foundation also supports three science talent camps –
Wu Chien-Shiung Science Camp, Wu Ta-Yu Science Camp
and Madame Curie Senior High School Chemistry Camps – to
provide talented students with the opportunity to meet and
learn from the world-class scientists with the goal of inspiring
the students and helping them realize their potential. This
year the TSMC Foundation also sponsored the National
Taiwan Science Education Center (NTSEC) to organize Taiwan
International Science Fair, from which two Taiwan groups
were selected to participate in the International Science and
Engineering Fair (ISEF) in Netherlands. One team earned a gold
medal and the second earned the bronze medal.
In the humanities, the TSMC Foundation supports “Hope
Reading” of the CommonWealth Foundation that donates
good books to 30 junior high schools of Taiwan’s remote
townships to promote the habit of reading among
underprivileged teenagers. The Foundation also held “the
TSMC Youth Literature Award” and “TSMC Youth Calligraphy
Contest” to showcase literacy and excellence in art of talented
youth and enrich their humanity.
At the college level, in addition to endowing chair
professorships to enhance academic research at Taiwan
universities, the TSMC Foundation continued to sponsor the
“Rising Sun Plan” of National Tsing Hua University and the
“Sunflower Plan”. To bridge the unbalanced educational
resources allocation caused by the gap between rich and
poor, the plan provides underprivileged students a chance
to enter top-notch universities with financial supports. And
to encourage young writers, the Foundation continued to
collaborate with the INK Literature Magazine to bestow the 3rd
TSMC Literature Award attracting hundred submitted works.
Promotion of Arts and Culture
The TSMC Education and Culture Foundation has made
considerable efforts over the years to promote the arts and
culture. In addition to actively assisting prominent Taiwanese
art groups to gain recognition on the international stage,
TSMC also provides support for performances held in Taiwan
by arts groups from around the world, giving the Taiwanese a
chance to view the world’s finest right at home. This year the
Foundation sponsored the Royal Concertgebouw Orchestra
to visit Taiwan second time since this permanent performing
group visited Taiwan in 2006. Led by the prominent conductor,
Gustavo Gimeno, the orchestra presented two symphonic
classics: Beethoven’s Pastorale and Tchaikovsky’s Pathetique.
The Foundation also collaborated with the National Theatre
and Concert Hall to create an exhibition tracing the Orchestra’s
history in the Concert Hall lobby, to invite 100 remote
townships students to attend the concert, and to organize
a live broadcast of the concert on the Arts Plaza of National
Theater and Concert Hall, attracting an audience of over 5,000.
In addition to inviting international orchestras, the TSMC
Foundation also supported Taiwan’s performing arts groups.
Besides the TSMC Hsin-chu Arts festival of regular invitations,
the Foundation continued to sponsor National Symphony
Orchestra to collaborate with Zurich Opera Theatre to present
Beethoven’s one and only opera, Fidelio. This exquisite
opera production not only amazed the audience but, more
importantly, also provided Taiwan performing arts groups with
invaluable international theater production experience and
uplifting their performing arts.
participants could feel the atmosphere of an oriental salon. The
Foundation also invited Professor Li Hon-chi, Emeritus Professor
of New York University, to introduce the audience to the
Protestant Reformation Era in a coffee shop.
Building Community by Arts
The Foundation has long played the role of “fine arts planter”
to spread the seeds of fine arts to the community through
continuous art activities. At TSMC’s site communities, Hsinchu,
Taichung and Tainan, the Foundation annually organizes
“TSMC Hsinchu Arts Festival” to present a broad spectrum of
performances to meet the communities’ interests in art.
The theme of 2015 TSMC Hsin-chu Arts Festival was ”Hero”.
The Foundation invited top artists to share their heroic way to
achieve their goals by theatrical arts, music, poetry and video.
Promoting Chinese theatrical arts is always one of the main
goals of the Festival. Therefore, the Festival invited the Xin-Xin
Nanguan Ensemble, the GuoGuang Opera Company and
Professor Huang Yi-Long to introduce audience to the beauty
of Chinese Traditional Arts by Nanguan Music, Chinese Opera
and History. Also the Festival organized a variety of marvelous
concerts by prestigious musicians, including the English cellist
Steven Isserlis, French classical pianist Jean-Efflam Bavouzet,
and the National Symphony Orchestra. The NSO laureate
conductor Gunther Herbig and the Armenian violinist Sergey
Khachatryan, the winner of the 2005 Queen Elisabeth Music
Competition, performed the Beethoven’s Classic Symphony
Eroica and Max Bruch’s First Violin Concerto, evoked a standing
ovation by the whole audience.
The TSMC Foundation has a long-term commitment to
promote Chinese Traditional Classics. Through lectures,
broadcast programs and audio books, the Foundation relives
the Classics that enable audiences to easily understand
traditional Chinese philosophy and wisdom. Since 2008,
the TSMC Foundation has invited Professor Hsin Yih-yun
to produce Chinese Classics broadcast programs on the IC
Radio Broadcasting Station. The programs are extremely
popular and followed by Chinese audiences all over the world.
The Foundation also held innovative lectures with unique
decorations and arrangements to narrow the gap between the
audience and the speakers and let the audience feel the appeal
of the Classics. Dream of Red Chamber Lectures delivered by
Professor Huang Yi-Long were conducted in tea banquets so
Also in 2015, the TSMC Hsin-chu Arts Festival made a major
effort to uplift the community through the power of the
arts. The festival facilitated a connection between National
Theater-Concert Hall (NTCH) Opera Workshop Artists and the
Taiyen Music School to perform the children’s opera Sleeping
Beauty. All box office income was donated to Taiyen Music
School for cultivating students’ music talent. To celebrate the
Dragon Boat Festival, the Hins-chu Arts Festival organized a
unique concert at Hsinchu Park by inviting renowned poets,
Cheng Chou-yu, Lin Yangmin and Hsu Huei-chih. The closing
concert combined sand paintings by Chuang Min-Da and a
performance of Taiwan String Orchestra to salute the four
seasons. All in all, the Festival arranged around 30 activities and
attracted over 20,000 attendees.
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7.4 TSMC Volunteer Program
TSMC takes corporate social responsibility seriously, and the
TSMC Volunteer Program, led by Mrs. Sophie Chang, President
of the Program, is dedicated to promoting education and
culture, providing aid for the underprivileged, advocating
energy savings, and caring for the community. The program
aims to provide a host of channels, encouraging employees to
utilize personal professions and capabilities to give back to the
society.
Employees and their families can take part in a variety of
programs including:
● TSMC Volunteer Docent Program
● TSMC Book Reading Volunteer Program
● TSMC Energy-savings Volunteer Program
● TSMC Community Volunteer Program
● TSMC Ecology Volunteer Program
● TSMC Fab/Division Volunteer Program
TSMC Volunteer Docent Program
To promote science education and enhance people’s
understanding of the semiconductor industry, TSMC made
a donation to the National Museum of Natural Science in
Taichung in 1997 to set up an exhibition hall, “The World
of the Integrated Circuits”. The hall was renovated twice,
and then replaced entirely in 2011 with “The World of
Semiconductors” exhibition hall.
TSMC Volunteer Docent Program was established in 2004 to
provide visitors with guided tours. In 2015, a total of 1,300
volunteers with 8,782 dedicated service hours were recorded;
the cumulative total reached more than 69,001 service hours.
The docents’ enthusiasm and professionalism were highly
praised by visitors. The group has continuously been
recognized as the “Outstanding Volunteer Team” by the
National Museum of Science.
TSMC Book Reading Volunteer Program
To help reduce the disparity of educational resources between
rural and urban schools, TSMC Foundation started sponsoring
the “Hope Reading Program” organized by CommonWealth
Magazine in 2004 with the annual donation of 20,000 books
to 200 schools in remote and rural areas.
Following on the early efforts of TSMC Foundation, the TSMC
Book Reading Volunteer Program was established in 2005. In
2015, almost 700 volunteers devoted in excess of 9,510 hours
of services to eight remote schools in Hsinchu, Taichung and
Tainan; the cumulative total reached more than 48,555 service
hours.
TSMC Energy Savings Volunteer Program
Leveraging the expertise of TSMC employees in energy savings,
TSMC Energy Savings Volunteer Program was established in
2008 to assist schools looking to improve environmental safety
and reduce electricity telecommunication costs, as well as
water and air-conditioning consumption. After assessing the
facilities, measuring and collecting data, and evaluating power
efficiency, the teams proposed energy-saving plans and ways
to reduce carbon emissions to the schools.
In 2015, 60 energy savings volunteers devoted 1,100 hours in
Taipei, Hsinchu, Taichung, Tainan and Kaohsiung areas.
TSMC Community Volunteer Program
When Typhoon Morakot struck Southern Taiwan in 2009,
TSMC employees, deeply saddened by the suffering it
caused, quickly established Typhoon Morakot Project Team.
Demonstrating strong teamwork, effectiveness and precision,
the team provided timely assistance and relief measures to the
typhoon victims.
Typhoon Morakot Project Team was transformed into TSMC
Community Volunteer Program in 2010, aimed at reaching
out to those in need, including both the elderly and children.
The TSMC Community Volunteer Program mainly serves the
elderly at Hsinchu Veterans Home and the children at St.
Teresa Children Center. In 2015, more than 460 volunteers
participated regularly in activities and were closely connected
to the elderly and the children.
Two Holiday Volunteer activities were held in July and August
2015 when TSMC Community and Fab/Division Volunteers
invited the children they served in the Book Reading Volunteer
Program and long-term companionship from Hsinchu,
Taichung, and Tainan to “Leofoo” and “EDA” theme parks.
With well-designed activities, these children from remote areas
spent a wonderful holiday together.
TSMC Ecology Volunteer Program
The TSMC Ecology Volunteer Program was launched in 2012.
In 2015, 580 volunteers donated their time to the cause of
environmental protection. Volunteers were trained as ecology
docents to share natural ecology concepts with school children
and the public visiting the selected areas. Activities in 2015
included the following:
● Hsinchu Fab 12B ecology park docent: more than 230
employees took part and the Company invited more than 300
students and teachers from ten elementary schools to visit
TSMC’s ecology park.
● Taichung Fab 15 ecology park docent: 110 employees took
part and the Company invited more than 200 students and
teachers from five elementary schools to visit TSMC’s ecology
park in Taichung.
● Tainan Jacana ecology education park docent: over 230
employees and their family members were recruited to serve
as volunteer docents at the Jacana ecology education park on
weekends and holidays.
TSMC Fab/Division Volunteer Program
Employees on the Fab/Division level devoted themselves to
various welfare activities for causes such as “Strengthening
Environment Protection,” and “Caring for the Disadvantaged”
to meet TSMC Corporate Social Responsibility Policy. These
included environmental protection, promotion of energy
conservation, caring of the disadvantaged, promotion of
education, help for farmers and workers, and charitable
donation.
1. Strengthening Environment Protection
● Environmental Protection
In 2015, volunteers held a charity bazaar by selling water
chestnuts from the Guantian Jacana Park and using the
proceeds to fix and replace telescopes in the park to improve
the quality of the eco tours. In Tainan, volunteers helped
reactivate the water purification plant on Monuments
Mountain and held cultural and environmental tours to bring
new life to the historical site.
● Energy Conservation
Despite severe competition in the technology industry, the
Company never forgets to cherish the environment. Seminars
concerning energy consumption and power reduction
continued to be held in 2015 to share TSMC’s knowledge
and technology of green buildings and energy savings
accomplishments. Through those efforts, the Company
hopes to root green power deeply into the minds of other
corporations.
2. Caring for the Disadvantaged
● Long-term Companionship
Beyond employees’ continuous and enthusiastic support to
repair and maintain old houses of people in need, provide
daily supplies and necessities, and offer warm companionship,
TSMC volunteers find new ways to enrich the lives of children.
In 2015, employees collected and provided used cameras for
children living in remote areas, leading them to see the world
in a different way through the camera. In addition, meal fees
were donated to children of the Kuskus tribe in southern
Taiwan, and promotions of their culture of old ballads were
conducted. Volunteers also supported Hui-Ming School for the
Blind and the underprivileged baseball team by giving them the
stage and means to perform. Lastly, they also taught girls from
St. Francis Xavier Home for Girls to learn skills and developed
their interests in handicraft and baking.
● Promotion of Education
In 2015, volunteers spread the seed of education further to
Guang-Rong Elementary School. The volunteers donated new
and used books to inspire the children’s interest in reading.
They provided guidance to students on their school work to
strengthen their comprehension and understanding and they
also helped to renovate the library to provide a larger place to
read for students.
● Help for Farmers and Workers
In 2015, TSMC volunteers supported farmers and fishermen to
divide water bamboo’s offshoot and string oysters. Plus they
collaborated with Formosa Charity Group to build dorms and
classrooms for the teenagers in the orphanage, raise funds
and resources, and repair the abandoned elementary school to
accommodate more people in need.
● Charitable Donation
Charity bazaars and group sales were held in fabs from time
to time and, in the belief that even a small donation will
make a difference, the accumulated profits were donated to
charities. In 2015, employees purchased goods from charities
as Mid-Autumn Festival gifts, and the revenue from group sales
for Thanksgiving were donated to Hui-Ming School for the
Blind.
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7.5 TSMC i-Charity
“TSMC i-Charity” is an interactive online platform launched in 2014 for employees to proactively take part in philanthropic activities
and give back to society. The intranet opens a channel for TSMC employees to propose caring projects, share results, suggest new
ideas and participate in philanthropic events directly and in a timely manner.
In 2015, 9,600 employees participated the following projects:
● Charity Bazaar of Stamps
● Re-layout of Kuang-Ron Elementary School’s Library
● Re-layout of Kuang-Ron Elementary School’s Library
● Caring Project of the Injured of Formosa Fun Coast Explosion
● Caring Project for 3 hearing impaired pre-school children
● Construction project for Shan-Hu branch of Po-Shan Elementary School
● Caring Project for the Special Education Center at Chu-Nan
With this interactive platform, TSMC hopes to maintain its commitment to society and encourage employees to join in efforts to
care for and give back to society in all ways.
7.6 Social Responsibility Implementation Status as Required by the Taiwan Financial Supervisory
Commission
Assessment Item
Implementation Status
Yes
No
Summary
V
V
1. Implementation of Corporate Governance
(1) Does the Company have a corporate social responsibility policy and
evaluate its implementation?
(2) Does the Company hold regular CSR training?
(3) Does the Company have a dedicated (or ad-hoc) CSR organization with
Board of Directors authorization for senior management, which reports to
the Board of Directors?
(4) Does the Company set a reasonable compensation policy, integrate
employee appraisal with CSR policy, and set clear and effective incentive
and disciplinary policies?
2. Environmentally Sustainable Development
(1) Is the Company committed to improving resource efficiency and to the
use of renewable materials with low environmental impact?
(2) Has the Company set an Environmental management system designed to
industry characteristics?
(3) Does the Company track the impact of climate change on operations,
carry out greenhouse gas inventories, and set energy conservation and
greenhouse gas reduction strategy
Non-implementation
and Its Reason(s)
None
(1) Please refer to “7. Corporate Social Responsibility” on pages 106-125 of this
Annual Report.
(2) Please refer to “3.5 Code of Ethics and Business Conduct” on pages 39-42
of this Annual Report
(3) Please refer to “7. Corporate Social Responsibility” on pages 106-125 of this
Annual Report.
(4) Social responsibility is regarded as an integral part of corporate governance
by TSMC. TSMC’s fair compensation policy is set with consideration of the
goals of the Company’s corporate governance and operation; corporate
social responsibility is included as part of its indices. For further details,
please refer to “5.5 Employees” on pages 75-79 of this Annual Report.
Please refer to “7.2.1 Environmental Protection” on pages 112-114 of this
Annual Report.
None
(Continued)
Non-implementation
and Its Reason(s)
None
Assessment Item
Implementation Status
Yes
No
Summary
3. Promotion of Social Welfare
V
(1) Does the Company set policies and procedures in compliance with
regulations and internationally recognized human rights principles?
(1) Please refer to “5.5 Employees” on pages 75-79 of this Annual Report.
(2) Has the Company established appropriately managed employee appeal
(2) Please refer to “5.5 Employees” on pages 75-79 of this Annual Report.
procedures?
(3) Does the Company provide employees with a safe and healthy working
(3) Please refer to “7.2.3 Safety and Health” on pages 117-120 of this Annual
environment, with regular safety and health training?
Report.
(4) Has the Company established a mechanism for regular communication
with employees and use reasonable measures to notify employees of
operational changes which may cause significant impact to employees?
(4) Please refer to “5.5 Employees” on pages 75-79 of this Annual Report.
(5) Has the Company established effective career development training
(5) Please refer to “5.5 Employees” on pages 75-79 of this Annual Report.
plans?
(6) Has the Company set polices and consumer appeal procedures in its R&D,
(6) Not applicable as TSMC is not an end product manufacturer.
purchasing, production, operations, and service processes?
(7) Does the Company follow regulations and international standards in the
(7) Not applicable as TSMC is not an end product manufacturer.
marketing and labelling of its products and services?
(8) Does the company evaluate environmental and social track records before
(8) Please refer to “Supplier and Contractor Management” on page 119-120 of
engaging with potential suppliers?
this Annual Report.
(9) Does the Company’s contracts with major suppliers include termination
clauses if they violate CSR policy and cause significant environmental and
social impact?
(9) Please refer to “Risks Associated with Purchase Concentration” in 6.3.3
Operational Risks of this Annual Report.
4. Enhanced Information Disclosure
V
Does the Company disclose relevant and reliable CSR information on its
website and the Taiwan Stock Exchange website?
TSMC has published a “Corporate Social Responsibility Report” since 2008,
and discloses this on the Company’s website (http://www.tsmc.com/english/
csr/index.htm).
None
5. If the company has established its corporate social responsibility code of practice according to “Listed Companies Corporate Social Responsibility Code of Practice,” please describe the operational status and
differences.
TSMC follows the Corporate Social Responsibility Policy set by the Chairman, Dr. Morris Chang. For our corporate social responsibility operational status, please refer to “7. Corporate Social Responsibility” on
pages 106-125 of this Annual Report and our corporate social responsibility related information in our website: http://www.tsmc.com/english/csr/index.htm
6. Other important information to facilitate better understanding of the company’s implementation of corporate social responsibility:
Please refer to TSMC’s website for its corporate social responsibility implementation status: http://www.tsmc.com/english/csr/index.htm
7. Other information regarding “Corporate Responsibility Report” which is verified by certifying bodies:
TSMC’s Corporate Social Responsibility Report is in accordance with the GRI G4 guidelines comprehensive option and verified by certifying bodies.
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8. Subsidiary Information and
Other Special Notes
8.1 Subsidiaries
8.1.1 TSMC Subsidiaries Chart
TSMC North America
Shareholding: 100%
TSMC Europe B.V.
Shareholding: 100%
TSMC Japan Limited
Shareholding: 100%
TSMC Korea Limited
Shareholding: 100%
TSMC China Company Limited
Shareholding: 100%
TSMC Partners, Ltd.
Shareholding: 100%
TSMC Global Ltd.
Shareholding: 100%
TSMC Technology, Inc.
Shareholding: 100%
As of 12/31/2015
TSMC Development, Inc.
Shareholding: 100%
WaferTech, LLC
Shareholding: 100%
InveStar Semiconductor Development
Fund, Inc.
Shareholding: 97.09%
InveStar Semiconductor Development
Fund, Inc. (II) LDC.
Shareholding: 97.09%
TSMC Design Technology Canada Inc.
Shareholding: 100%
VisEra Holding Company (Note 2)
Shareholding: 98.29%
VisEra Technologies Company Ltd.
(Note 2)
Shareholding: 86.94%
Taiwan
Semiconductor
Manufacturing
Company Limited
Emerging Alliance Fund, L.P.
Shareholding: 99.5%
VentureTech Alliance Holdings, LLC
Shareholding: 100%
VentureTech Alliance Fund II, L.P.
Shareholding: 98%
Mutual-Pak Technology Co., Ltd.
Shareholding: 58.33%
VentureTech Alliance Fund III, L.P.
Shareholding: 98%
Growth Fund Limited
Shareholding: 100%
TSMC Solar Europe GmbH (Note 1)
Shareholding: 100%
Chi Cherng Investment Co., Ltd. (Note 3)
Shareholding: 100%
Note 1: In August 2015, TSMC Solar Ltd. (“TSMC Solar”) ceased its manufacturing operations. TSMC Solar and TSMC Guang Neng Investment, Ltd. were incorporated
into TSMC on December 14, 2015. After the incorporation, TSMC Solar Europe GmbH, the 100% owned subsidiary of TSMC Solar, is held directly by TSMC. TSMC
Solar North America, the 100% owned subsidiary of TSMC Solar, completed the liquidation procedures in December 2015.
Note 2: TSMC acquired OmniVision Technologies, Inc.'s (“OVT's”) 49.1% ownership in VisEra Holding Company (“VisEra Holding”) and 100% ownership in Taiwan
OmniVision Investment Holding Co. (“OVT Taiwan”) on November 20, 2015. As a result, TSMC has obtained controls of VisEra Holding and OVT Taiwan; and has
consolidated VisEra Holding, its subsidiary VisEra Technologies Company Ltd., and OVT Taiwan since November 20, 2015.
Note 3: OVT Taiwan was renamed as Chi Cherng Investment Co., Ltd. in December 2015.
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8.1.2 Business Scope of TSMC and Its Subsidiaries
8.1.4 Shareholders in Common of TSMC and Its Subsidiaries with Deemed Control and Subordination: None.
8.1.5 Rosters of Directors, Supervisors, and Presidents of TSMC’s Subsidiaries
Unit: NT$(USD), except shareholding
Company (Note 1)
Title
Name
As of 12/31/2015
Shareholding
Shares (Investment Amount)
% (Investment
Holding %)
TSMC and its subsidiaries strive to provide the best foundry services in the industry. Subsidiaries in North America, Europe, Japan,
China, and South Korea are dedicated to serving TSMC customers worldwide. WaferTech in the United States and TSMC China
provide additional 8-inch wafer capacity. Other subsidiaries support the Company’s core foundry business with related services
such as design service and invest in start-up companies involved in design, manufacturing, and other related businesses in the
semiconductor industry.
8.1.3 TSMC Subsidiaries
Unit: NT(USD, EUR, JPY, KRW, RMB, CAD)$ thousands
As of 12/31/2015
Company (Note 1)
TSMC North America
TSMC Europe B.V.
TSMC Japan Limited
TSMC Korea Limited
Date of Incorporation
Place of Registration
Capital Stock
Business Activities
Jan. 18, 1988
San Jose, California, U.S.
US$ 11,000
Selling and marketing of integrated circuits and
semiconductor devices
Mar. 04, 1994
Amsterdam, The Netherlands
EUR 100
Marketing and engineering supporting activities
Sep. 10, 1997
May 02, 2006
Yokohama, Japan
JPY 300,000
Marketing activities
Seoul, Korea
KRW 400,000
Customer service and technical supporting activities
TSMC China Company Limited
Aug. 04, 2003
Shanghai, China
RMB 4,502,080
Manufacturing and selling of integrated circuits at the
order of and pursuant to product design specifications
provided by customers
TSMC Technology, Inc.
Feb. 20, 1996
Delaware, U.S.
US$ 0.001
Engineering support activities
TSMC North America
TSMC Europe B.V.
TSMC Japan Limited
TSMC Korea Limited
InveStar Semiconductor Development Fund, Inc.
Sep. 10, 1996
Cayman Islands
US$ 600
Investing in new start-up technology companies
TSMC China Company Limited
InveStar Semiconductor Development Fund, Inc.
(II) LDC.
Aug. 25, 2000
Cayman Islands
US$ 9,578
Investing in new start-up technology companies
TSMC Development, Inc.
WaferTech, LLC
Feb. 16, 1996
Jun. 03, 1996
Delaware, U.S.
Delaware, U.S.
US$ 0.001
Investment activities
US$ 0
TSMC Partners, Ltd.
Mar. 26, 1998
British Virgin Islands
US$ 988,268
TSMC Design Technology Canada Inc.
May 28, 2007
Ontario, Canada
CAD 2,434
Engineering support activities
TSMC Global Ltd.
Jul. 13, 2006
British Virgin Islands
US$ 5,284,000
Investment activities
Mutual-Pak Technology Co., Ltd.
Mar. 22, 2006
New Taipei City, Taiwan
NT$ 268,184
Manufacturing of electronic parts, wholesaling and retailing
of electronic materials, and researching, developing and
testing of RFID
Emerging Alliance Fund, L.P. (Note 2)
VentureTech Alliance Fund II, L.P.
Jan. 10, 2001
Feb. 27, 2004
Cayman Islands
Cayman Islands
US$ 24,255
Investing in new start-up technology companies
US$ 14,911
Investing in new start-up technology companies
Manufacturing, selling, testing and computer-aided
designing of integrated circuits and other semiconductor
devices
Investing in companies involved in the design, manufacture,
and other related business in the semiconductor industry
TSMC Technology, Inc.
InveStar Semiconductor Development
Fund, Inc.
InveStar Semiconductor Development
Fund, Inc. (II) LDC
TSMC Development, Inc.
VentureTech Alliance Fund III, L.P.
Mar. 25, 2006
Cayman Islands
US$ 102,382
Investing in new start-up technology companies
WaferTech, LLC
Growth Fund Limited
VentureTech Alliance Holdings, LLC
TSMC Solar Europe GmbH (Note 1)
May 30, 2007
Apr. 25, 2007
Dec. 17, 2010
Cayman Islands
Delaware, U.S.
US$ 1,462
Investing in new start-up technology companies
N/A
Investing in new start-up technology companies
Hamburg, Germany
EUR 400
Selling of solar modules and related products and providing
customer service
VisEra Holding Company (Note 3)
Mar. 31, 2005
Cayman Islands
US$ 87,500
Investment activities
VisEra Technologies Company Ltd. (Note 3)
Dec. 01, 2003
Hsinchu, Taiwan
NT$ 2,911,531
Engaged in manufacturing electronic spare parts and in
researching, developing, designing, manufacturing, selling,
packaging and testing of color filter
Chi Cherng Investment Co. Ltd. (Note 3)
Sep. 18, 2007
Taipei, Taiwan
NT$ 366,000
Investment activities
Note 1: TSMC Solar Ltd. (“TSMC Solar”) ceased manufacturing operations in August 2015. TSMC Solar and TSMC Guang Neng Investment, Ltd. were merged into TSMC on December 14, 2015. In the
third quarter of 2015, the Board of Directors of TSMC Solar also approved the dissolution of TSMC Solar North America, Inc. and TSMC Solar Europe GmbH. TSMC Solar North America completed
the dissolution in December 2015.
Note 2: Due to the expiration of the investment agreement between Emerging Alliance Fund, L.P. and TSMC, Emerging Alliance Fund, L.P. will complete its liquidation procedures in April 2016.
Note 3: Pursuant to TSMC Board’s approval on August 11, 2015, TSMC acquired OmniVision Technologies, Inc.’s 49.1% ownership in VisEra Holding Company (“VisEra Holding”) and 100% ownership in
Taiwan OmniVision Investment Holding Co. Inc. (“OVT Taiwan”) on November 20, 2015. As a result, TSMC has obtained controls of VisEra Holding and OVT Taiwan; and has consolidated VisEra
Holding, its subsidiary VisEra Technologies Company Ltd., and OVT Taiwan since November 20, 2015. After the acquisition, OVT Taiwan changed its name to Chi Cherng Investment Co., Ltd.
TSMC Partners, Ltd.
TSMC Design Technology Canada Inc.
Director
Director
President
Director
Director
President
Director
Director
Supervisor
President
Director
Director
Director
Chairman
Director
Director
Supervisor
President
Chairman
Director
President
Sylvia Fang
Rick Cassidy
Rick Cassidy
Wendell Huang
Maria Marced
Maria Marced
Chih-Chun Tsai
Makoto Onodera
Lora Ho
Makoto Onodera
Shing-Wha Lin
Chih-Chun Tsai
Wendell Huang
F.C. Tseng
M.C. Tzeng
L.C. Tu
Lora Ho
L.C. Tu
Lora Ho
Cliff Hou
Cliff Hou
Director
Wendell Huang
Director
Wendell Huang
Chairman
Director
President
Director
Director
President
Director
Director
President
Director
Director
Director
President
Lora Ho
Sylvia Fang
Lora Ho
M.C. Tzeng
Steve Tso
Tsung-Chia Kuo
Lora Ho
Sylvia Fang
Lora Ho
Cliff Hou
Cormac Michael O’Connell
Sylvia Fang
Cliff Hou
-
-
-
TSMC holds 11,000,000 shares
-
-
-
TSMC holds 200 shares
-
-
-
-
TSMC holds 6,000 shares
-
-
-
TSMC holds 80,000 shares
-
-
-
-
-
(TSMC’s investment US$596,000,000)
-
-
-
TSMC Partners, Ltd. holds 10 shares
-
TSMC Partners, Ltd. holds 582,523 shares
-
TSMC Partners, Ltd. holds 9,298,625 shares
-
-
-
TSMC Partners, Ltd. holds 10 shares
-
-
-
TSMC Development, Inc. holds 293,636,833 shares
-
-
-
TSMC holds 988,268,244 shares
-
-
-
-
TSMC Partners, Ltd. holds 2,300,000 shares
-
-
-
100%
-
-
-
100%
-
-
-
-
100%
-
-
-
100%
-
-
-
-
-
(100%)
-
-
-
100%
-
97.09%
-
97.09%
-
-
-
100%
-
-
-
100%
-
-
-
100%
-
-
-
-
100%
(Continued)
128
129
Company (Note 1)
Title
Name
Shareholding
Shares (Investment Amount)
% (Investment
Holding %)
TSMC Global Ltd.
Mutual-Pak Technology Co., Ltd.
Emerging Alliance Fund, L.P. (Note 2)
VentureTech Alliance Fund II, L.P.
VentureTech Alliance Fund III, L.P.
Growth Fund Limited
VentureTech Alliance Holdings, LLC
TSMC Solar Europe GmbH (Note 1)
VisEra Holding Company (Note 3)
VisEra Technologies Company Ltd. (Note 3)
Chi Cherng Investment Co. Ltd. (Note 3)
Director
Director
Chairman
Director
Director
Supervisor
President
None
None
None
None
None
Director
Director
Director
Director
Chairman
Director
Director
Supervisor
President
Chairman
Director
Director
Supervisor
Lora Ho
Sylvia Fang
Hsu-Tung Chen
Lewis Hwang
Representative of VentureTech Alliance Fund III,
L.P.: Juine-Kai Tseng
Wei-Pong Lin
Lewis Hwang
None
None
None
None
None
Lora Ho
C.H. Chen
Robert Kuan
J.K. Lin
Robert Kuan
J.K. Lin
George Liu
Wendell Huang
S.C. Hsin
Lora Ho
J.K. Lin
Sylvia Fang
Wendell Huang
-
-
TSMC holds 5,284 shares
1,107,010 shares
2,508,000 shares
15,643,347 shares
30,000 shares
2,508,000 shares
(TSMC’s investment US$24,134,090)
(TSMC’s investment US$14,613,019)
(TSMC’s investment US$100,334,790)
(VentureTech Alliance Fund III, L.P.’s investment
US$1,461,768)
None
-
-
TSMC holds 800 shares
-
-
TSMC Partners, Ltd holds 86,000,000 shares
54,600 shares
-
-
-
-
VisEra Holding Company holds 253,120,000 shares
-
-
-
-
TSMC holds 36,600,000 shares
-
-
100%
4.13%
9.35%
58.33%
0.11%
9.35%
(99.50%)
(98.00%)
(98.00%)
(100%)
(100%)
-
-
100%
-
-
98.29%
0.02%
-
-
-
-
86.94%
-
-
-
-
100%
Note 1: TSMC Solar Ltd. (“TSMC Solar”) ceased manufacturing operations in August 2015. TSMC Solar and TSMC Guang Neng Investment, Ltd. were merged into TSMC on December 14, 2015. In the
third quarter of 2015, the Board of Directors of TSMC Solar also approved the dissolution of TSMC Solar North America, Inc. and TSMC Solar Europe GmbH. TSMC Solar North America completed
the dissolution in December 2015.
Note 2: Due to the expiration of the investment agreement between Emerging Alliance Fund, L.P. and TSMC, Emerging Alliance Fund, L.P. will complete its liquidation procedures in April 2016.
Note 3: Pursuant to TSMC Board’s approval on August 11, 2015, TSMC acquired OmniVision Technologies, Inc.’s 49.1% ownership in VisEra Holding Company (“VisEra Holding”) and 100% ownership in
Taiwan OmniVision Investment Holding Co. Inc. (“OVT Taiwan”) on November 20, 2015. As a result, TSMC has obtained controls of VisEra Holding and OVT Taiwan; and has consolidated VisEra
Holding, its subsidiary VisEra Technologies Company Ltd., and OVT Taiwan since November 20, 2015. After the acquisition, OVT Taiwan changed its name to Chi Cherng Investment Co., Ltd.
8.1.6 Operational Highlights of TSMC Subsidiaries (Note)
Unit: NT$ thousands, except EPS ($)
Company
Capital Stock
Assets
Liabilities
Net Worth
Net Revenues
Income (Loss)
from Operation
Net Income
(Loss)
Basic Earning
(Loss) Per Share
As of 12/31/2015
TSMC North America
TSMC Europe B.V.
TSMC Japan Limited
TSMC Korea Limited
361,845
65,263,171
61,028,486
4,234,685
570,613,863
3,600
81,990
11,200
461,865
185,078
38,486
131,201
57,625
3,255
330,664
127,453
35,231
468,106
223,283
29,146
177,282
49,915
9,751
2,650
98,802
38,825
3,533
3,090
TSMC China Company Limited
22,806,637
43,416,047
3,002,565
40,413,482
21,866,636
7,537,049
8,709,986
8.98
194,123.78
588.81
38.62
NA
TSMC Technology, Inc.
InveStar Semiconductor Development Fund, Inc.
InveStar Semiconductor Development Fund,
Inc. (II) LDC.
0.03
19,737
315,055
927,196
46,610
372,716
382,184
545,012
1,794,436
42,373
17,939
4,237
354,777
-
4,324
85,449
(414)
3,334
49,392
4,939,187.05
(414)
3,334
(0.69)
0.35
TSMC Development, Inc.
0.03
21,251,231
-
21,251,231
1,351,663
1,350,453
1,312,315
131,231,529.67
WaferTech, LLC
TSMC Partners, Ltd.
TSMC Design Technology Canada Inc.
57,755
174,523
32,509,084
50,906,685
21,989
21,957
50,884,696
2,020,628
2,014,240
2,009,702
152,566
228,643
20,786
18,908
-
7,462,469
749,503
6,712,966
8,492,242
1,862,971
1,241,489
TSMC Global Ltd.
173,817,180
253,701,143
50,275,420
203,425,723
24,243,711
22,601,932
22,522,263
4,262,351.07
Mutual-Pak Technology Co., Ltd.
Emerging Alliance Fund, L.P.
VentureTech Alliance Fund II, L.P.
VentureTech Alliance Fund III, L.P.
Growth Fund Limited
VentureTech Alliance Holdings, LLC
TSMC Solar Europe GmbH
VisEra Holding Company
268,184
797,880
490,505
3,367,870
48,085
-
91,736
443,117
567,253
370,329
31,962
-
14,400
76,323
2,878,313
7,095,907
81,658
-
8,075
-
5,814
-
75,137
12,354
10,078
443,117
559,178
370,329
26,148
-
121,662
(14,516)
(15,855)
(0.59)
1,710
3,048
385,505
49,743
-
(2,549)
(5,380)
(93,739)
30,617
-
(2,575)
(5,358)
(93,739)
30,617
-
NA
NA
NA
NA
NA
1,186
512,045
(35,166)
(35,666)
(44,582.60)
7,083,553
-
1,201,790
1,115,859
VisEra Technologies Company Ltd.
2,911,531
6,922,801
751,334
6,171,467
3,172,665
Chi Cherng Investment Co., Ltd.
366,000
394,672
308
394,364
-
Note: Foreign exchange rates for balance sheet amounts are as follows:
$1 USD = $32.895 NT, $1 EUR = $36.00 NT, $1 JPY = $0.2733 NT, $1 RMB = $5.07 NT, $1 KRW = $0.0280 NT, $1 CAD = $23.73 NT
Foreign exchange rates for income statement amounts are as follows:
$1 USD = $31.720 NT, $1 EUR = $35.47 NT, $1 JPY = $0.2632 NT, $1 RMB = $5.05 NT, $1 KRW = $0.0282 NT, $1 CAD = $24.97 NT
323,083
(88,668)
312,427
(93,651)
4.23
2.03
8.22
12.75
1.07
(2.56)
8.2 Status of TSMC Common Shares and ADRs Acquired, Disposed of, and Held by Subsidiaries: None.
8.3 Special Notes
8.3.1 Private Placement Securities in 2015 and as of the Date of this Annual Report: None.
8.3.2 Regulatory Authorities’ Legal Penalties to the Company or Its Employees, and the Company’s Resulting
Punishment on Its Employees for Violations of Internal Control System Provisions, Principal Deficiencies, and the
State of Any Efforts to Make Improvements in 2014 and as of the Date of this Annual Report
In 2015, the Company complied with the Taiwan Company Law, Securities Trading Act and relevant environmental laws and
regulations. TSMC will file an administrative lawsuit with the High Administrative Court to dispute a minor NT$40,000 fine issued by
the labor authority for the alleged underpayment of employees’ overtime because of an inconsistency between the claimed overtime
and actual hours worked by the employee in question. TSMC believes there is no basis for the fine.
8.3.3 Any Events in 2015 and as of the Date of this Annual Report that Had Significant Impacts on Shareholders’ Right
or Security Prices as Stated in Item 3 Paragraph 2 of Article 36 of Securities and Exchange Law of Taiwan: None.
8.3.4 Other Necessary Supplement: None.
130
131
Contact Information
Corporate Headquarters & Fab 12A
8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu 30078, Taiwan, R.O.C.
Tel: +886-3-5636688 Fax: +886-3-5637000
R&D Center & Fab 12B
168, Park Ave. II, Hsinchu Science Park, Hsinchu 30075, Taiwan, R.O.C.
Tel: +886-3-5636688 FAX: +886-3-6687827
Fab 2, Fab 5
121, Park Ave. 3, Hsinchu Science Park, Hsinchu 30077, Taiwan, R.O.C.
Tel: +886-3-5636688 Fax: +886-3-5781546
Fab 3
9, Creation Rd. 1, Hsinchu Science Park, Hsinchu 30077, Taiwan, R.O.C.
Tel: +886-3-5636688 Fax: +886-3-5781548
Fab 6
1, Nan-Ke North Rd., Tainan Science Park, Tainan 74144, Taiwan, R.O.C.
Tel: +886-6-5056688 Fax: +886-6-5052057
Fab 8
25, Li-Hsin Rd., Hsinchu Science Park, Hsinchu 30078, Taiwan, R.O.C.
Tel: +886-3-5636688 Fax: +886-3-5662051
Fab 14A
1-1, Nan-Ke North Rd., Tainan Science Park, Tainan 74144, Taiwan
R.O.C.
Tel: +886-6-5056688 Fax: +886-6-5051262
Fab 14B
17, Nan-Ke 9th Rd., Tainan Science Park, Tainan 74144, Taiwan, R.O.C.
Tel: +886-6-5056688 Fax: +886-6-5055217
Fab 15
1, Keya Rd.6, Cental Taiwan Science Park, Taichung 42882, Taiwan, R.O.C.
Tel: +886-4-27026688 Fax: +886-4-25607548
TSMC North America
2851 Junction Avenue, San Jose, CA 95134, U.S.A.
Tel: +1-408-3828000 Fax: +1-408-3828008
TSMC Europe B.V.
World Trade Center, Zuidplein 60, 1077 XV Amsterdam
The Netherlands
Tel: +31-20-3059900 Fax: +31-20-3059911
TSMC Japan Limited
21F, Queen’s Tower C, 2-3-5, Minatomirai, Nishi-ku, Yokohama
Kanagawa, 2206221, Japan
Tel: +81-45-6820670 Fax: +81-45-6820673
TSMC China Company Limited
4000, Wen Xiang Road, Songjiang, Shanghai, China
Postcode: 201616
Tel: +86-21-57768000 Fax: +86-21-57762525
Copyright © 2015 by Taiwan Semiconductor Manufacturing Company, Ltd. All rights reserved.
TSMC Korea Limited
15F, AnnJay Tower, 208, Teheran-ro, Gangnam-gu
Seoul 06220, Korea
Tel: +82-2-20511688 Fax: +82-2-20511669
TSMC Liaison Office in India
1st Floor, Pine Valley, Embassy Golf-Links Business Park
Bangalore-560071, India
Tel: +1-408-3827960
Fax: +1-408-3828008
TSMC Design Technology Canada Inc.
535 Legget Dr., Suite 600, Kanata, ON K2K 3B8, Canada
Tel: +613-576-1990
Fax: +613-576-1999
TSMC Spokesperson
Name: Lora Ho
Title: Senior Vice President & CFO
Tel: +886-3-5054602 Fax: +886-3-5637000
Email: cyhsu@tsmc.com
TSMC Deputy Spokesperson/Corporate Communications
Name: Elizabeth Sun
Title: Senior Director, TSMC Corporate Communication Division
Tel: +886-3-5682085 Fax: +886-3-5637000
Email: elizabeth_sun@tsmc.com
Auditors
Company: Deloitte & Touche
Auditors: Yi-Hsin Kao, Hung-Wen Huang
Address: 12F, 156, Sec. 3, Min-Sheng E. Rd., Taipei 10596, Taiwan, R.O.C.
Tel: +886-2-25459988 Fax: +886-2-25459966
Website: http://www.deloitte.com.tw
Common Share Transfer Agent and Registrar
Company: The Transfer Agency Department of Chinatrust
Commercial Bank
Address: 5F, 83, Sec. 1, Chung-Ching S. Rd., Taipei 10008, Taiwan
R.O.C.
Tel: +886-2-66365566 Fax: +886-2-23116723
Website: http://www.ctbcbank.com
ADR Depositary Bank
Company: Citibank, N.A.
Depositary Receipts Services
Address: 388 Greenwich Street, New York, NY 10013, U.S.A.
Website: http://www.citi.com/dr
Tel: +1-877-2484237 (toll free)
Tel: +1-781-5754555 (out of US)
Fax: +1-201-3243284
E-mail: citibank@shareholders-online.com
TSMC’s depositary receipts of the common shares are listed on New
York Stock Exchange (NYSE) under the symbol TSM. The information
relating to TSM is available at http://www.nyse.com and http://mops.
twse.com.tw